PXI based digital functional test targets next generation circuits News & Analysis 8/31/2007 Post a comment Rohde & Schwarz has equipped the CompactTSVP production test platform withy a high-speed digital test module, the TS-PHDT with a maximum data rate of 40 MHz and a storage capacity of 1.5 Gbyte. The test module was developed in close conjunction with he RF and Automotive Business Unit of Atmel.
Non-volatile memory is the secret star at JEDEC meeting News & Analysis 8/29/2007 Post a comment During its recent meeting series in Munich, Germany, JEDEC standards organization discussed enhancements to a series of memory-related standards. In addition, the organizations picked up the thrust in the industry towards flash-based disk drives by launching a new Solid State Disk Committee.
Foreign filers stir patent pot News & Analysis 8/27/2007 Post a comment U.S. foreign national intellectual property contributions are increasing. Their international patent application filings rose from 7.6 percent in 1998 to 25.6 percent in 2006.
Leverage nature's forces, medical engineers told News & Analysis 8/23/2007 Post a comment Keynoters laid out two paths to innovation for engineers working in the medical sector at the annual IEEE Engineering in Medicine and Biology Society conference, exhorting them to mimic nature and drive the transition of health care to the Web.
Compromise blends Ethernet, Fibre Channel News & Analysis 8/20/2007 Post a comment Rivals Brocade Communications and Cisco Systems agreed on a frame format for running Fibre Channel over Ethernet, clearing a major hurdle in the effort to develop a standard for the converged network and opening the door for work to begin on chips that implement the standard.
AMD will extend x86 for parallelism News & Analysis 8/14/2007 Post a comment Advanced Micro Devices published the first of several plans to extend the x86 instruction set to ease the job of programming multicore processors, applying once again its formula of competing with Intel Corp. on technology by advancing the CPU architecture ahead of its larger archrival.
Debate surfaces over Express 3.0 plan News & Analysis 8/10/2007 Post a comment A debate was surfaced around some of the technical decisions including the targeting of 8 GigaTransfers/second maximum throughput and use of linear Decision Feedback Equalization in the draft specification for PCI Express 3.0 within hours of when first details of the draft spec were announced.
Vectron advances frequency converter line Product News 8/9/2007 Post a comment Vectron International has expanded its C3430 frequency controlled crystal oscillator (FCXO) family for use in wireline infrastructure, test and measurement, military applications and wireless infrastructure such as GSM, CDMA and W-CDMA base stations and point-to-point radio.
Emulex, Qlogic tip 8G Fibre Channel products News & Analysis 8/9/2007 Post a comment Both Emulex Corp. and QLogic Corp. announced prototype chips and cards supporting the 8Gbit/second version of Fibre Channel expected to roll out in storage networks starting next year, doubling throughput of today's 4 Gbit/s nets.
Updated: Next-gen PCI Express aims at 8 Gbits/s News & Analysis 8/8/2007 Post a comment The PCI Special Interest Group has set 8 GigaTransfers/second as the bit rate for the next generation of the PCI Express interconnect, following a lively debate that has stretched over several months as to whether 8 or 10 GT/s was the right step for the 3.0 version of the interconnect introduced in 2003 and now broadly used in PCs.
WEEE challenges ahead as producers go to court News & Analysis 8/7/2007 Post a comment WEEE legal action has been quiet since the incident in 2005 involving the Irish authorities fining retailer Boots Pharmacy for not displaying recycling costs added to the product price. But producers have been challenging authorities in the courts in at least two member states, Germany and the Netherlands.
VC groups join forces across the Atlantic News & Analysis 8/6/2007 Post a comment European venture capital group Esprit Capital Partners is selling a "strategic stake" in the firm to Silicon Valley based Draper Fisher Jurvetson and Esprit (Cambridge, England) will become DFJ's exclusive partner in Europe.
What are the engineering and design challenges in creating successful IoT devices? These devices are usually small, resource-constrained electronics designed to sense, collect, send, and/or interpret data. Some of the devices need to be smart enough to act upon data in real time, 24/7. Are the design challenges the same as with embedded systems, but with a little developer- and IT-skills added in? What do engineers need to know? Rick Merritt talks with two experts about the tools and best options for designing IoT devices in 2016. Specifically the guests will discuss sensors, security, and lessons from IoT deployments.