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Lattice Deal: Harbinger of FPGA & ASSP Union
News & Analysis  
5/1/2015   1 comment
Lattice CEO, after its acquisition of Silicon Image in March, believes the marriage of FPGA company to an ASSP firm is a match made in heaven. He said, “That’s why Intel wants Altera. It’s obvious.” But is it?
Effective Code Coverage Comes to Multicore Software
News & Analysis  
5/1/2015   Post a comment
New code coverage tool gives greater visibility into software running on a multicore design.
NXP CEO on China, Apple Pay, IoT & V2V
News & Analysis  
4/30/2015   1 comment
In unveiling its Q1 earnings, NXP CEO talks about the pending RF power business sales, its China strategy, a new mobile payment market that Apple Play in China may trigger, and its IoT strategy.
MediaTek Pins 2nd Half Hopes on Octacore
News & Analysis  
4/30/2015   Post a comment
MediaTek, the world’s third-largest chip designer, expects new octacore products coming out in the second half of this year to help lift sales out of the doldrums.
Living Computers Ultimate Goal
News & Analysis  
4/30/2015   Post a comment
Georgia Tech has created arrays of sensor pixels for hybrid semiconductor/living cell sensor/actuators, paving the way to living computers.
UMC to Skip 20nm, Gun for 14nm FinFET
News & Analysis  
4/29/2015   3 comments
UMC, which has once again become the world’s second-largest chip foundry, will skip the 20 nm technology node as it aims to have 14nm FinFET tapeouts available for customers by Q4 this year.
How the 3 Cs Drive IC Consumption
News & Analysis  
4/29/2015   1 comment
The communications, computers and consumer electronics sectors are set to be responsible for more than 70 percent of IC sales in every geographic region -- Americas, Europe, Japan, and Asia-Pacific -- in 2015, according to market research firm IC Insights.
Topic Teardown: Connected Cars' Pros & Cons
Teardown  
4/28/2015   11 comments
We illustrate the benefits of connected cars. We analyze the driving force behind the connected car. We will scout security measures necessary inside cars in order to make connected cars less vulnerable to external malicious attacks.
High-End PCB Design Made Affordable
News & Analysis  
4/28/2015   5 comments
Mentor's new PADS family targets independent engineers with lower cost and more powerful printed circuit board design capabilities.
EUV Deal Raises Questions
News & Analysis  
4/24/2015   8 comments
ASML announced it struck a deal to sell 15 EUV systems to an existing U.S. customer, once again raising hopes about the readiness of the key technology for making leading-edge chips.
Freescale Reveals NXP Mega Merger Details
News & Analysis  
4/24/2015   9 comments
Five companies, aside from NXP, were in talks with Freescale, and CEO Gregg Lowe will be leaving post merger. Freescale reveals details of the NXP merger during its quarterly results call.
QCOM Seeks Options Beyond Apple, Samsung
News & Analysis  
4/23/2015   3 comments
Qualcomm’s recent earnings reports suggest significant vulnerabilities. Qualcomm is heavily dependent on a single market segment (smartphones), while its revenues are susceptible to the whims of the two top-tier smartphone vendors – Apple and Samsung.
Elvis Sees All in Russia
News & Analysis  
4/23/2015   17 comments
A Russian company claims it has the first Russian designed smart chip. The video intelligent processor (VIP-1) is sold in surveillance systems in Russia, but may be sold as a bare-chip overseas.
Smartwatch Uptick in Mobile Slump
News & Analysis  
4/23/2015   3 comments
Smartwatches could grow to sales of 400 million units a year by 2019 when smartphone and tablet sales slump to single-digit levels, said a market watcher.
Cadence Tensilica Fusion DSP Core Targets IoT, Wearables
News & Analysis  
4/22/2015   Post a comment
Tensilica Fusion is a configurable and scalable DSP that is ideal for applications requiring specialized computation, ultra-low power consumption, and the smallest possible footprint.
EDA Tool Speeds FinFET Design
News & Analysis  
4/22/2015   Post a comment
Mentor Graphics new Calibre xACT tool extracts parasitic capacitance, resistance and inductance quickly and accurately.
Intel's 10nm Secrets Predicted
News & Analysis  
4/21/2015   11 comments
Leapfrogging competitors to lower power chips, Intel will use quantum well FETs in a 10nm process next year using germanium and InGaAs, predicted a semiconductor analyst.
