Micron, Intel Flash 3D NAND News & Analysis 3/26/2015 1 comment Micron and Intel have co-developed a 3-D flash NAND chip sampling now that is denser than the parts Samsung has been shipping since July.
Intel's Xeon Phi to House 72 Cores News & Analysis 3/25/2015 11 comments Intel's Xeon Phi mutiprocessor, with up to 72 cores and integrated Micron Hybrid Memory Cubes, will accelerate both enterprise and supercomputer workloads.
Apple A9 Orders Pivot to TSMC News & Analysis 3/23/2015 1 comment Apple will ramp up production of A9 for its yet-to-be-announced iPhone 6S. Originally, a majority of A9 orders were said to have gone to Samsung, but sources say TSMC snatched Apple A9 orders from Samsung on yield issues.
Patent Filings: Who Made the Cut for Top 50? News & Analysis 3/19/2015 5 comments We often measure the technology prowess – of a nation, a company – by the number of international patents filed and granted. China’s Huawei Technologies was the top applicant for international patents in 2014, according to a WIPO report.
Broadcom v ASICs, Part 2 News & Analysis 3/18/2015 Post a comment Broadcom announced the first 28nm versions of its StrataDNX chips from its Dune acquisition, driving deeper into competition with OEM ASICs.
Bi-directional RF Doubles Cellular Capacity News & Analysis 3/18/2015 16 comments Full-duplex sending and receiving over the same frequency at the same time is possible, unlike what you learned in engineering school. According to researchers at Columbia University, you just have to cancel out the signal from the much more powerful transmitter at the receiver's antenna.
Industrial IoT Drives Microsemi-Vitesse Merger News & Analysis 3/18/2015 Post a comment Microsemi Corp. will acquire Vitesse Semiconductor Corp. for $389 million to focus on “communications semiconductors.” On horizon is the MIPS vs. ARM conflict as the two companies use two diverging processor cores of their product lines.
Marvell Touts MoChi, FLC in Shanghai News & Analysis 3/17/2015 6 comments The president of Marvell painted broad strokes about its Final-Level Cache memories and a new interconnect technology called MoChi during a keynote in Shanghai. She described them as basic building blocks for the company’s newly proposed scalable SoCs.
SoC Spec Hits Version 1.0 News & Analysis 3/16/2015 2 comments The AMD-led Heterogeneous Systems Architecture Foundation has finished its 1.0 spec, turning attention to what SoCs will support it.
Scientists Pursue Super-Fast Material News & Analysis 3/16/2015 10 comments Researchers may have realized an 80-year-old-dream of forming a pure electron crystalline lattice with 200-times the electron mobility of graphene and 1700-times the electron mobility of silicon.
Layoffs Hit 1,600 in Cypress Deal News & Analysis 3/13/2015 1 comment Cypress and Spansion are expected to lay off more than 20% of combined staff or about 1,600 people following their recently approved merger.
PC Drop & iPhone Rumors Color Intel Forecast News & Analysis 3/13/2015 9 comments Intel’s forecast warning raise the issue of its ability to diversify its business. A recent report that Intel’s LTE modems “getting into iPhones in 2016” stirred some noise, but it’s still a rumor at this point.
Marvell CEO: The Tinkerer at The Top News & Analysis 3/12/2015 10 comments Marvell CEO has been obsessed with a computer architecture that’s unchanged for decades. Why must its progress depend on more memory and faster CPU? “We are going to fix it for once and all.”
Sigfox, Sequans: Tale of Two French IoT Firms News & Analysis 3/11/2015 4 comments There is an underlying thread in both 5G and IoT: Diversification. Diversified networks, network topologies and network infrastructures are necessary to enable both. Carriers realize that there will be no one-size-fits-all network for either 5G or IoT.
FinFETs Race Toward Silicon News & Analysis 3/10/2015 Post a comment As Cadence announced a new physical-design tool, Synopsys said it has 100 production tape outs in FinFET processes, 90% of the advanced chips made to date.
NXP to Focus on All CMOS Radar Future News & Analysis 3/9/2015 9 comments NXP CEO sees making “big and clunky radars” small is critical for ADAS. NXP has an RF CMOS-based 80GHz radar front-end transmitter chip — a working prototype – in the hands of its lead customers for several months.
2D Material Beats Graphene News & Analysis 3/4/2015 2 comments Black phosphorus is a 2D material with advantages over graphene, including a variable bandgap and other photonics characteristics.
NXP CEO: ‘Security, IoT, Cars’ Drove Freescale Deal News & Analysis 3/3/2015 2 comments NXP CEO spoke with on the overlapping businesses with Freescale, once the merger goes through. Products that don’t belong to NXP’s focus on “security and connectivity with a smarter world” are Freescale’s network processors and NXP’s standard products.
