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Moore's Law Competitor Wins $150K Elevator Pitch Prize
News & Analysis  
11/27/2014   Post a comment
Quilt packaging wins $150,000 prize for best elevator pitch explaining a new MEMS-based device or technology.
Sony’s 3-Year Plan: Treading Water or Just Sinking?
News & Analysis  
11/26/2014   17 comments
Sony’s three-year outlook for its mobile business "isn’t aiming for size or market share," said Sony's new mobile chief.
NXP to Pick Up Its Missing IoT Link – Bluetooth Low Energy
News & Analysis  
11/25/2014   7 comments
In pursuit of the Internet of Things market, NXP Semiconductors has picked up a key technology conspicuously absent from its portfolio -- Bluetooth Low Energy -- from Quintic, a nine-year-old startup.
Megachips to Launch DSP-Based Sensor Fusion IC
News & Analysis  
11/25/2014   1 comment
The growing sensor-fusion controller market for smartphones and wearable devices is about to meet a new competitor – this time from Japan. Megachips is rolling out a motion engine and sensor hub chip, dubbed Frizz.
MediaTek Plans $49 Million Investment in China's Chip Fund
News & Analysis  
11/25/2014   1 comment
Taiwan’s largest chip designer has announced it will invest $48.9 million in a Chinese government fund as the company aims to sharpen its competitive edge in the world’s largest cellphone market.
Startup to Open Source Parallel CPU
News & Analysis  
11/24/2014   32 comments
Rex Computing plans a parallel processor that could deliver a 10x leap in performance/watt. It will open source the design through Facebook's Open Compute Project.
Can Japan Get Her Groove Back With IoT?
News & Analysis  
11/24/2014   11 comments
Japan once looked like a world leader in smart home standards. Now she's trying to get her groove back via the Internet of Things.
Megachips: Japan's Best Kept Secret
News & Analysis  
11/21/2014   17 comments
In a recent interview with EE Times, Megachips’ president and CEO Akira Takata laid out a plan to commit the company’s future growth, not on ASICs for the domestic market, but ASSPs for the global market.
Intel Expects 2015 Mobile Speedup
News & Analysis  
11/21/2014   12 comments
Intel is back on track with mobile, company officials said at an annual investor meeting.
Automotive Industry Drives Chip Demand
News & Analysis  
11/20/2014   9 comments
Among all major end use-applications for integrated circuits, the automotive market exposes the strongest growth, finds market researcher IC Insight in a study to be released later this month.
Carbon Nanobuds Flex, Replace Indium Tin Oxide
News & Analysis  
11/20/2014   5 comments
Carbon nanobud films will replace indium tin oxide as the transparent conductors enabling touchscreens, buttons, sliders, and more.
Qualcomm Rides LTE to Cat 10
News & Analysis  
11/20/2014   4 comments
Qualcomm announced its fifth-generation LTE modem, a Category 10 chip with global carrier aggregation. The Gobi 9x45 modem and its second- generation RF360 envelope tracker are based on 20nm technology.
iCub: It's Robotic, It's Cute & It's Italian
News & Analysis  
11/19/2014   11 comments
Japan's love affair with robots is well-known. So, predictably, Japanese attendees at Embedded Technology show are gushing over this little Italian -- about as big as a four-year-old child - which they praise as smart, sophisticated and gentle.
Intel Merges Mobile, PC Divisions
News & Analysis  
11/18/2014   18 comments
In a move to streamline business and combat dismal financial results for its mobile in the third quarter, Intel will merge its mobile and PC divisions. The transition is set to occur in early 2015.
Xilinx Announces SDAccel Dev Environment for C, C++ & OpenCL
News & Analysis  
11/18/2014   2 comments
Real-world benchmarks show that -- using hand-coded RTL as a baseline reference point -- SDAccel can meet or exceed hand-coded results.
Chinese Dream for IC Powerhouse Is Coming True
News & Analysis  
11/18/2014   3 comments
China, which for nearly two decades has aimed to make semiconductor manufacturing one of its pillar industries, may realize the dream in the next 10 years, according to executives and analysts surveyed by EE Times.
Is Sony Too Big to Succeed?
News & Analysis  
11/18/2014   7 comments
Big spenders and financial analysts gathering for Sony's investor relations event next week in Tokyo are preoccupied with one big question: Does Sony's management team have the medicine to cure its ailing electronics business?
