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Researchers Claim 44x Power Cuts
News & Analysis  
3/30/2015   Post a comment
Researchers at the University of Illinois invented the worlds first on/off transceiver fast enough for commercialization, saving up to $870 million per year in datacenter power bills.
How Will Deep Learning Change SoCs?
News & Analysis  
3/30/2015   Post a comment
Deep learning is changing the way computers see, hear and identify objects -- but will it ever migrate into smartphones or vision SoCs for cars? Has anybody come up with SoCs optimized for neural networks?
Micron, Intel Flash 3D NAND
News & Analysis  
3/26/2015   1 comment
Micron and Intel have co-developed a 3-D flash NAND chip sampling now that is denser than the parts Samsung has been shipping since July.
Bosch Rides Apple to MEMS Dominance
News & Analysis  
3/26/2015   1 comment
How did Bosch achieve a future “MEMS titan” status? Why is STMicroelectronics slipping? Get the lowdown of MEMS Industry status and technology breakdown.
Intel's Xeon Phi to House 72 Cores
News & Analysis  
3/25/2015   11 comments
Intel's Xeon Phi mutiprocessor, with up to 72 cores and integrated Micron Hybrid Memory Cubes, will accelerate both enterprise and supercomputer workloads.
Apple A9 Orders Pivot to TSMC
News & Analysis  
3/23/2015   1 comment
Apple will ramp up production of A9 for its yet-to-be-announced iPhone 6S. Originally, a majority of A9 orders were said to have gone to Samsung, but sources say TSMC snatched Apple A9 orders from Samsung on yield issues.
Apple's ResearchKit: Is Open Source Good for Your and Apple's Health?
News & Analysis  
3/20/2015   Post a comment
ResearchKit has potential for Apple's customers, and for the computing and communications world more generally, but there are also a few concerns.
MediaTek Sees IoT as Its Next Growth Driver
News & Analysis  
3/19/2015   Post a comment
MediaTek, Taiwan’s largest chip designer, says it expects IoT to become its next big growth driver once the smartphone business starts to lose steam.
Patent Filings: Who Made the Cut for Top 50?
News & Analysis  
3/19/2015   5 comments
We often measure the technology prowess – of a nation, a company – by the number of international patents filed and granted. China’s Huawei Technologies was the top applicant for international patents in 2014, according to a WIPO report.
Broadcom v ASICs, Part 2
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3/18/2015   Post a comment
Broadcom announced the first 28nm versions of its StrataDNX chips from its Dune acquisition, driving deeper into competition with OEM ASICs.
Bi-directional RF Doubles Cellular Capacity
News & Analysis  
3/18/2015   16 comments
Full-duplex sending and receiving over the same frequency at the same time is possible, unlike what you learned in engineering school. According to researchers at Columbia University, you just have to cancel out the signal from the much more powerful transmitter at the receiver's antenna.
Industrial IoT Drives Microsemi-Vitesse Merger
News & Analysis  
3/18/2015   Post a comment
Microsemi Corp. will acquire Vitesse Semiconductor Corp. for $389 million to focus on “communications semiconductors.” On horizon is the MIPS vs. ARM conflict as the two companies use two diverging processor cores of their product lines.
Marvell Touts MoChi, FLC in Shanghai
News & Analysis  
3/17/2015   6 comments
The president of Marvell painted broad strokes about its Final-Level Cache memories and a new interconnect technology called MoChi during a keynote in Shanghai. She described them as basic building blocks for the company’s newly proposed scalable SoCs.
SoC Spec Hits Version 1.0
News & Analysis  
3/16/2015   2 comments
The AMD-led Heterogeneous Systems Architecture Foundation has finished its 1.0 spec, turning attention to what SoCs will support it.
Scientists Pursue Super-Fast Material
News & Analysis  
3/16/2015   10 comments
Researchers may have realized an 80-year-old-dream of forming a pure electron crystalline lattice with 200-times the electron mobility of graphene and 1700-times the electron mobility of silicon.
Layoffs Hit 1,600 in Cypress Deal
News & Analysis  
3/13/2015   1 comment
Cypress and Spansion are expected to lay off more than 20% of combined staff or about 1,600 people following their recently approved merger.
Tri-Core Sensor Hub Ups Ante: Sensors Included
News & Analysis  
3/13/2015   1 comment
Invensense claims to have the world's first system-in-package to act not only as a 6-axis inertial sensor, but also as a programmable hub for all the other sensors in a smartphone.
PC Drop & iPhone Rumors Color Intel Forecast
News & Analysis  
3/13/2015   9 comments
Intel’s forecast warning raise the issue of its ability to diversify its business. A recent report that Intel’s LTE modems “getting into iPhones in 2016” stirred some noise, but it’s still a rumor at this point.
One-stop Shop From IC Design to Silicon Tape Out
