EC report discusses increased support for electronics News & Analysis 9/30/2009 Post a comment The European Commission has identified nanotechnology, electronics and photonics as key enabling technologies (KETs) that are of strategic interest to the European Union. Advanced materials and biotechnology are also listed in a report that goes on to discuss ways in which greater support should be offered to these disciplines.
Canon shuffles responsibility for semi equipment News & Analysis 9/29/2009 Post a comment Canon and its independent marketing arm, Canon Marketing Japan, announced they have reached a basic agreement to transfer Canon Marketing Japan's semiconductor equipment-related business to Canon, effective Jan. 1, 2010.
Analysis: What's behind Taiwan's decision to ease investment rules? News & Analysis 9/29/2009 Post a comment Comments reported by local media from Taiwan's economic minister Shih Yen-shiang on the easing investment restrictions with regard to mainland China were enough to send the share prices of Taiwan Semiconductor Manufacturing Co. and United Microelectronics Corp. shooting upwards, but the devil could yet be in the detail.
Fast interfaces overlap at IDF News & Analysis 9/24/2009 1 comment The buzz in fast interconnects at Intel Developer Forum was supposed to be around SuperSpeed USB, the 3.0 version of the omnipresent interface coming to systems in 2010, but somewhere on the road to San Francisco's Moscone Center, Intel decided to roll out Light Peak, the next next big thing in fast interconnects.
Standards bodies seek common ground for powerline nets News & Analysis 9/24/2009 Post a comment A senior director of DS2, the Valencia, Spain based specialist in silicon for broadband power line gear, has warned of confusion and frustration in the industry and amongst consumers if forthcoming votes on a standard for the technology fail to resolve the problem of a fragmented powerline networking industry.
Update: Intel debuts optical link for PCs News & Analysis 9/23/2009 2 comments Intel Corp. wants to consolidate all the wired connections on your PC to a single 10 Gbit/second optical cable it calls Light Peak that it plans to support in silicon sometime next year working with Sony Corp.'s Viao group and other unnamed partners.
Otellini denies antitrust charges in EC's Intel report News & Analysis 9/23/2009 Post a comment Chief executive Paul Otellini denied Intel Corp. engaged in anticompetitive practices outlined in a 518-page report released Monday by the European Commission, and said in a Q&A session after his keynote at the first day of the Intel Developer Forum that Intel will present its evidence in an appeal of the EC's May decision to slap a $1.45 billion fine on the chip maker.
Europe releases report on Intel antitrust investigation News & Analysis 9/21/2009 1 comment A day before the opening of the Intel Developer Forum in San Francisco, the European Commission has released a 518-page report detailing its allegations of antitrust violations against Intel Corp. for which it levied a $1.45 billion fine in May.
Long, bumpy transition seen for USB 3.0 News & Analysis 9/21/2009 1 comment The Intel Developer Forum is expected to generate buzz around SuperSpeed USB this week, but the transition to the 5 GHz interface may be slower and bumpier than many would hope due to cost, power and support issues.
St. Dennis out as Applied shuffles GMs News & Analysis 9/18/2009 Post a comment Chip and solar manufacturing equipment vendor Applied Materials announced significant leadership changes, including the departure of veteran semiconductor equipment executive Tom St. Dennis.
Rambus demos threaded modules at IDF News & Analysis 9/17/2009 Post a comment Rambus Inc. has partnered with Kingston Technology to create a prototype DDR3 memory module that increases performance and lowers power for main memory access, and they will demonstrate the prototype targeted at use with multicore processors at next week's Intel Developer Forum.
Companies partner for space qualified modules Product News 9/17/2009 Post a comment C-MAC MicroTechnology (Great Yarmouth, England) and Linear Technology (Milpitas, Calif.) have joined forces for a deal that will allow manufacturers outside of the U.S. to purchase space grade and rad-hard monolithic and multichip modules from a European manufacturer without the bureaucratic restrictions they have to face.
Patent office again finds in favor of MMP portfolio News & Analysis 9/16/2009 Post a comment The US Patent Office has again affirmed the validity of US’336, the most widely recognized patent in the Moore Microprocessor Patent (MMP) portfolio jointly owned by Patriot Scientific Corporation and the TPL Group (Cupertino, Calif.)
Data acquisition software with enhanced functionality Product News 9/16/2009 Post a comment Automotive industry measurement equipment vendor Ipetronik (Baden-Baden, Germany), has announces the availability of version V.01.02.00 of its IPEmotion measurement-data acquisition software for download. The version features several highlights and improvements.
Rambus ups guidance for third quarter News & Analysis 9/16/2009 Post a comment Memory technology licensor Rambus Inc. (Los Altos, Calif.) has revised upwards a revenues guidance issued in June and now expects sales for the third quarter to be between $27 million and $28 million rather than between $22 million to $25 million.
Ethernet caught in demand/cost squeeze News & Analysis 9/16/2009 1 comment In one of the central ironies of the Internet era, popular Web sites and service providers are driving bandwidth requirements through the roof while pushing the costs of systems through the floor, according to presentations from Facebook engineers and others at a meeting of the Ethernet Alliance.
Indian 3G auction set for December News & Analysis 9/14/2009 Post a comment India is set to stage its long-awaited auction of 3G wireless spectrum on Dec. 7, followed by bidding for EVDO and WiMax spectrum two days after completion of 3G auctions.
ESP sensor measures yaw rate and acceleration Product News 9/11/2009 Post a comment Bosch Automotive Electronics claims that its SMI540 is the world's first micromechanical inertial measurement unit for vehicle dynamics control in low-cost SOIC16w housing. The unit opens up new development possibilities for the ESP electronic stability program.
EC set to decide on long-running Qualcomm probe News & Analysis 9/10/2009 Post a comment Antitrust regulators in the European Commission are understood to be considering setting up a special panel to unravel the long-drawn out case pending against wireless chip group Qualcomm concerning patent royalty payments.
picoChip targets small-cell LTE femto designs News & Analysis 9/10/2009 Post a comment Wireless chip design group picoChip (Bath, England) is continuing to extend its range of development systems for the emerging femtocells market, with a hardware and software platform targeting "small cell" LTE basestations.
Polymer Vision may hit the screens again Product News 9/10/2009 Post a comment On-line reports in the Netherlands suggest that Polymer Vision has been bought from the administrators by an Asian based company, and that it will continue to work on launching foldable e-paper display devices.
Motion to stay ITC ruling denied, Tessera says News & Analysis 9/10/2009 Post a comment A U.S. federal appeals court has denied a motion to stay U.S. International Trade Commission orders prohibiting the importation into the U.S. of certain products by several vendors of wireless ICs, according to Tessera Technologies.
Ramtron reaches settlement over product failure News & Analysis 9/9/2009 Post a comment Nonvolatile memory vendor Ramtron International has entered into a settlement with one of its customers that resolves all matters related to previously disclosed in-field failures of one of Ramtron's ferroelectric RAM products.
What are the engineering and design challenges in creating successful IoT devices? These devices are usually small, resource-constrained electronics designed to sense, collect, send, and/or interpret data. Some of the devices need to be smart enough to act upon data in real time, 24/7. Are the design challenges the same as with embedded systems, but with a little developer- and IT-skills added in? What do engineers need to know? Rick Merritt talks with two experts about the tools and best options for designing IoT devices in 2016. Specifically the guests will discuss sensors, security, and lessons from IoT deployments.