Sony May Buy Renesas Fab News & Analysis 12/4/2013 7 comments Sony is considering the purchase of a chip fab from Japanese semiconductor manufacturer Renesas, with plans to expand CMOS image sensor production at a cost of $96 million. Sony already has around 30 percent of the CMOS image sensor market.
Stanene May Be Better Than Graphene News & Analysis 12/3/2013 12 comments Move over graphene. A new material called stanene combines the best properties of a room temperature superconductor with the ease of fabrication of metal deposition with tin instead of copper.
China Investigates Qualcomm News & Analysis 11/25/2013 19 comments Qualcomm Incorporated Monday disclosed that China's National Development and Reform Commission, which regulates prices, has begun investigating Qualcomm regarding compliance with the Chinese Anti-Monopoly Law.
Spansion Exec Reassures Fujitsu Customers News & Analysis 11/25/2013 9 comments The most tangible technology advances, after Spansion acquired Fujitsu Semiconductor's MCU/analog business, will come from the adoption of Spansion’s proprietary eCT technology in embedded MCUs -- to be released in 2015.
Sensor Showcase From Japan With Love Slideshow 11/22/2013 18 comments At Embedded Technology 2013, vendors were talking up M2M, sensors, energy harvesting ICs, battery-less wireless connectivity, HTML browsers, and big data -- all thrown together as a solution.
Omron: Never Underestimate Blood Pressure News & Analysis 11/21/2013 9 comments To win the next-generation smart healthcare battle, Omron executive says it's important to know the types of data your technology must "sense, track, accumulate, and send" to doctors who are treating patients' lifestyle illnesses.
Intel to Customize High-End Processors News & Analysis 11/20/2013 13 comments Intel's roadmap for its future high-end processors promises greater levels of integration as well as customized models of its Xeon and Xeon Phi processors with in-package memory, high-speed switches, optical fabrics, next-generation storage, and 3D stacked memory.
Sony PS4 Goes Monolithic, Says Chipworks Slideshow 11/15/2013 17 comments The PS4 uses a single die CPU/GPU and one main shared 8GB memory array. We therefore expected to see a single die under the main processor package, with no separate DRAM die in package, and no embedded DRAM on the main die. This is indeed what we have found. A huge monolithic die of 20 x 20mm.
Marvell Does Comms for Sony PS4 News & Analysis 11/15/2013 7 comments Marvell supplied a comms ASIC and the WiFi controller in the Sony PS4, according to a teardown by Chipworks. Two of the companies chips in the new game console were among the few surprising finds of the teardown.
III-V FinFET Fabbed on Silicon News & Analysis 11/7/2013 6 comments Imec has succeeded in fabricating the world's first III-V FinFET to be monolithically integrated on a 300 millimeter silicon wafer, opening the door to extending the semiconductor roadmap at seven-nanometer and beyond.
EE Times Community Weighs In on Toyota Case News & Analysis 11/7/2013 27 comments EE Times readers took Toyota’s unintended acceleration case to heart. After all, Toyota’s failures, pointed out by the expert witnesses, aren’t just Toyota’s problems. Its failures are relevant to all the hard choices engineers make.