Graphics API Gets Makeover News & Analysis 3/3/2015 Post a comment With new proprietary graphics interfaces out from AMD, Apple and Microsoft, Khronos Group is previewing Vulkan as an open follow on to OpenGL.
NXP, Freescale: Bigger Not Better News & Analysis 3/2/2015 13 comments The proposed merger of NXP and Freescale creates a embedded chip vendor that is significantly bigger than most, but not all, its rivals and not substantially different.
Intel Tablet SoCs Pack LTE News & Analysis 3/2/2015 14 comments Intel announced a new family of SoCs and modems for mobile devices under its Atom brand, targeting low to premium markets. The chip giant hopes to win a large share of the mobile space with highly integrated processors and excellent graphics.
Imagination Dons Wearable GPU News & Analysis 3/2/2015 1 comment Imagination Technologies announced a suite of video IP cores for the next generation of graphic displays at Mobile World Congress. Alongside a set of video encoder cores, the UK company also announced a new PowerVR GPU for mobile and wearables.
Freescale Unveils Vision SoC for Accident-Free Cars News & Analysis 3/2/2015 Post a comment Freescale has unveiled an automotive vision system-on-chip. Besides advanced vision algorithms and sensor data fusion features, the new SoC provides protection against external wireless attacks, a much needed feature in the era of “Connected Cars.”
NXP, Freescale Plan Mega Merger News & Analysis 3/1/2015 23 comments NXP bid to acquire Freescale to create a $10 billion embedded chip giant that would be a world leader in automotive chips and microcontrollers.
Samsung Phones Pack 14nm SoC News & Analysis 3/1/2015 3 comments Samsung will pack a handful of new technologies -- including a 14nm Exynos applications processor -- into its new Galaxy S6 and S6 Edge smartphones announced here. The handsets also sport a new fast-charging battery, novel memory stack, simplified user interface, and advanced camera features.
Freescale, Cisco, Ciena Give Nod to FD-SOI News & Analysis 3/1/2015 39 comments Freescale, Cisco and Ciena have defied the general skepticism of fully-depleted silicon-on-insulator by revealing their own experience with the process technology, creating expectations that more companies might follow.
Graphene Polymer Speeds Electron Transport News & Analysis 2/27/2015 Post a comment Depositing conducting polymers on graphene gives then highly desirable electrical properties, flexibility and strength for future flexible electronics, organic solar cells, protective coatings and other practical applications.
Benchmark Stresses Big Chips News & Analysis 2/26/2015 6 comments The EEMBC consortium rolled out CoreMark-Pro, a benchmark suite for 32- and 64-bit chips, an extension of its six-year old test for MCUs and CPUs.
Mesh Comes to Bluetooth News & Analysis 2/25/2015 6 comments Expect Bluetooth to add mesh networking technology later this year. The Bluetooth SIG’s fast-track effort is a testament to the groundswell of interest in the technology. But it can also be viewed as a pre-emptive strike against the Thread Group.
5 Trends to Watch at Mobile World Congress News & Analysis 2/25/2015 4 comments Anything and everything in the world that demands wireless connectivity – cars, phones, homes, retail transactions, factories, buildings, wearables, public transportation systems, you name it – is descending upon the Mobile World Congress next week in Barcelona.
Silicon Labs' First Salvo in IoT SoCs: Blue Gecko News & Analysis 2/24/2015 2 comments Silicon Labs unveiled its first Bluetooth Low Energy wireless SoC, Blue Gecko. Integrating Silicon Labs’ EFM32 Gecko MCU with 2.4GHz radio, it’s the first in a series of IoT SoCs Silicon Labs has promised to deliver in coming months.
AMD Describes Notebook Processor News & Analysis 2/23/2015 1 comment AMD’s next-gen notebook processor, Carrizo, packs a south bridge and HEVC decoder in the same space as its previous Kaveri chip, it said at ISSCC.
Marvell Shakes Up SoCs, DRAMs News & Analysis 2/23/2015 10 comments Marvell CEO Sehat Sutardja announced a new SoC interconnect and virtual-memory initiatives aimed to make next-generation chips and systems cheaper.
Parrot Spins Positive on FAA Drone Draft News & Analysis 2/23/2015 2 comments We talked with Yannick Levy, vice president of Parrot (Paris), to find out how the FAA’s draft drone rules are viewed in Europe, and where the focus of the drone debate will move next.
Chip Packs 100, 64-bit ARM Cores News & Analysis 2/23/2015 4 comments EZchip announced it will sample next year a 28nm network processor using 100 ARM 64-bit A53 cores, gunning for sockets with Broadcom and Cavium.
A Book For All Reasons Bernard Cole1 Comment Robert Oshana's recent book "Software Engineering for Embedded Systems (Newnes/Elsevier)," written and edited with Mark Kraeling, is a 'book for all reasons.' At almost 1,200 pages, it ...