Allied with Intel, CEA-Leti Shoots for Moon News & Analysis 9/27/2016 2 comments CEA-Leti's CEA calls the new five-year research contract with Intel a "moonshot." Included in the research framework is for the French institute to provide technologies that enable the next-generation communicationo for Internet of Things.
Baidu Releases AI Benchmark News & Analysis 9/26/2016 2 comments Calling for 100x faster processors, Baidu released DeepBench, a benchmark for how fast processors train neural networks.
Chip Market to Go Down, says Future Horizons News & Analysis 9/26/2016 Post a comment Malcolm Penn, the founder and CEO of Future Horizons Ltd. and usually one of the most bullish of chip market forecasters, thinks 2017 could be a third year of decline for the global semiconductor industry.
Imagination 2.0 Update Ships News & Analysis 9/26/2016 Post a comment Imagination Technologies predicts profits this year with streamlined operations under a new CEO and thoughts of new core IP licensing models.
Massive Sensor Fusion for Cars Is HERE News & Analysis 9/26/2016 1 comment HERE’s new live traffic/map offerings are the world’s first services created from real-time sensor data from competing car brands. From technical perspectives, though, bigger issues include: how open the specifications will be for collected sensory data.
TSMC Expands its 3D Menu News & Analysis 9/22/2016 14 comments TSMC showed an expanding array of foundry process technologies, packaging options and applications-specific platforms at an event.
Amazon Echo & How It Resonates News & Analysis 9/22/2016 4 comments Amazon’s Echo-like smart speakers are on the rise. The voice interface is emerging as one of the most natural interface to control IoT devices. Analysts expect the voice interface in home automation hubs, TVs, set-top boxes, HVAC/environmental control hubs and more.
Robo-Car's Safety Challenges DoT News & Analysis 9/21/2016 27 comments The federal policy places self-driving cars directly under the purview of federal regulators. Stripped from the privilege of “self-certifying” their vehicles, carmakers will need “pre-market approval” from the DoT. The key question, however, is testing of AI cars’ safety.
Persistent Memory Needs Apps News & Analysis 9/20/2016 6 comments A researcher from Hewlett Packard Enterprise called for apps that use persistent memory on servers although the chips are still more than a year away.
Peratech 'Print' Smart Buttons on Any Surface News & Analysis 9/20/2016 2 comments Peratech, which invented quantum tunneling composites (QTC) materials, is now allowing its clients to print a smart button, which people can push with force, on any surface of any materials – including laminated wood.
Emerging Memories: Ship First, Perfect Later News & Analysis 9/20/2016 1 comment MRAM maker Everspin sees perfection as a barrier to getting traction; Everspin sees putting its technology into production as a way to improve processes and lower costs--the keys to adoption.
ARM Raises Bar for Safety, Determinism News & Analysis 9/19/2016 3 comments ARM is rolling out what the company describes as its “most advanced processor for safety.” The new processor, dubbed Cortex-R52, is aimed at automotive, industrial and healthcare applications that demand functional safety.
Transistor Trick Beats Moore News & Analysis 9/14/2016 7 comments Zeno Semiconductor, a Zvi-OrBach startup, claims it has discovered a More-that-Moore architecture that can instantly convert any MOSFET to a high-power bipolar-junction transistor (BJT), or even FinFETs.
Intersil Deal: Renesas' Survival Bid News & Analysis 9/13/2016 Post a comment In an exclusive telephone interview with EE Times, Renesas CEO said the Intersil deal won't be the last big M&A for Renesas. Intersil CEO will stay with the new company in a senior management position.
Chip Process War Heats Up News & Analysis 9/12/2016 Post a comment Fully-depleted silicon-on-insulator is on the rise but FinFETs are strong and planar will be the big winner, says veteran chip watcher Handel Jones.
SGI Supercomputes Ireland News & Analysis 9/8/2016 Post a comment SGI and Irish Centre for High-End Computing (ICHEC) collaborate on the world's most accurate climate modeling aiming to provide accurate weather forecasts.
Apple Heralds Dawn of Dual Lens Camera News & Analysis 9/8/2016 1 comment Apple’s iPhone 7 Plus comes with a dual-lens camera, providing both telephoto-zoom and depth of field features. Corephotonics, who pioneered the computational dual camera for smartphones, is enabling Apple’s competitors to develop similar dual camera smartphones.
Globalfoundries Preps 12nm FDSOI Process News & Analysis 9/8/2016 7 comments Globalfoundries has announced a next-generation FDSOI process, called12FDX, to follow on from the 22FDX process that is nearing production. The new process nominally at 12nm minimum geometry is intended for mobile computing, 5G, artificial intelligence and autonomous vehicles.
IC Insights Trims IoT Chip Market Forecast News & Analysis 9/8/2016 1 comment IC Insights reduced the IoT semiconductor market’s projected compound annual growth rate (CAGR) -- between 2014 and 2019 -- from originally projected 21.1 percent to 19.9 percent.