Will New SoCs Keep Marvell at No. 2 in China’s LTE Market?
News & Analysis  
11/17/2014   3 comments
Marvell, with a 30% market share in China’s LTE market today, plans to fend off competitors with two five-mode 4G LTE 64-bit mobile processors -- one with octa-cores and another with quad-cores.
ISSCC Tips Hot Circuit Designs
News & Analysis  
11/17/2014   4 comments
The International Solid State Circuits Conference will host papers on new processors from Intel, AMD, and IBM and some of the first designs made in new FinFET processes.
Renesas Shifts Automotive Center of Gravity to Europe
News & Analysis  
11/14/2014   Post a comment
Europe gets automotive, US gets industrial: Chipmaker Renesas will open its Global ADAS Solution Group in Düsseldorf, Germany.
Analysts: TSMC’s FinFET Shows 'Company Ahead of Schedule'
News & Analysis  
11/13/2014   1 comment
TSMC's "milestone" announcement on the production of its 16nm FinFET Plus process is yet another sign that the world's largest chip foundry is ahead of schedule, according to analysts.
Trillion-Sensor Vision, Results Shared
News & Analysis  
11/12/2014   3 comments
The proliferation of sensors from mobile, medical, and engineering applications will drive an “abundant” world free of pressing issues such as healthcare, according to speakers at the TSensors Summit held here. Sensors will be a key component in curing the world’s ills, and the world needs a roadmap.
Software Has the Last Word for PIN Entry
News & Analysis  
11/11/2014   Post a comment
The Cartes Secure Connexions exhibition had its fair share of hardware exhibitors, but authentication is at the core of every transaction, and software solutions are increasingly taking center stage.
Spansion’s Foray Into e.MMC Market
News & Analysis  
11/11/2014   Post a comment
Spansion has rolled out a family of “industrial-grade” embedded MultiMediaCard memory products by using its high-density MLC NAND flash. The company is playing catchup with Micron and Toshiba.
CogniVue, Fraunhofer Debut Supersmall Camera at Electronica
News & Analysis  
11/11/2014   3 comments
Fraunhofer's driver-assist microcamera, exhibited this week at Electronica in Munich, uses CogniVue's image processing technology and a Freescale Semiconductor image cognition processor based on CogniVue's IP.
TSMC Predicts Next Big Thing
News & Analysis  
11/10/2014   5 comments
With MEMS and CMOS on same chip, sourced from a single well-oiled supply chain offering dirt-cheap prices, innovators will create the "next big thing." One-stop shopping at a semiconductor manufacturer is the future, says TSMC.
PowerVR Guns for AMD, Nvidia
News & Analysis  
11/10/2014   11 comments
Imagination Technologies' latest PowerVR Series 7 graphics cores sport a host of new features, including the ability to play in notebooks, consoles, and servers.
NXP's Ultra-Low-Power LPC54100 MCUs for Always-On Sensor Apps
News & Analysis  
11/7/2014   18 comments
LPC54100 MCUs boast dual processors: a Cortex-M0+ for listening, data aggregation, and management functions, and a Cortex-M4F for math-intensive sensor fusion algorithms.
Globalfoundries Wins Design Partner
News & Analysis  
11/6/2014   8 comments
Invecas, an IP core and SoC design firm formed by combining two companies and a small group of ex-IBMers, has set up shop exclusively supporting Globalfoundries, which is racing to deliver 14nm FinFET node.
MediaTek Aims for Fast Entry Into China’s LTE Market
News & Analysis  
11/6/2014   1 comment
MediaTek aims to pare Qualcomm’s lead in China’s 4G smartphone market with the launch of a new octa-core processor in the first quarter of 2015.
TI to Open 300mm Wafer Bumping Facility in Chengdu
News & Analysis  
11/6/2014   2 comments
TI will open a 300mm wafer bumping facility in Chengdu, China. The company described the move as the third leg of a “long-term China strategy,” unveiled in 2010, to establish production facilities in China.
China Owes Us, Qualcomm Says
News & Analysis  
11/5/2014   18 comments
In an otherwise glowing quarterly financial report, Qualcomm said China device makers are not reporting hundreds of millions in sales to avoid royalties.
Superconductivity Predicted by Supercomputer
News & Analysis  
11/5/2014   4 comments
Tower Semiconductor Ltd. (Migdal Haemek, Israel) has started manufacturing the military grade MAXL-OL-2000 MEMS-based accelerometer family for fabless chip company Physical Logic AG (Zurich, Switzerland) using a thick-film silicon-on-insulator (SOI) version of its 180nm modular MEMS process.
