Lattice Deal: Harbinger of FPGA & ASSP Union News & Analysis 5/1/2015 1 comment Lattice CEO, after its acquisition of Silicon Image in March, believes the marriage of FPGA company to an ASSP firm is a match made in heaven. He said, “That’s why Intel wants Altera. It’s obvious.” But is it?
NXP CEO on China, Apple Pay, IoT & V2V News & Analysis 4/30/2015 1 comment In unveiling its Q1 earnings, NXP CEO talks about the pending RF power business sales, its China strategy, a new mobile payment market that Apple Play in China may trigger, and its IoT strategy.
UMC to Skip 20nm, Gun for 14nm FinFET News & Analysis 4/29/2015 3 comments UMC, which has once again become the world’s second-largest chip foundry, will skip the 20 nm technology node as it aims to have 14nm FinFET tapeouts available for customers by Q4 this year.
How the 3 Cs Drive IC Consumption News & Analysis 4/29/2015 1 comment The communications, computers and consumer electronics sectors are set to be responsible for more than 70 percent of IC sales in every geographic region -- Americas, Europe, Japan, and Asia-Pacific -- in 2015, according to market research firm IC Insights.
Topic Teardown: Connected Cars' Pros & Cons Teardown 4/28/2015 11 comments We illustrate the benefits of connected cars. We analyze the driving force behind the connected car. We will scout security measures necessary inside cars in order to make connected cars less vulnerable to external malicious attacks.
EUV Deal Raises Questions News & Analysis 4/24/2015 8 comments ASML announced it struck a deal to sell 15 EUV systems to an existing U.S. customer, once again raising hopes about the readiness of the key technology for making leading-edge chips.
Freescale Reveals NXP Mega Merger Details News & Analysis 4/24/2015 9 comments Five companies, aside from NXP, were in talks with Freescale, and CEO Gregg Lowe will be leaving post merger. Freescale reveals details of the NXP merger during its quarterly results call.
QCOM Seeks Options Beyond Apple, Samsung News & Analysis 4/23/2015 3 comments Qualcomm’s recent earnings reports suggest significant vulnerabilities. Qualcomm is heavily dependent on a single market segment (smartphones), while its revenues are susceptible to the whims of the two top-tier smartphone vendors – Apple and Samsung.
Elvis Sees All in Russia News & Analysis 4/23/2015 17 comments A Russian company claims it has the first Russian designed smart chip. The video intelligent processor (VIP-1) is sold in surveillance systems in Russia, but may be sold as a bare-chip overseas.
Smartwatch Uptick in Mobile Slump News & Analysis 4/23/2015 3 comments Smartwatches could grow to sales of 400 million units a year by 2019 when smartphone and tablet sales slump to single-digit levels, said a market watcher.
Intel's 10nm Secrets Predicted News & Analysis 4/21/2015 11 comments Leapfrogging competitors to lower power chips, Intel will use quantum well FETs in a 10nm process next year using germanium and InGaAs, predicted a semiconductor analyst.
WSTS Marks America Up for 2015 Boom News & Analysis 4/21/2015 Post a comment The market for semiconductors in the Americas region will grow by 15 percent in 2015, according to a revised estimate from the World Semiconductor Trade Statistics (WSTS) organization.
Smartwatches to Outpace Trackers News & Analysis 4/21/2015 Post a comment Smartwatch ownership is on the rise and will likely surpass activity trackers, according to market researchers. A report from The NDP Group projected that 2016 activity tracker ownership will have peaked at 32 million in 2016 while smartwatch ownership will hit 9%.
TI Obsoletes FPGA News & Analysis 4/21/2015 56 comments Texas Instruments is out to kill the FPGA with a nine processor chip that can downsize avionics, military and medical applications to portable size -- from backpack radars to portable MRIs.
Athena Security IPs Designed to Mend Holes in SoCs News & Analysis 4/21/2015 6 comments We see rapidly growing needs for protecting connected systems by using security chips with crypto keys inside. But how do we know if security chips themselves (designed into such connected systems) aren’t leaking key information?
MINI Giving Drivers a Peek at 'Augmented Reality' News & Analysis 4/19/2015 8 comments Although most drivers have yet to embrace the idea of head-up displays on windshields, MINI is leapfrogging to the next phase of futuristic motoring, with its introduction this week of AR eyewear – powered by Qualcomm
Moore's Law: Dead or Alive News & Analysis 4/17/2015 22 comments Moore's Law is still alive and kicking after 50 years, but here are the technologies that are busting and boosting it in the 21st century.