News & Analysis  
3/12/2015   Post a comment
CEA-Leti has launched the Silicon Impulse IC design competence centre, offering IC design, advanced intellectual property, emulator and test services along with industrial multi-project wafer (MPW) shuttles.
Marvell CEO: The Tinkerer at The Top
News & Analysis  
3/12/2015   10 comments
Marvell CEO has been obsessed with a computer architecture that’s unchanged for decades. Why must its progress depend on more memory and faster CPU? “We are going to fix it for once and all.”
Xilinx Targets Embedded Software Developers with SDSoC
News & Analysis  
3/11/2015   1 comment
Embedded software developers outnumber their hardware counterparts by a factor of 10:1, so a tool that lets them take full advantage of programmable SoCs is extremely significant.
Sigfox, Sequans: Tale of Two French IoT Firms
News & Analysis  
3/11/2015   4 comments
There is an underlying thread in both 5G and IoT: Diversification. Diversified networks, network topologies and network infrastructures are necessary to enable both. Carriers realize that there will be no one-size-fits-all network for either 5G or IoT.
FinFETs Race Toward Silicon
News & Analysis  
3/10/2015   Post a comment
As Cadence announced a new physical-design tool, Synopsys said it has 100 production tape outs in FinFET processes, 90% of the advanced chips made to date.
Intel's 1st Xeon SoC Twists ARM
News & Analysis  
3/9/2015   23 comments
Intel hopes it first Xeon SoC -- the D-1500 -- will be an ARM killer in the micro server market.
Synopsys Opens Up ARC Processor Architecture Online
News & Analysis  
3/9/2015   2 comments
To reach developers in a range of new embedded Internet of Things designs, Synopsys has sponsored the embARC.org web with open source tools for use with its ARC processor.
NXP to Focus on All CMOS Radar Future
News & Analysis  
3/9/2015   9 comments
NXP CEO sees making “big and clunky radars” small is critical for ADAS. NXP has an RF CMOS-based 80GHz radar front-end transmitter chip — a working prototype – in the hands of its lead customers for several months.
2D Material Beats Graphene
News & Analysis  
3/4/2015   2 comments
Black phosphorus is a 2D material with advantages over graphene, including a variable bandgap and other photonics characteristics.
NXP CEO: ‘Security, IoT, Cars’ Drove Freescale Deal
News & Analysis  
3/3/2015   2 comments
NXP CEO spoke with on the overlapping businesses with Freescale, once the merger goes through. Products that don’t belong to NXP’s focus on “security and connectivity with a smarter world” are Freescale’s network processors and NXP’s standard products.
Graphics API Gets Makeover
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3/3/2015   Post a comment
With new proprietary graphics interfaces out from AMD, Apple and Microsoft, Khronos Group is previewing Vulkan as an open follow on to OpenGL.
NXP, Freescale: Bigger Not Better
News & Analysis  
3/2/2015   13 comments
The proposed merger of NXP and Freescale creates a embedded chip vendor that is significantly bigger than most, but not all, its rivals and not substantially different.
Intel Tablet SoCs Pack LTE
News & Analysis  
3/2/2015   14 comments
Intel announced a new family of SoCs and modems for mobile devices under its Atom brand, targeting low to premium markets. The chip giant hopes to win a large share of the mobile space with highly integrated processors and excellent graphics.
Asian Share of Global Fab Capacity May Top 69% by 2019
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3/2/2015   Post a comment
Asia is expected to account for a new record, nearly 70% of the world's fab capacity, by 2019, according to a new report from IC Insights.
Imagination Dons Wearable GPU
News & Analysis  
3/2/2015   1 comment
Imagination Technologies announced a suite of video IP cores for the next generation of graphic displays at Mobile World Congress. Alongside a set of video encoder cores, the UK company also announced a new PowerVR GPU for mobile and wearables.
Freescale Unveils Vision SoC for Accident-Free Cars
News & Analysis  
3/2/2015   Post a comment
Freescale has unveiled an automotive vision system-on-chip. Besides advanced vision algorithms and sensor data fusion features, the new SoC provides protection against external wireless attacks, a much needed feature in the era of “Connected Cars.”
NXP, Freescale Plan Mega Merger
News & Analysis  
3/1/2015   23 comments
NXP bid to acquire Freescale to create a $10 billion embedded chip giant that would be a world leader in automotive chips and microcontrollers.
Samsung Phones Pack 14nm SoC
News & Analysis  
3/1/2015   3 comments
Samsung will pack a handful of new technologies -- including a 14nm Exynos applications processor -- into its new Galaxy S6 and S6 Edge smartphones announced here. The handsets also sport a new fast-charging battery, novel memory stack, simplified user interface, and advanced camera features.