Fabless Pipsqueaks Grow Up
News & Analysis  
11/5/2014   14 comments
The trade association of fabless semiconductor companies celebrates its 20th anniversary this year, declaring victory in its goal to establish its sector and the business model behind it.
Chip Market Growth Continues to Slow in September
News & Analysis  
11/4/2014   1 comment
For the fourth consecutive month the annual growth in the global semiconductor market slowed in September.
Imagination Takes On Nvidia
News & Analysis  
11/3/2014   4 comments
Imagination Technologies is developing technology to link hundreds of MIPS and PowerVR cores.
China Blamed for Microchip Dip
News & Analysis  
10/30/2014   4 comments
Microchip Technology Inc. reported financial results for the second quarter of fiscal 2015 ending Sept. 30. Officials said the company's decrease in sales is a reflection of the economic climate in China rather than internal issues.
Why Xiaomi Is World's 3rd Largest Mobile Co.
News & Analysis  
10/30/2014   28 comments
Xiaomi's emergence as world's third largest smartphone vendor makes us ask how the rules have changed in global smartphone market.
Japan's MegaChips to Buy MEMS Timing Leader SiTime
News & Analysis  
10/29/2014   4 comments
MegaChips, Japan's fast-growing fabless, will buy SiTime Corp. for $200 million in cash to leverage SiTime's MEMS timing devices to enhance its own SoCs and ASSPs for wearable and mobile devices.
UMC Takes Bigger Slice of 28nm Business
News & Analysis  
10/29/2014   7 comments
UMC, the world’s third-largest chip foundry, said that it grabbed a larger piece of the 28 nm business that is dominated by TSMC. UMC reiterated its capital expenditure for this year at about $1.3 billion.
Freescale CEO: 'IoT Isn't Just Buzz'
News & Analysis  
10/29/2014   13 comments
Two factors rejuvenating Freescale are the "explosion of connected devices" and "cars so aware of their surroundings that they can't get into accidents," says its CEO.
Clouds Gather in Cellular Nets
News & Analysis  
10/29/2014   5 comments
Carriers say cloud radio access networks will be important for the future of cellular nets, but they still face real-time and software challenges.
ARM Cortex-M7: Abundance of Memory or Not Enough?
News & Analysis  
10/28/2014   31 comments
Whether the Cortex M7 meets requirements depends on who you ask; the myriad answers point to the hairball of decisions and trade-offs in hardware, software and systems today’s developers are confronted with.
Kili Unveils 1-Stop Fix for Chip-Card Mandate
News & Analysis  
10/28/2014   14 comments
While US retailers struggle to keep up with the transition of mobile payment systems to new technologies like NFC, they face an even bigger challenge as US card issuers drag them into the new world of chip cards.
AMD Hires Dell's Server Chief
News & Analysis  
10/27/2014   5 comments
The new manager of AMD's server and embedded group, Forest Norrod, is the former manager of Dell's server business where he recently shared skeptical views on ARM-based servers, one of AMD's new target markets.
Inside a $125 Million Silicon Startup
News & Analysis  
10/27/2014   10 comments
Soft Machines has come a long way on the persuasiveness of its CEO and the passion of its CTO, but now it must build real commercial products and convince big, established players to license them.
Lucio Lanza to Receive EDA Honor
News & Analysis  
10/27/2014   4 comments
The annual Phil Kaufman award for excellence in electronic design automation (EDA) will be awarded to Lucio Lanza at ICCAD 2014 on Nov. 4th.
China's 5-Year Plan Revealed
News & Analysis  
10/23/2014   12 comments
China's next five-year plan, starting in 2016, will emphasize connectivity, a smartphone for everyone, and the Internet of Things en masse.
Startup Creates Virtual Cores
News & Analysis  
10/23/2014   1 comment
Soft Machines describes its approach to creating virtual cores that bring a new level of parallelism to single-threaded code for any processor architecture.
Microsoft Eyes Expanding FPGA Role
News & Analysis  
10/23/2014   14 comments
Microsoft will explore using FPGAs to replace networking chips in its million-server datacenters to deliver new speeds and network functions.
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Max Maxfield

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Book Review: Controlling Radiated Emissions by Design
Martin Rowe
1 Comment
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