Samsung Busts TSMC's 'Monopoly,' Analysts Say
News & Analysis  
4/21/2015   2 comments
Samsung has broken the monopoly in leading-edge foundry services recently held by Taiwan Semiconductor Manufacturing Co. (TSMC), according to analysts who cover the chipmakers.
WSTS Marks America Up for 2015 Boom
News & Analysis  
4/21/2015   Post a comment
The market for semiconductors in the Americas region will grow by 15 percent in 2015, according to a revised estimate from the World Semiconductor Trade Statistics (WSTS) organization.
Smartwatches to Outpace Trackers
News & Analysis  
4/21/2015   Post a comment
Smartwatch ownership is on the rise and will likely surpass activity trackers, according to market researchers. A report from The NDP Group projected that 2016 activity tracker ownership will have peaked at 32 million in 2016 while smartwatch ownership will hit 9%.
TI Obsoletes FPGA
News & Analysis  
4/21/2015   56 comments
Texas Instruments is out to kill the FPGA with a nine processor chip that can downsize avionics, military and medical applications to portable size -- from backpack radars to portable MRIs.
Athena Security IPs Designed to Mend Holes in SoCs
News & Analysis  
4/21/2015   6 comments
We see rapidly growing needs for protecting connected systems by using security chips with crypto keys inside. But how do we know if security chips themselves (designed into such connected systems) aren’t leaking key information?
MINI Giving Drivers a Peek at 'Augmented Reality'
News & Analysis  
4/19/2015   8 comments
Although most drivers have yet to embrace the idea of head-up displays on windshields, MINI is leapfrogging to the next phase of futuristic motoring, with its introduction this week of AR eyewear – powered by Qualcomm
Moore's Law: Dead or Alive
News & Analysis  
4/17/2015   22 comments
Moore's Law is still alive and kicking after 50 years, but here are the technologies that are busting and boosting it in the 21st century.
'Connected Home' Key to Intel’s Lantiq Deal
News & Analysis  
4/17/2015   Post a comment
Intel has formed a freshly minted “Connected Home Division,” which will become a home for Lantiq’s employees and those who are currently working at Intel’s Service Provider Division.
TSMC Cuts Capex by $1 Billion
News & Analysis  
4/16/2015   4 comments
Taiwan Semiconductor Manufacturing Co. (TSMC) is cutting its planned capital expenditure for this year by $1 billion, citing improvements in capital efficiency and a faster-than-expected migration to its leading-edge 16nm process technology.
Odds of Success of Mie Fujitsu, Japan’s Pure-Play Foundry
News & Analysis  
4/16/2015   2 comments
Mie Fujitsu Semiconductor is a foundry born from Fujitsu’s lack of any better options. Its genesis raises questions about the odds of Mie Fujitsu’s survival. We asked Mie Fujitsu President hard questions.
Samsung Describes Road to 14nm
News & Analysis  
4/16/2015   2 comments
A Samsung executive described the company's road to it 14nm FinFET process used for the Exynos chip in its latest smartphones.
Data Centers Drive SDN, Bandwidth
News & Analysis  
4/16/2015   2 comments
A Microsoft engineer described two new networking initiatives Web-scale engineers are driving to lower costs and get more bandwidth.
Imagination Tunes in Wi-Fi, BT
News & Analysis  
4/15/2015   Post a comment
Imagination Technologies hopes to leverage the communications experience of its Ensigma division to bring low power wireless connection to Internet of Things and wearable devices. Imagination hopes its built-for-IoT IP will prove valuable in a market that currently uses dumbed-down mobile chips
Intel Does Balancing Act
News & Analysis  
4/15/2015   Post a comment
In its Q1 results, predictably Intel's PC business is down but data center, IoT, and nonvolatile memory made up for PC loses. Surprisingly capex goes down.
Worldwide Semi Revenue Grew 7.9% in 2014, According to Gartner
News & Analysis  
4/15/2015   Post a comment
Booming DRAM market sees revenue increase 32 percent during 2014.
Is Head-Up Display Future ADAS Screen?
News & Analysis  
4/15/2015   5 comments
Texas Instruments, rolling out a new automotive-qualified DLP chipset, is banking on head-up display, predicting it to become “the ADAS display of the future.” But can DLP redefine the HUD market?
Moore’s Law Hits Middle Age
News & Analysis  
4/14/2015   6 comments
Top technologists from Intel, IBM and TSMC who helped drive Moore’s Law forward share their stories and opinions on its 50th anniversary.
Graphene Spintronics Beats All
News & Analysis  
4/14/2015   7 comments
Chalmers University of Technology claims graphene's high-electron mobility enables longer wires without repeaters for future spintronics that encode information on the spin of individual electrons instead of their charge like today.
