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Memory Design Trends in 2014
News & Analysis  
12/19/2014   Post a comment
Memory transitions, increased-density drive design trends: Customers are looking for subsystems that can accommodate both DDR3 and DDR4, while constraint-based design is par for the course as denser memory makes manufacturing more complex.
True 3-D Chips Harness Nanotubes
News & Analysis  
12/19/2014   Post a comment
Stanford University has learned how to stack any number of layers atop a standard CMOS chip by using low-temperature RRAM for memory and carbon nanotube transistors for logic.
Successful With Phones & Drones, Parrot Ponders Farming
News & Analysis  
12/18/2014   5 comments
Parrot is a 20-year-old startup that has the passion of "makers" backed by intimate knowledge of telephony connectivity, digital signal processing, and in-house ASIC design.
Sony's Debuts Smartglasses Module
News & Analysis  
12/18/2014   1 comment
Following up on prototypes demonstrated earlier this year, Sony has announced an attachable smartglass module that can turn various eyewear into augmented reality devices.
MIT Discovers Superconductor Law
News & Analysis  
12/18/2014   14 comments
The Massachusetts Institute of Technology has discovered a law governing the relationship between critical temperature at which superconductivity begins, resistivity, and the thickness of the film for superconducting integrated circuits.
Apps Layer: '800lb Gorilla' in IoT Nobody Talks About
News & Analysis  
12/16/2014   16 comments
Plenty of people and companies in the technology world tend to come at the Internet of Things by dwelling on "Internet." But what if we started with the "Things" instead?
Will Qualcomm's China Investment Pay Off?
News & Analysis  
12/15/2014   8 comments
Qualcomm is vulnerable in China, and the company knows it. It remains to be seen, however, how its $150 million PR gambit to invest in China's mobile ecosystem will actually pay off.
7 Questions With Broadcom’s CTO
News & Analysis  
12/15/2014   1 comment
Broadcom co-founder and chief technologist talks about Moore’s Law, his plans for 16nm FinFET tape-outs in 2015, IoT platform wars and shifts in the engineering profession.
Sequans: The Startup That Started Over
News & Analysis  
12/15/2014   6 comments
Early one Paris morning in July 2011, Georges Karam, president and CEO of Sequans, got a call from HTC. Kara'’s biggest customer asked him to stop shipping Sequans' WiMax radio chips. That called changed everything.
Tiny Spectrometer Targets IoT
News & Analysis  
12/12/2014   14 comments
NanoLambda has developed an ultra-compact, low-cost spectrometer-on-a-chip to measure concentration and density based on wavelength. The chip is accurate to 1 nm with 10nm resolution for consumer and medical uses.
Top 2014 Acquisitions that Advanced the Internet of Things
News & Analysis  
12/11/2014   7 comments
2014 was the year when the electronics industry decidedly and collectively moved forward to push IoT. For evidence, look no further than the many mergers and acquisitions among IC, system, and software vendors this year.
Silicon Startups Get Incubator
News & Analysis  
12/9/2014   10 comments
Silicon Catalyst aims to help about 10 semiconductor startups produce their first chips in 2015, leveraging partnerships with Keysight, Synopsys, and TSMC.
Freescale Charges 15W Wirelessly
News & Analysis  
12/8/2014   4 comments
Freescale is turning up power with a new set of wireless charging receivers and transmitters for larger mobile devices such as phablets, tablets, and handheld medical equipment. The Qi-compliant system is the first in the industry to reach the 15 Watt threshold.
TSMC to Use EUV for 7nm, Says ASML
News & Analysis  
12/8/2014   7 comments
ASML says that TSMC plans to buy two EUV scanners next year to extend the boundaries of its process technology, potentially to 7 nanometers.
Foundry Sales Growing Faster Than Chip Market
News & Analysis  
12/8/2014   4 comments
Global foundry IC revenues will grow by 13 percent to $47.9 billion in 2014, following on from annual growth of 13 percent in 2013 and 18 percent in 2012, according to a report produced jointly by the Global Semiconductor Alliance (GSA) and market researcher IC Insights.
eSilicon Offers Try-Before-You-Buy IP Tool
News & Analysis  
12/3/2014   5 comments
eSilicon launched the IP MarketPlace web-based tool for SoC designers. It facilitates browsing IP, encouraging designers to tinker, build, and generate a complete memory subsystem before making a purchase decision.
