Japan to Form Power Device Initiative News & Analysis 7/31/2013 11 comments Unlike the CE market, there are no established testing procedures for power devices used in vehicles or other high-voltage, high-current infrastructure equipment. It could result in life and death issues, warned an Advantest executive.
Test USB 3.0 Compliance News & Analysis 7/18/2013 9 comments Also known as SuperSpeed USB, USB 3.0 from the USB-IF (USB Implementer’s Forum) brings a 5 Gb/s signaling rate to USB, which is a 10X increase in performance from Hi-Speed USB. But how do you test it?
SRC, Intel Shrink Environmental Footprint of Chip Building News & Analysis 7/16/2013 6 comments Intel and Semiconductor Research Corp. have developed a semiconductor gas distribution system purging algorithm that cuts ultra-high purity gas usage 20-percent and the time required to purge by 30 percent, thus cutting costs while improving throughput.
For Durability Testing, Ford Turns to Robots News & Analysis 7/1/2013 12 comments Automotive companies are known as pioneers in robotic technologies. They’ve honed their robotic skills to improve their production lines. Now robots are going to work as test drivers, says Ford.
Troubleshooting at the Network Edge News & Analysis 7/1/2013 1 comment The rise of bring-your-own-devices (BYOD) and the ubiquitous nature of WiFi has led to an entirely new set of problems and challenges at the network edge.