KLA-Tencor COO Kispert stepping down News & Analysis 8/29/2008 Post a comment John Kispert, president and chief operating officer of chip gear vendor KLA-Tencor, will step down at the end of the year. The company also announced the appointment of a new chief financial officer.
ASA releases Version 6.01 for M1 scope tools Product News 8/27/2008 Post a comment ASA Corp. has released Version 6.01 of its M1 oscilloscope tools software family with a PLL toolkit, designed to provide new views and measurements critical to understanding the behavior of PLLs in a system.
STATS ChipPac to provide services for Infineon News & Analysis 8/27/2008 Post a comment Singapore-based test and packaging vendor STATS ChipPac has entered into an agreement with Infineon Technologies AG to provide manufacturing services for products based on Infineon's first-generation embedded wafer-level ball grid array technology.
Prosecutors reportedly search UMC offices News & Analysis 8/27/2008 Post a comment Taiwan prosecutors have visited the headquarters of foundry United Microelectronics in Hsinchu, Taiwan, as well as the company's office in Taipei as part of probe into the company's investments, according to a Reuters report.
Judge urges ban on importation of SiRF GPS chips News & Analysis 8/25/2008 Post a comment A U.S. International Trade Commission administrative law judge has recommended that the ITC bar the importation into the U.S. of chips from SiRF Technology Holdings that infringe on patents held by a Broadcom subsidiary.
KT spins off crash test company Product News 8/25/2008 Post a comment Aerospace and automotive engineering company Kayser Threde GmbH (Munich, Germany) has spun off its automotive business. Specialized on sensor and dummy technology for automotive crash tests, the new company hopes to tie up to its present global market share of about 70 percent.
Group peers into 3-D future for Blu-Ray Product News 8/21/2008 Post a comment The Blu-Ray Disc Association is working on its strategy for supporting stereoscopic 3-D under growing pressure from Hollywood studios who want to create a home video market for their rising number of stereo 3-D titles.
Barrett chides U.S. for R&D shortfall News & Analysis 8/19/2008 3 comments The U.S. government needs boost spending on research and development and education, according to Intel Chairman Craig Barrett, announcing a set of challenge awards for ideas using technology to advance education, health care, the environment and economic development around the world.
Big turnout planned for 3DTV meeting News & Analysis 8/18/2008 Post a comment More than 160 people representing more than 80 companies are signed up to kick off one of the first big industry efforts for bringing stereoscopic 3D to television, seen by many as the next big thing in consumer electronics.
Serial ATA doubles data rate to 6 Gbits/s News & Analysis 8/18/2008 Post a comment The serial ATA interface is doubling its maximum data rate to support transfers up to 6 Gbits/second, and the group marshalling the spec has also started a logo program to help ensure interoperability among the expanding group of hard, optical and solid-state drives using the link.
Hella, Gutman launch diagnostics JV News & Analysis 8/18/2008 Post a comment Automotive tier one Hella KGaA Hueck & Co (Lippstadt) and Gutmann Messtechnik GmbH (Ihringen) have launched a joint venture which aims at the market for vehicle diagnostic systems.
Intel releases controller spec for USB 3.0 News & Analysis 8/14/2008 1 comment Intel Corp. has released a draft version 0.9 of its Extensible Host Controller Interface for USB 3.0 also called SuperSpeed USB that aims to deliver data rates up to 300 Mbytes/second at the application level.
Sematech demos progress on EUV at 22 nm News & Analysis 8/12/2008 Post a comment Sematech has demonstrated a way of using extreme ultraviolet lithography to define silicon devices with a half-pitch resolution as small as 22 nm and is close to being able to define features smaller than 20 nm, work the chip research consortium says shows the promise of EUV to serve a future 22 nm semiconductor node.
NetXen takes flexible approach to 10G Ethernet News & Analysis 8/12/2008 Post a comment NetXen Inc. will support three physical interfaces in the third-generation 10Gbit Ethernet controller it is rolling out, underlying the fragmented nature of cable support that has slowed the roll out of 10G technology.
Report: India's outsourced R&D business growing at 23% News & Analysis 8/11/2008 Post a comment India is the top choice for companies looking to outsource R&D with an offshoring business there expected to grow 23 percent to $21 billion by 2012 and a talent pool in its largest hub—Bangalore--second only to Silicon Valley, according to a study by a management consulting firm.
India allots 3G, WiMax spectrum News & Analysis 8/7/2008 Post a comment India's Ministry for Communications and Information Technology has approved the release of 3G and WiMax spectrum to two state-owned telecommunications service providers.
L.A. lab forms 3DTV group News & Analysis 8/7/2008 1 comment A major university lab has quietly kicked off an industry working group to study the future for stereoscopic 3D on next-generation televisions, at least the fourth group to convene this year to study the opportunities and challenges around 3DTV.
Anritsu enhances economy microwave spectrum analyzers Product News 8/7/2008 Post a comment Anritsu Company has introduced new options for its MS271xB series that take advantage of the economy microwave spectrum analyzers' phase noise of -110 dBc/Hz at 10 kHz offset (typical, 800 MHz) and make it easier to integrate the instruments into legacy manufacturing environments.
Manufacturing pull still strong in CEE News & Analysis 8/7/2008 Post a comment Western firms still see Central and Eastern Europe as a choice site for factories despite rising domestic currencies and a slowdown in key export markets, according to a report from Reuters.
Battle-hardened veterans of the electronics industry have heard of the “connected car” so often that they assume it’s a done deal. But do we really know what it takes to get a car connected and what its future entails? Join EE Times editor Junko Yoshida as she moderates a panel of movers and shakers in the connected car business. Executives from Cisco, Siemens and NXP will share ideas, plans and hopes for connected cars and their future. After the first 30 minutes of the radio show, our listeners will have the opportunity to ask questions via live online chat.