TSMC Cuts Capex by $1 Billion News & Analysis 4/16/2015 4 comments Taiwan Semiconductor Manufacturing Co. (TSMC) is cutting its planned capital expenditure for this year by $1 billion, citing improvements in capital efficiency and a faster-than-expected migration to its leading-edge 16nm process technology.
Imagination Tunes in Wi-Fi, BT News & Analysis 4/15/2015 Post a comment Imagination Technologies hopes to leverage the communications experience of its Ensigma division to bring low power wireless connection to Internet of Things and wearable devices. Imagination hopes its built-for-IoT IP will prove valuable in a market that currently uses dumbed-down mobile chips
Intel Does Balancing Act News & Analysis 4/15/2015 Post a comment In its Q1 results, predictably Intel's PC business is down but data center, IoT, and nonvolatile memory made up for PC loses. Surprisingly capex goes down.
Is Head-Up Display Future ADAS Screen? News & Analysis 4/15/2015 5 comments Texas Instruments, rolling out a new automotive-qualified DLP chipset, is banking on head-up display, predicting it to become “the ADAS display of the future.” But can DLP redefine the HUD market?
Moore’s Law Hits Middle Age News & Analysis 4/14/2015 6 comments Top technologists from Intel, IBM and TSMC who helped drive Moore’s Law forward share their stories and opinions on its 50th anniversary.
Graphene Spintronics Beats All News & Analysis 4/14/2015 7 comments Chalmers University of Technology claims graphene's high-electron mobility enables longer wires without repeaters for future spintronics that encode information on the spin of individual electrons instead of their charge like today.
3D Testing Standardized by SRC News & Analysis 4/14/2015 Post a comment The Semiconductor Research Corp. has standardized Design-for-Test method for 3D chips that has fast throughput by using a single probe to touch several TSV microbumps at the same time.
Parallel Processing Spawns Non-MPEG Codec News & Analysis 4/10/2015 14 comments V-Nova will next week at NAB demonstrate a new video codec called Perseus. It's designed to do hierarchical and scalable video encoding by leveraging massive parallel processing, while sidestepping the complexity of block-based compression algorithms.
MEMS Startup Selects MIPS for Sensor Hubs News & Analysis 4/10/2015 Post a comment A South Korean startup has licensed a MIPS Warrior M-class CPU core from Imagination Technologies Group plc for use in sensor hubs it is developing to address IoT, wearables and automotive applications.
Bell Labs Opens New Doors News & Analysis 4/8/2015 5 comments Bell Labs celebrates is forward looking research at the unveiling of the Nobel Laureate Garden. The president Marcus Weldon's look into its future.
TSMC Outlines 16nm, 10nm Plans News & Analysis 4/8/2015 2 comments TSMC announced plans to roll out updated low-power versions of existing chips and announced its roadmap for smaller process nodes. The company will begin volume production of its 16nm FinFet+ in the middle of this year while breaking ground on 10nm development.
European Chip Market Turns 'Schizophrenic' News & Analysis 4/8/2015 Post a comment Euro-dollar exchange rates affected European chip market figures significantly in February 2015 with the three-month average of European chip market showing growth when interpreted in euros and showing a decline in dollar terms.
Sony Licenses Bonding Technology from Ziptronix News & Analysis 4/2/2015 Post a comment Ziptronix Inc., a developer and provider of low-temperature direct bonding interconnect (DBI) technology for 3D integration, has announced a patent licensing agreement with Sony Corp. for the application of its technology to image sensors.
Medical Chip Market on 12% CAGR News & Analysis 3/31/2015 Post a comment Moves to smaller and portable medical equipment for use away from hospitals is driving up sales of ICs and sensors in the medical semiconductor market, according to market research firm IC Insights.
Battle-hardened veterans of the electronics industry have heard of the “connected car” so often that they assume it’s a done deal. But do we really know what it takes to get a car connected and what its future entails? Join EE Times editor Junko Yoshida as she moderates a panel of movers and shakers in the connected car business. Executives from Cisco, Siemens and NXP will share ideas, plans and hopes for connected cars and their future. After the first 30 minutes of the radio show, our listeners will have the opportunity to ask questions via live online chat.