Freescale hits GaAs on RF basestation ICs Product News 6/30/2010 1 comment Freescale is moving into gallium arsenide for monolithic microwave basestation ICs that harness ultralow-noise amps for trunk network amplifier radio cards and as predrivers for its high-voltage lateral diffusion MOS power amps.
Rohde & Schwarz find scope for expansion News & Analysis 6/29/2010 Post a comment Rohde & Schwarz is today launching its first dedicated oscilloscopes. It has developed its own ASICs and A to D converters to support the new design which is described as 20 times faster than existing devices.
Samsung, TSMC hit by ITC complaint News & Analysis 6/28/2010 3 comments STC.UNM (STC)--the technology-transfer arm of the University of New Mexico (UNM)--said that it is charging Taiwan Semiconductor Manufacturing Co. Ltd. (TSMC) and Samsung Electronics Co. Ltd. with alleged patent infringement.
CoorsTek buys ceramics unit for $245M News & Analysis 6/28/2010 Post a comment CoorsTek Inc., a manufacturer of ceramic and specialty material components, has signed a definitive agreement to purchase the advanced ceramics business of Saint-Gobain for about $245 million.
Obducat CEO resigns amid losses News & Analysis 6/28/2010 1 comment Amid losses and order delays, Patrik Lundstrom has been named acting CEO of Obducat AB (Malmo, Sweden), a supplier of nano-imprint lithography tools.
Report: Firms buy stake in PSi News & Analysis 6/28/2010 Post a comment Integrated Micro-Electronics Inc. (IMI)and Narra Venture Capital II have acquired a 67 percent stake in PSi Technologies Inc. (PSi) of the Philippines for $30 million.
Aeroflex rolls single-box multi-RAT tester Product News 6/24/2010 Post a comment Aeroflex's 7100 tester now supports multiple Radio Access Technologies (RAT) including CDMA EV-DO and eHRPD as well as LTE to accelerate multi-mode cellular terminal device development for new LTE deployments.
Trio forms 3-D chip alliance News & Analysis 6/21/2010 2 comments Elpida Memory Inc., Powertech Technology Inc. and United Microelectronics Corp. (UMC) have formed an alliance to speed up the development of three-dimensional (3-D) chips.
Anritsu enhances one-box tester Product News 6/17/2010 Post a comment The MT8820C from Anritsu now simulates an LTE enhanced node B to accurately and cost-efficiently measure LTE device parametrics during development and manufacturing.
Qualcomm hit by Icera allegation News & Analysis 6/17/2010 Post a comment Mobile communications technology company Qualcomm Inc. could come under an investigation by the European Commission after allegations that it has used incentives to try and dissuade customers from dealing with U.K. company Icera Inc.
Group aims to set standards for multicore tools News & Analysis 6/17/2010 Post a comment The Multicore Association has formed a new work group to tackle the problem of incompatible software development tools for multicore processors and expects to have a draft standard for one or more common data format and a Linux-based reference implementation of its work within a year.
FormFactor to cut 8% of workforce News & Analysis 6/16/2010 Post a comment Wafer probe card maker FormFactor said Wednesday it will lay off about 8 percent of its workforce as part of an effort to reduce operating expenses. It marks the fifth time in a little more than two years that FormFactor has conducted a significant layoff.
MoCA group revs home net spec to Gbit rate News & Analysis 6/15/2010 Post a comment The Multimedia over Coax Alliance ratified its version 2.0 specification for home networking over coax cables that when fully revved up will exceed a Gbit/second, using a combination of new channel-bonding and point-to-point features.
NSF funds computer virus immunization effort News & Analysis 6/10/2010 1 comment Giving applications unique executables could immunize them against viruses and other malware which preys on a software application's uniformity, according to Florida State University researchers.
Viewpoint: Divining Ethernet's future News & Analysis 6/9/2010 1 comment The next major milestone in the history of Ethernet is anticipated for June 17, when the expected ratification of the 40Gb/s and 100 Gb/s Ethernet standard is set to occur.
Software drives mesh nets for smart meters News & Analysis 6/7/2010 Post a comment Arch Rock is releasing software based on Internet Protocol standards for a new generation of radio chips from companies such as Analog Devices and Texas Instruments aimed at supporting wireless mesh neighborhood networks to link smart meters to utility networks.
Join the Conversation: Do we need another Linux group? News & Analysis 6/3/2010 10 comments Do we need another mobile Linux consortium? That's the question posed by the launch of Linaro, created by ARM, Freescale, IBM, Samsung, ST-Ericsson and Texas Instruments to develop Linux software for ARM-based SoCs. We'd like to hear what you think.
New specs rev Infiniband to 100 Gbits/s News & Analysis 6/2/2010 Post a comment The trade group behind the Infiniband interconnect is adding new 50 and 100 Gbit/second milestones to its road map, claiming its members will deliver products for them by early 2012 as the technology revs up to compete with the next wave of Ethernet.
What are the engineering and design challenges in creating successful IoT devices? These devices are usually small, resource-constrained electronics designed to sense, collect, send, and/or interpret data. Some of the devices need to be smart enough to act upon data in real time, 24/7. Are the design challenges the same as with embedded systems, but with a little developer- and IT-skills added in? What do engineers need to know? Rick Merritt talks with two experts about the tools and best options for designing IoT devices in 2016. Specifically the guests will discuss sensors, security, and lessons from IoT deployments.