Algotronix OTN AES-GCM Cores Are Configurable up to 800 Gbit/s
News & Analysis  
12/3/2014   Post a comment
In the case of encryption cores, design team needs to be able to prove beyond doubt that no virus or Trojan code is incorporated in the core.
Hot Technologies: Looking Ahead to 2015
News & Analysis  
12/3/2014   3 comments
EDN and EE Times explore some of the hot technologies in 2014 that will shape technology trends for next year and beyond as engineers bring even more innovative ideas to reality.
Bluetooth 4.2 Unveiled: No Mesh Yet, But Big on IoT
News & Analysis  
12/3/2014   14 comments
With new Bluetooth 4.2 specs published Dec. 3, the Bluetooth Special Interest Group promises to deliver several incremental but solid performance increases. Conspicuously absent is mesh technology.
HP Signals Itanium’s Decline
News & Analysis  
12/2/2014   7 comments
Hewlett-Packard announces versions of its high-end, Itanium-based servers running on x86 chips, presaging a shift away from the processor it co-developed with Intel.
Intel X86 Eyes Google Glass
News & Analysis  
12/1/2014   11 comments
The next generation of Google Glass may have new guts, as an Intel x86 processor is expected to replace the existing Texas Instruments Omap chip.
Biologists Grow Living Circuits
News & Analysis  
12/1/2014   9 comments
Biologists at MIT are wiring together implantable living cells to repair damage from maladies like Parkinson's.
Cypress Bids $4B For Spansion
News & Analysis  
12/1/2014   13 comments
Cypress and Spansion struck a deal to merge into a $2 billion embedded chip company with half its business in memory and an expanded microcontroller portfolio with a strong focus on automotive.
Moore's Law Competitor Wins $150K Elevator Pitch Prize
News & Analysis  
11/27/2014   10 comments
Quilt packaging wins $150,000 prize for best elevator pitch explaining a new MEMS-based device or technology.
Sony’s 3-Year Plan: Treading Water or Just Sinking?
News & Analysis  
11/26/2014   28 comments
Sony’s three-year outlook for its mobile business "isn’t aiming for size or market share," said Sony's new mobile chief.
NXP to Pick Up Its Missing IoT Link – Bluetooth Low Energy
News & Analysis  
11/25/2014   8 comments
In pursuit of the Internet of Things market, NXP Semiconductors has picked up a key technology conspicuously absent from its portfolio -- Bluetooth Low Energy -- from Quintic, a nine-year-old startup.
Megachips to Launch DSP-Based Sensor Fusion IC
News & Analysis  
11/25/2014   2 comments
The growing sensor-fusion controller market for smartphones and wearable devices is about to meet a new competitor – this time from Japan. Megachips is rolling out a motion engine and sensor hub chip, dubbed Frizz.
MediaTek Plans $49 Million Investment in China's Chip Fund
News & Analysis  
11/25/2014   1 comment
Taiwan’s largest chip designer has announced it will invest $48.9 million in a Chinese government fund as the company aims to sharpen its competitive edge in the world’s largest cellphone market.
Startup to Open Source Parallel CPU
News & Analysis  
11/24/2014   53 comments
Rex Computing plans a parallel processor that could deliver a 10x leap in performance/watt. It will open source the design through Facebook's Open Compute Project.
Can Japan Get Her Groove Back With IoT?
News & Analysis  
11/24/2014   11 comments
Japan once looked like a world leader in smart home standards. Now she's trying to get her groove back via the Internet of Things.
Megachips: Japan's Best Kept Secret
News & Analysis  
11/21/2014   22 comments
In a recent interview with EE Times, Megachips’ president and CEO Akira Takata laid out a plan to commit the company’s future growth, not on ASICs for the domestic market, but ASSPs for the global market.
Intel Expects 2015 Mobile Speedup
News & Analysis  
11/21/2014   12 comments
Intel is back on track with mobile, company officials said at an annual investor meeting.
Automotive Industry Drives Chip Demand
News & Analysis  
11/20/2014   9 comments
Among all major end use-applications for integrated circuits, the automotive market exposes the strongest growth, finds market researcher IC Insight in a study to be released later this month.
Carbon Nanobuds Flex, Replace Indium Tin Oxide
News & Analysis  
11/20/2014   7 comments
Carbon nanobud films will replace indium tin oxide as the transparent conductors enabling touchscreens, buttons, sliders, and more.
