AMD, HP propose extensions for PCI Express 3.0 News & Analysis 7/31/2009 Post a comment Researchers from Advanced Micro Devices and Hewlett-Packard have written two extensions to the PCI Express 3.0 specification which aims to enable lower cost chips that could support multiple protocols and reduce processor overhead.
Silicon Valley, Wall Street meet at interconnect event News & Analysis 7/30/2009 Post a comment The Hot Interconnects conference will move from its longstanding home on the Stanford campus to Lower Manhattan next month as organizers try to bring together Silicon Valley technologists and bleeding edge systems users on Wall Street, in part to debate the competition between 10 Gbit Ethernet and Infiniband.
Kappos sketches out plans for patent office News & Analysis 7/30/2009 1 comment David J. Kappos, nominated by President Barack Obama to head the U.S. Patent and Trademark Office, pledged to "refashion the patent examination process" and improve funding for the patent office in his confirmation hearing before the Senate Judiciary Committee Wednesday.
Micronova shrinks HiL simulator to desktop size Product News 7/30/2009 Post a comment With the NovaSim Micro, test devices vendor Micronova (Vierkirchen, Germany) has shrunk Hardware-in-the-loop (HiL) simulators to desktop size. Despite its small size, the simulator runs function tests on complex ECUs, the vendor promises.
Panel: Future job prospects bright for EDA pros News & Analysis 7/29/2009 Post a comment Amid concerns that EDA may be permanently shrinking, technical professionals with EDA experience nevertheless have good future job prospects, according to members of a career-oriented panel discussion at the Design Automation Conference.
EDA chiefs debate getting bigger slice of the pie News & Analysis 7/28/2009 Post a comment The age-old question of whether EDA gets its fair share of semiconductor ecosystem revenue reared its head at a panel discussion involving the CEOs of EDA's three largest companies at the Design Automation Conference, with at least one suggesting that the current recession may be the catalyst for a favorable change.
Agilent to pay $1.5B for Varian News & Analysis 7/27/2009 1 comment Agilent Technologies Inc. has agreed to pay $1.5 billion for Varian Inc. as it continues to seek growth opportunities outside of its dominant position in the electronic test and measurement equipment market.
Patents key to Nortel wireless auction News & Analysis 7/24/2009 Post a comment A portfolio of patents is one of the most sought-after assets in an auction today of a wireless business unit of Nortel Networks, the veteran Canadian telecom systems provider forced into bankruptcy earlier this year.
Continental integrates yaw rate and acceleration sensors in one unit Product News 7/23/2009 1 comment Automotive tier one Continental AG has combined yaw rate and acceleration sensors in one component. The device aims at ESC and other safety-related systems, offering compact design at lower cost. Unlike comparable sensors, it is not based on MEMS technology but implemented as capacitive sensors.
Cisco, Intel help power up smart grids News & Analysis 7/21/2009 1 comment A broad group of companies including giants Cisco Systems and Intel Corp. are rolling up their sleeves to help set standards and compete for Department of Energy grants to build smart electric grids.
Report attacks post-grant patent review News & Analysis 7/20/2009 Post a comment A new post-grant review process proposed in a patent reform bill before Congress would add to the delays and costs getting patents, according to an analysis by a professor at Case Western Reserve.
Venture capital rebounds in second quarter Product News 7/18/2009 Post a comment Venture capital investments leapt 32 percent in the second quarter to hit $5.27 billion, up from $4 billion in the first three months of the year, the lowest level in a decade, according to Dow Jones VentureSource.
Report: LCDs rule in growing digital-sign market Product News 7/16/2009 Post a comment The market for public signs using flat-panel displays will grow 24 percent over the next few years, expanding from about 1.5 million units in 2009 to about 7.5 million in 2015 with LCDs dominating the market and plasma taking a small share, according to market watcher DisplaySearch.
Intel keynoter offers pep talk, vision of better days News & Analysis 7/16/2009 Post a comment Anand Chandrasekher, senior vice president and general manager of Intel's Ultra Mobility Group, did his best to offer hope to beleaguered semiconductor equipment executives in a Semicon West keynote address, predicting that the convergence of communications and computing would mean big money for the industry in years to come.
PCI Express will scale to 8 GHz by next June News & Analysis 7/15/2009 1 comment The final specification for PCI Express 3.0 will be released by next June, the PCI Special Interest Group announced at its annual conference, providing more detail about the 8 GHz interconnect and challenges implementing it.
CEA may set wireless charging standard News & Analysis 7/14/2009 1 comment The Consumer Electronics Association is investigating whether it should create a wireless charging standard for devices such as cellphones at a time when many competing technologies are emerging including one used in the Palm Pre Touchstone that has analysts scratching their heads.
Report sees WiMax slowdown, LTE concerns Product News 7/13/2009 Post a comment WiMax networks are facing a slowdown in revenue and subscriber growth this year, and many carriers still harbor concerns about whether the rival fourth generation wireless technology, Long Term Evolution, is ready for deployment, according to a new report from Maravedis Research.
Agilent broadens USB test portfolio Product News 7/8/2009 Post a comment Agilent's portfolio now includes an integrated USB 3.0 protocol analysis solution, which results from a collaboration with Ellisys, and the recently introduced Infiniium 9000 Series mixed signal oscilloscope, which includes fast, integrated 2GSa/s digital channels and an in-scope protocol viewer for USB.
China boosts renewable energy targets Product News 7/6/2009 1 comment China is ratcheting up the target of how much of its energy it obtains from renewable resources such as solar and wind to 15 percent by 2020, according to a report in today's China Daily.
Startup touts major advance in wireless sensor's temp sensitivity News & Analysis 7/6/2009 Post a comment A start-up based in Cambridge, England, focusing on healthcare technologies, has started user trials of a wireless temperature sensor that can measure body temperature to within a thousandth of a degree. Cambridge Temperature Concepts (CTC) has already used the sensor to create a device to assist women in getting pregnant.
European researchers warned on FP7 funding rules News & Analysis 7/3/2009 Post a comment Singleimage, a company that helps European researchers and research administrators win bids for and execute European research programs , has warned that recent EU rules that impose accurate time recording procedures on maverick staff has created a major headache for finance managers supporting collaborative research projects.
What are the engineering and design challenges in creating successful IoT devices? These devices are usually small, resource-constrained electronics designed to sense, collect, send, and/or interpret data. Some of the devices need to be smart enough to act upon data in real time, 24/7. Are the design challenges the same as with embedded systems, but with a little developer- and IT-skills added in? What do engineers need to know? Rick Merritt talks with two experts about the tools and best options for designing IoT devices in 2016. Specifically the guests will discuss sensors, security, and lessons from IoT deployments.