3D Testing Standardized by SRC
News & Analysis  
4/14/2015   Post a comment
The Semiconductor Research Corp. has standardized Design-for-Test method for 3D chips that has fast throughput by using a single probe to touch several TSV microbumps at the same time.
Intel, Samsung Up, Qualcomm, Toshiba Down in Chip Vendor Ranking
News & Analysis  
4/10/2015   Post a comment
Gartner Inc. has produced an updated top-ten chip vendor ranking for 2014 based on companies' final financial results.
Taiwan Chipmakers Prepare to Transport Water as Drought Worsens
News & Analysis  
4/10/2015   4 comments
Taiwan Semiconductor Manufacturing Co. (TSMC), the world's largest chip foundry, and other chipmakers on the island say they are prepared to ship water supplies to their fabs here if drought conditions worsen.
Parallel Processing Spawns Non-MPEG Codec
News & Analysis  
4/10/2015   14 comments
V-Nova will next week at NAB demonstrate a new video codec called Perseus. It's designed to do hierarchical and scalable video encoding by leveraging massive parallel processing, while sidestepping the complexity of block-based compression algorithms.
MEMS Startup Selects MIPS for Sensor Hubs
News & Analysis  
4/10/2015   Post a comment
A South Korean startup has licensed a MIPS Warrior M-class CPU core from Imagination Technologies Group plc for use in sensor hubs it is developing to address IoT, wearables and automotive applications.
Intel, Altera End Acquisition Talks
News & Analysis  
4/10/2015   6 comments
A rumored deal between Intel and FPGA maker Altera is now dead, following reports of a price disagreement.
Intel's 'Plans' for Atom x3 in IoT/Wearables, Bargain Smartphones
News & Analysis  
4/9/2015   2 comments
Intel's Developer Forum in Shenzhen kicked off a major effort to woo Chinese firms and developers to Atom for wearables, mobiles and IoT.
Bell Labs Opens New Doors
News & Analysis  
4/8/2015   5 comments
Bell Labs celebrates is forward looking research at the unveiling of the Nobel Laureate Garden. The president Marcus Weldon's look into its future.
TSMC Outlines 16nm, 10nm Plans
News & Analysis  
4/8/2015   2 comments
TSMC announced plans to roll out updated low-power versions of existing chips and announced its roadmap for smaller process nodes. The company will begin volume production of its 16nm FinFet+ in the middle of this year while breaking ground on 10nm development.
European Chip Market Turns 'Schizophrenic'
News & Analysis  
4/8/2015   Post a comment
Euro-dollar exchange rates affected European chip market figures significantly in February 2015 with the three-month average of European chip market showing growth when interpreted in euros and showing a decline in dollar terms.
Atmel Bids for Low-Power MCU Leadership
News & Analysis  
4/7/2015   Post a comment
Atmel is targeting its SAM21 MCUs at the needs of Internet of Things developers by providing fine-grained feature-by-feature power management.
Sony Licenses Bonding Technology from Ziptronix
News & Analysis  
4/2/2015   Post a comment
Ziptronix Inc., a developer and provider of low-temperature direct bonding interconnect (DBI) technology for 3D integration, has announced a patent licensing agreement with Sony Corp. for the application of its technology to image sensors.
CoolCube 3D Goes Monolithic
News & Analysis  
4/2/2015   4 comments
The University of Grenoble Alpes (France) has developed their CoolCube 3D chips using a monolithic method.
10 Apple Acquisitions: What Do They Mean?
News & Analysis  
4/2/2015   Post a comment
Apple has a habit of buying tech companies. Let's look at its most recent acquisitions and in what ways each might enhance the company's future.
Medical Chip Market on 12% CAGR
News & Analysis  
3/31/2015   Post a comment
Moves to smaller and portable medical equipment for use away from hospitals is driving up sales of ICs and sensors in the medical semiconductor market, according to market research firm IC Insights.
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Why Connect a Car?
May 11, 1pm EDT Monday
Overview: Battle-hardened veterans of the electronics industry have heard of the “connected car” so often that they assume it’s a done deal. But do we really know what it takes to get a car connected and what its future entails? Join EE Times editor Junko Yoshida as she moderates a panel of movers and shakers in the connected car business. Executives from Cisco, Siemens and NXP will share ideas, plans and hopes for connected cars and their future. After the first 30 minutes of the radio show, our listeners will have the opportunity to ask questions via live online chat.
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