IBM Bests Intel's HPCs News & Analysis 9/8/2016 Post a comment IBM+Nvidia claim to have produced supercomputers in a single rack slot that are faster and cheaper than equivalent Intel-based configurations.
LTE IoT: Sequans Claims 'Big Lead' over Rivals News & Analysis 9/6/2016 3 comments With the recent ratification of the Cat M1 and Cat NB1 standards, Cellular IoT is getting hot. Sequans claims it’s the first to sample CAT M1/NB1 chips, 9 months ahead of its rivals including Qualcomm, Intel and Altair.
Intel Buys Movidius: Automotive Vision in Play? News & Analysis 9/6/2016 Post a comment The Movidius deal is a big win for Intel. Where analysts’ opinions diverge is whether Intel has a long-term ambition to extend Movidius’ technology to autonomous cars, and if Movidius is equally hungry for the automotive market.
TSMC, Renesas Partner in 28nm for Robotic Cars News & Analysis 9/5/2016 14 comments Renesas will combine its Metal-Oxide-Nitride-Oxide-Silicon (MONOS) eFlash technology with TSMC’s 28nm high-K metal gate process to make MCUs for applications such as autonomous vehicle sensor control, coordination of ECUs, fuel-efficient engine management and motor inverter control for EVs.
2016 IC Industry: Who Grabbed What...So Far News & Analysis 9/2/2016 11 comments Among M&A deals thus far in 2016, we find more transactions that are not an outright “whole” company acquisition. As deals get granular, who owns what becomes more of a tangled web. EE Times attempts to untangle it.
Renesas, Maxim In Duel for Intersil News & Analysis 8/31/2016 Post a comment The courtship of Intersil Corp. is turning into a duel between Japan’s Renesas Electronics and San Jose, Calif.-based Maxim Integrated Products Inc. Intersil may announce a sale to Renesas as early as next week, Reuters reported.
IC Industry M&A: Who's Left to Buy? News & Analysis 8/31/2016 4 comments Only eight months in, 2016 is already looking like another blockbuster year for M&A in the global chip industry. As valuations keep going up, the questions are who’s left to buy and what’s a good buy?
Apple Owes $14.5 Billion Back Tax, says Europe News & Analysis 8/30/2016 6 comments The European Commission has ruled that over several years Ireland has granted unjustifiable tax benefits to Apple worth up to €13 billion (about $14.5 billion), which the US computer company must now pay back to the Irish state — plus interest.
ARM Investors Nod to Its Sale to SoftBank News & Analysis 8/30/2016 1 comment Shareholders of ARM overwhelmingly approved its sale to SoftBank on Tuesday. The move officially put an end to the independence of ARM, a wildly successful processor IP core company born 31 years ago in Cambridge, the U.K.
Intel Debuts 14nm+ Processors News & Analysis 8/30/2016 3 comments Intel announced its Kaby Lake PC chips using an enhanced 14nm process and media engine to deliver a 12% overall boost and improved 4K video.
Auto Cybersecurity Dissected: Who, Where & What News & Analysis 8/25/2016 3 comments The automotive industry’s change in perception on cybersecurity, compared to just a year ago, is seismic. We attempt to break down the layers of automotive cybersecurity. We identify where such software will reside, its functions and likely evolution.
Power9 Opens IBM to Partners News & Analysis 8/24/2016 3 comments IBM’s Power9 processor reaches out to new OEMs and partners with multiple interconnects and variants of the chip, according to a talk at Hot Chips.
AMD Reveals Zen of X86 News & Analysis 8/24/2016 Post a comment AMD detailed Zen at Hot Chips, its next-generation x86 core aimed at head-to head competition with Intel in everything from notebooks to servers.
Renesas Sets Sights on Intersil News & Analysis 8/23/2016 Post a comment Renesas Electronics is “in the final stages of negotiations to acquire Intersil,” reported the Japanese economic newspaper Nikkei Monday. Neither Renesas nor Intersil is confirming the report at this time.
ARM Reaches for Supercomputers News & Analysis 8/22/2016 1 comment New vector extensions for 64-bit ARM cores aim to take the company into the highest reaches of supercomputer performance with partners including Fujitsu.
Laser Slicing to Slash SiC Wafer Costs, Boost Yield News & Analysis 8/22/2016 1 comment Japanese ingot processing equipment manufacturer DISCO Corporation has unveiled a new laser-based technique to slice wafers out of a SiC ingot, producing 50% more wafers through reduced material losses while slashing production times by a factor of six.
What are the engineering and design challenges in creating successful IoT devices? These devices are usually small, resource-constrained electronics designed to sense, collect, send, and/or interpret data. Some of the devices need to be smart enough to act upon data in real time, 24/7. Specifically the guests will discuss sensors, security, and lessons from IoT deployments.