Freescale, Cisco, Ciena Give Nod to FD-SOI
News & Analysis  
3/1/2015   43 comments
Freescale, Cisco and Ciena have defied the general skepticism of fully-depleted silicon-on-insulator by revealing their own experience with the process technology, creating expectations that more companies might follow.
MediaTek Sails Uncharted Waters With CrossMount
News & Analysis  
3/1/2015   Post a comment
MediaTek has revealed a new cross-device sharing technology called “CrossMount.” With the proposal of a new industry standard that’s royalty-free and open to all comers, MediaTek sails uncharted waters.
MediaTek Wrestles ARM A72 into Tablets
News & Analysis  
3/1/2015   Post a comment
Taiwanese chipmaker MediaTek announced a new tablet SoC based on ARM’s new Cortex-A72 processor. The chipset is designed to be a "workhorse" for media and enterprise.
Graphene Polymer Speeds Electron Transport
News & Analysis  
2/27/2015   Post a comment
Depositing conducting polymers on graphene gives then highly desirable electrical properties, flexibility and strength for future flexible electronics, organic solar cells, protective coatings and other practical applications.
Benchmark Stresses Big Chips
News & Analysis  
2/26/2015   6 comments
The EEMBC consortium rolled out CoreMark-Pro, a benchmark suite for 32- and 64-bit chips, an extension of its six-year old test for MCUs and CPUs.
Mesh Comes to Bluetooth
News & Analysis  
2/25/2015   6 comments
Expect Bluetooth to add mesh networking technology later this year. The Bluetooth SIG’s fast-track effort is a testament to the groundswell of interest in the technology. But it can also be viewed as a pre-emptive strike against the Thread Group.
Flex Logix Introduces FPGA IP Cores for SoC Designs
News & Analysis  
2/25/2015   1 comment
The EFLX FPGA fabric allows things like I/O protocols, encryption algorithms, radio filters, and other "fixed" functions to be upgraded on-the-fly.
5 Trends to Watch at Mobile World Congress
News & Analysis  
2/25/2015   4 comments
Anything and everything in the world that demands wireless connectivity – cars, phones, homes, retail transactions, factories, buildings, wearables, public transportation systems, you name it – is descending upon the Mobile World Congress next week in Barcelona.
Xilinx Unveils 16nm Ultrascale+ FPGAs, MPSoCs & 3D ICs
News & Analysis  
2/24/2015   1 comment
Applications for Xilinx's new UltraScale+ FPGAs, MPSoCs, and 3D ICs include LTE Advanced and early 5G wireless, terabit wired communications, automotive ADAS, and industrial IoT.
MediaTek Push into Global LTE Not Likely Until 2016, Analyst Says
News & Analysis  
2/24/2015   Post a comment
With U.S. certification still pending, MediaTek’s ramp in developed markets may take until next year to have some traction, says Credit Suisse analyst.
Silicon Labs' First Salvo in IoT SoCs: Blue Gecko
News & Analysis  
2/24/2015   2 comments
Silicon Labs unveiled its first Bluetooth Low Energy wireless SoC, Blue Gecko. Integrating Silicon Labs’ EFM32 Gecko MCU with 2.4GHz radio, it’s the first in a series of IoT SoCs Silicon Labs has promised to deliver in coming months.
TSMC to Start 10nm in 2017, Closing Gap with Intel
News & Analysis  
2/24/2015   4 comments
TSMC expects to start 10nm production in 2017, when it will have process technology matching that of industry leader Intel Corp.
AMD Describes Notebook Processor
News & Analysis  
2/23/2015   1 comment
AMD’s next-gen notebook processor, Carrizo, packs a south bridge and HEVC decoder in the same space as its previous Kaveri chip, it said at ISSCC.
Marvell Shakes Up SoCs, DRAMs
News & Analysis  
2/23/2015   10 comments
Marvell CEO Sehat Sutardja announced a new SoC interconnect and virtual-memory initiatives aimed to make next-generation chips and systems cheaper.
Page 1 / 2   >   >>


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Max Maxfield

March 28 is Arduino Day -- Break Out the Party Hats!
Max Maxfield
7 comments
Well, here's a bit of a conundrum. I just received an email from my chum David Ashton who hails from the "Unfinished Continent" Down Under. David's message was short and sweet; all he said ...

Bernard Cole

A Book For All Reasons
Bernard Cole
1 Comment
Robert Oshana's recent book "Software Engineering for Embedded Systems (Newnes/Elsevier)," written and edited with Mark Kraeling, is a 'book for all reasons.' At almost 1,200 pages, it ...

Martin Rowe

Leonard Nimoy, We'll Miss you
Martin Rowe
5 comments
Like many of you, I was saddened to hear the news of Leonard Nimoy's death. His Star Trek character Mr. Spock was an inspiration to many of us who entered technical fields.

Rich Quinnell

Making the Grade in Industrial Design
Rich Quinnell
16 comments
As every developer knows, there are the paper specifications for a product design, and then there are the real requirements. The paper specs are dry, bland, and rigidly numeric, making ...

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