Qualcomm Rides LTE to Cat 10
News & Analysis  
11/20/2014   4 comments
Qualcomm announced its fifth-generation LTE modem, a Category 10 chip with global carrier aggregation. The Gobi 9x45 modem and its second- generation RF360 envelope tracker are based on 20nm technology.
iCub: It's Robotic, It's Cute & It's Italian
News & Analysis  
11/19/2014   14 comments
Japan's love affair with robots is well-known. So, predictably, Japanese attendees at Embedded Technology show are gushing over this little Italian -- about as big as a four-year-old child - which they praise as smart, sophisticated and gentle.
Intel Merges Mobile, PC Divisions
News & Analysis  
11/18/2014   25 comments
In a move to streamline business and combat dismal financial results for its mobile in the third quarter, Intel will merge its mobile and PC divisions. The transition is set to occur in early 2015.
Xilinx Announces SDAccel Dev Environment for C, C++ & OpenCL
News & Analysis  
11/18/2014   2 comments
Real-world benchmarks show that -- using hand-coded RTL as a baseline reference point -- SDAccel can meet or exceed hand-coded results.
Chinese Dream for IC Powerhouse Is Coming True
News & Analysis  
11/18/2014   3 comments
China, which for nearly two decades has aimed to make semiconductor manufacturing one of its pillar industries, may realize the dream in the next 10 years, according to executives and analysts surveyed by EE Times.
Is Sony Too Big to Succeed?
News & Analysis  
11/18/2014   12 comments
Big spenders and financial analysts gathering for Sony's investor relations event next week in Tokyo are preoccupied with one big question: Does Sony's management team have the medicine to cure its ailing electronics business?
Will New SoCs Keep Marvell at No. 2 in China’s LTE Market?
News & Analysis  
11/17/2014   3 comments
Marvell, with a 30% market share in China’s LTE market today, plans to fend off competitors with two five-mode 4G LTE 64-bit mobile processors -- one with octa-cores and another with quad-cores.
ISSCC Tips Hot Circuit Designs
News & Analysis  
11/17/2014   4 comments
The International Solid State Circuits Conference will host papers on new processors from Intel, AMD, and IBM and some of the first designs made in new FinFET processes.
Renesas Shifts Automotive Center of Gravity to Europe
News & Analysis  
11/14/2014   Post a comment
Europe gets automotive, US gets industrial: Chipmaker Renesas will open its Global ADAS Solution Group in Düsseldorf, Germany.
Analysts: TSMC’s FinFET Shows 'Company Ahead of Schedule'
News & Analysis  
11/13/2014   1 comment
TSMC's "milestone" announcement on the production of its 16nm FinFET Plus process is yet another sign that the world's largest chip foundry is ahead of schedule, according to analysts.
Trillion-Sensor Vision, Results Shared
News & Analysis  
11/12/2014   3 comments
The proliferation of sensors from mobile, medical, and engineering applications will drive an “abundant” world free of pressing issues such as healthcare, according to speakers at the TSensors Summit held here. Sensors will be a key component in curing the world’s ills, and the world needs a roadmap.
Software Has the Last Word for PIN Entry
News & Analysis  
11/11/2014   Post a comment
The Cartes Secure Connexions exhibition had its fair share of hardware exhibitors, but authentication is at the core of every transaction, and software solutions are increasingly taking center stage.
Spansion’s Foray Into e.MMC Market
News & Analysis  
11/11/2014   Post a comment
Spansion has rolled out a family of “industrial-grade” embedded MultiMediaCard memory products by using its high-density MLC NAND flash. The company is playing catchup with Micron and Toshiba.
CogniVue, Fraunhofer Debut Supersmall Camera at Electronica
News & Analysis  
11/11/2014   4 comments
Fraunhofer's driver-assist microcamera, exhibited this week at Electronica in Munich, uses CogniVue's image processing technology and a Freescale Semiconductor image cognition processor based on CogniVue's IP.
TSMC Predicts Next Big Thing
News & Analysis  
11/10/2014   5 comments
With MEMS and CMOS on same chip, sourced from a single well-oiled supply chain offering dirt-cheap prices, innovators will create the "next big thing." One-stop shopping at a semiconductor manufacturer is the future, says TSMC.
PowerVR Guns for AMD, Nvidia
News & Analysis  
11/10/2014   11 comments
Imagination Technologies' latest PowerVR Series 7 graphics cores sport a host of new features, including the ability to play in notebooks, consoles, and servers.
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