Biodegradable Electronics Debut News & Analysis 7/2/2015 1 comment Single crystal silicon transistors operating in the same microwave frequency ranges as modern electronics can be fabricated on biodegradable cellulose nanofibrillated fiber (CNF) substrates that biodegrade in landfills--in the presence if water and fungi--within a few weeks.
Intel President, Execs Step Down News & Analysis 7/2/2015 2 comments Intel President Renée James is among several top executives who announced plans to resign from the chip giant. Three other executives from various divisions will also leave the company.
IBM-GlobalFoundries Deal Finalized News & Analysis 7/1/2015 3 comments Following final approval by U.S. regulators, IBM closed the sale of its chip manufacturing operations to GlobalFoundries. IBM will pay $1.5 billion to the world’s second largest chip foundry.
Talking Sheets, Thinking Shorts News & Analysis 6/30/2015 2 comments The tagging of garments via RFID-based labels has been commonplace for more than a decade. But what if electronic components could be threaded into the very fabric of clothes and even survive the washing machine?
Advanced Packaging to Boost Photolithography Market, Says Yole News & Analysis 6/30/2015 Post a comment "Growing photolithography equipment markets in advanced packaging, MEMS and LEDs are attracting new players; but they have to navigate complex roadmaps", hints market research firm in its new report "Photolithography Equipment & Materials for Advanced Packaging, MEMS and LED Applications".
Wafer-Level Packaging Not Enough, say OSATS News & Analysis 6/29/2015 1 comment Large format fan-out packaging was the focus of discussion at IC packaging and semiconductor processing experts gathered at European's largest for this year's SEMI Packaging Tech Seminar.
Leti’s FD-SOI Lesson: Build Ecosystems News & Analysis 6/26/2015 Post a comment Annual open-house events hosted by CEA-Leti and IMEC collided this week, exposing the growing rivalry between the two laboratories. As they court the same partners in the electronics industry, at stake are big contracts and government grants.
Woz Wows with Humanitarianism News & Analysis 6/25/2015 12 comments Steve Wozniak single-handedly designed the Apple-I and after forming Apple with Steve Jobs also designed the Apple-II personal computer (PC), although Jobs oversaw the design of the case for the Apple-II.
Low Temperature 2D MoS2 Now at Wafer-Level News & Analysis 6/24/2015 Post a comment Researchers at the University of Southampton's Zepler Institute have fabricated and characterised large-area 2D films of molybdenum disulphide (MoS2), an N-type semiconductor, at room temperature using a process which is scalable to any size wafer.
Secure IoT MCUs Drive Freescale-NXP News & Analysis 6/24/2015 Post a comment The future of Freescale Semiconductor and NXP is in connecting and securing the Internet of Things, with a major focus on automotive. The CEOs of both companies outlined their collective vision for the merger, which will likely close in November.
GlobalFoundries’ FD-SOI Revolution News & Analysis 6/23/2015 7 comments Confirming the imminent announcement of the company’s big FD-SOI plan, GlobalFoundries came to Grenoble to discuss its 22nm FD-SOI process scheduled to be qualified by early 2016.
PCIe 16G May Take Until 2017 News & Analysis 6/23/2015 1 comment The PCI Express 4.0 standard, aka Gen 4, may not be complete until 2017, but Cadence and Synopsys will announce PHY and controller blocks for it this week.
Where's Atmel in IoT Race? News & Analysis 6/23/2015 3 comments How does Atmel stack up in IoT? Does it really beat "other companies" as Atmel seems to imply? By breaking its competition in two, Atmel’s senior vice president Reza Kazerounian elaborated Atmel’s place in IoT.
China's SMIC, Q'comm in 14nm Deal News & Analysis 6/23/2015 3 comments Semiconductor Manufacturing International Corp. formed a joint venture with Huawei, Qualcomm and Imec to develop a homegrown 14nm node ready for mass production by 2020.
'Smallest SoC for IoT' Adds Memory News & Analysis 6/23/2015 9 comments Freescale's new i.MX 6D SoC is called a Single Chip System Module, (SCM) because it also has a 1-gigaByte Micron low-power double data rate chip stacked on top of three Freescale die for its dual ARM Cortex-A9 cores, power management chip and 16 megaByte of serial peripheral interface NOR flash nonvolatile memory.
AMD Denies Mulling Breakup News & Analysis 6/22/2015 Post a comment Company denies report that it hired a consulting firm to help it consider options for breaking up the company or spinning off part of its business.
Freescale Adds Comms to IoT MCUs News & