Micron, Samsung in Flash Battle News & Analysis 2/5/2016 10 comments Micron described a 768Gbit 3D NAND flash chip that is twice as dense as Samsung’s current vertical NAND, but it’s not clear it will come to market.
Where Are We With Inattentive Driving? News & Analysis 2/4/2016 14 comments Distracted driving -- especially through the growing use of smartphones in vehicles -- is killing people on the road. Where are the technologies designed to combat the problem of inattentive or intoxicated driving?
MIT Neural Network IC Aims At Mobiles News & Analysis 2/4/2016 Post a comment MIT researchers have designed a chip to implement neural networks and claim it is 10 times as efficient as a mobile GPU. This could be used to allow mobile devices to run artificial-intelligence algorithms locally, rather than uploading data to the Internet for processing.
FinFETs Flow at Samsung, TSMC News & Analysis 2/3/2016 3 comments Production of next-generation FinFET chips is underway in earnest with Samsung and TSMC leading the charge. Although Samsung announced mass production of its 14nm LPP process technology with a major customer win in Qualcomm, TSMC may have the last laugh with Apple driving shipments.
34 Automotive Startups to Watch News & Analysis 2/2/2016 2 comments The automotive sector has been going through something of a renaissance with automotive tech startups mushrooming at unprecedented speed. In collaboration with IHS Automotive’s analyst Egil Juliussen, we put together a list of 34 startups to watch.
Chip Sales Dipped Slightly in 2015 News & Analysis 2/1/2016 Post a comment Despite formidable economic headwinds, semiconductor sales in 2015 fell just short of the record total established in 2014, according to the Semiconductor Industry Association.
Moore’s Law Goes Post-CMOS News & Analysis 2/1/2016 8 comments Moore's Law can continue if engineers focus on cost per transistor and adopt challenging post-CMOS techniques, Intel's top fav executive said at ISSCC.
Why Opt For Chip Stack, FD-SOI in Image Sensors? News & Analysis 1/28/2016 2 comments Before stampeding to FD-SOI for CMOS image censors (CIS), a few key questions need answering: How big is the CIS market? Why chip stacking in CIS? Why use FD-SOI? We asked Yole Développement to help us break it down.
FDSOI Carries on Despite ST Re-org, Says COO News & Analysis 1/28/2016 6 comments STMicroelectronics' withdrawal from the set-top-box business and the transfer of engineers to microcontroller and digital automotive work will not stop the adoption of fully-depleted silicon-on-insulator (FDSOI) manufacturing process, according to Jean-Marc Chery, ST's chief operating officer.
Google's Deep Learning Comes to Movidius News & Analysis 1/27/2016 Post a comment Google will buy Movidius vision processing chips and license the entire Movidius software development environment. Google's goal is to expand its machine intelligence technology beyond the data center, by bringing it to mobile devices.
India Preps RISC-V Processors News & Analysis 1/27/2016 34 comments An India government lab expects to get up to $45 million to develop a 64-bit RISC-V microprocessor, while a team of academics is developing similar chips released as open source.
Chip Stacks Take New Tacks News & Analysis 1/25/2016 4 comments Chip stacks will be key to advances in semiconductors, but in logic TSVs are waning while fan-out techniques and SiPs are on the rise.
Toshiba to Gut Chip Biz Sans NAND News & Analysis 1/22/2016 2 comments Toshiba Corp. has decided to gut the company’s semiconductor business—except for its NAND flash memory products, Japan’s economic newspaper Nikkei reported Saturday morning.
Security Outlook Bleak, Improving News & Analysis 1/22/2016 1 comment The rise of the Internet of Things with more devices and data means many more security breaches are ahead but so are more secure SoCs, said an expert at DesignCon.
IoT Shoots for the Stars News & Analysis 1/21/2016 1 comment Arrayent, the inventor of the Connect Platform for Internet of Things brands such as Whirlpool, Pentair, Maytag Commercial Laundry, LiftMaster, and more just landed $15 million in Series C funding.
Sony To Use FD-SOI in Stacked Image Sensors News & Analysis 1/21/2016 4 comments At the FD-SOI Forum held here Thursday, the biggest FD-SOI news, which surfaced as chatter during coffee breaks at the Forum, is that Sony is looking to use FD-SOI for image signal processor on chip stack CMOS Image Sensors.
Microchip Signs to Buy Atmel News & Analysis 1/20/2016 2 comments Microcontroller, analog and flash memory IC vendor Microchip Technology Inc. (Chandler, Ariz.) has agreed to buy Atmel Corp. (San Jose, Calif.) for about $3.56 billion and Dialog Semiconductor, previously set to buy Atmel, has been paid a $137.3 million termination fee.
Intel Protege Pitches Wireless SoC for IoT News & Analysis 1/20/2016 Post a comment Fabless chip company Telink Semiconductor Co. Ltd. (Shanghai, China) has launched the TLSR8269 a system-on-chip intended to provide low power wireless connection for the Internet of Things applications in the smart home.
V-Nova Preps UHD/4K Silicon IP for Licensing News & Analysis 1/19/2016 Post a comment V-Nova Ltd., the startup creator of a proprietary video codec and compression technology called Perseus, has said it is preparing to provide its technology as UHD/4K video silicon IP for licensing and inclusion in customers' SoCs.
Has Samsung Snagged Qualcomm Business with New Process? News & Analysis 1/15/2016 2 comments Samsung Electronics, which has been in a nip-and-tuck race with Taiwan Semiconductor Manufacturing Co. (TSMC) to win foundry orders with the world’s most advanced fabrication technology, may have grabbed all of Qualcomm’s business with a second-generation version of its 14nm FinFET process.
Microchip Wins Atmel Bidding War News & Analysis 1/15/2016 1 comment Atmel announced that its board of directors favors an acquisition proposal by Microchip Technology and cancel an existing agreement to be acquired by Dialog Semiconductor.
TSMC Boosts 2016 Capex to About $9.5 Billion News & Analysis 1/14/2016 2 comments Taiwan Semiconductor Manufacturing Co. (TSMC), the world’s largest foundry, said it will increase its capital expenditure in 2016 to an amount ranging from $9 billion to $10 billion as it aims for a bigger share of finer geometry chips.
Consumers Feel Perils of Connectivity News & Analysis 1/14/2016 7 comments Connectivity is the main thing in the Internet of Things . But what if software updates, unbeknownst to users, go haywire, leaving people -- especially seniors, the ill and babies – inside in the cold?
AMD’s ARM SoC Seeks Sockets News & Analysis 1/14/2016 1 comment AMD announced production availability for its first 64-bit ARM-based server processor, but it lacks customers and is not competitive with Intel’s Xeon.
6 Things to Know About HDR, 4K TV News & Analysis 1/14/2016 3 comments The consumer electronics world has just got some much-needed clarity on 4K Ultra High Definition TV. In parallel, the industry now faces a fresh format battle brewing over High Dynamic Range technology. Here are the six things you need to know about 4K, HDR.
Cypress Unveils Traveo OTA Update MCUs News & Analysis 1/12/2016 Post a comment Cypress Semiconductor Corp. rolled out the first series of Traveo MCUs with embedded flash on the 40nm process technology node, designed to enable mid-range to mass-market cars to implement over-the-air software updates.
Chip Forecasts, Drivers Diverge News & Analysis 1/12/2016 5 comments Chip revenues could contract 3%, expand 4% or something in between this year, said analysts at the SEMI trade group's annual executive forum.
Mobileye, Nvidia (and Others) Spar over Cars News & Analysis 1/11/2016 5 comments The field of autonomous driving technologies revealed its substantial expansion at this year’s Consumer Electronics Show. Mobileye’s new mapping technology is potentially “most dangerous,” cautioned CEVA CEO, as it can lock in car makers using Mobileye’s EyeQ chip.
Imec Melds Flash/III-V News & Analysis 1/8/2016 7 comments Just as III-V channels can speed the operation of planar silicon transistors, so can vertical flash structures we sped up with InGaAs channels.
ARM Exec’s Straight Car Talk at CES News & Analysis 1/7/2016 1 comment In a one-on-one interview with EE Times at the CES, Ian Drew, ARM’s executive vice president of marketing and business development, posed five questions that the automotive industry -- or the tech industry in general -- would rather not hear.
Amazon Now Sells Own ARM chips News & Analysis 1/7/2016 2 comments Annapurna Labs Inc. ( ), a subsidiary of Internet shopping channel Amazon.com, has announced the availability of its Alpine range of ARM-based chips and subsystems aimed at home use Wi-Fi routers and Network-Attached Storage devices.
As data rates begin to move beyond 25 Gbps channels, new problems arise. Getting to 50 Gbps channels might not be possible with the traditional NRZ (2-level) signaling. PAM4 lets data rates double with only a small increase in channel bandwidth by sending two bits per symbol. But, it brings new measurement and analysis problems. Signal integrity sage Ransom Stephens will explain how PAM4 differs from NRZ and what to expect in design, measurement, and signal analysis.
January 2016 Cartoon Caption ContestBob's punishment for missing his deadline was to be tied to his chair tantalizingly close to a disconnected cable, with one hand superglued to his desk and another to his chin, while the pages from his wall calendar were slowly torn away.122 comments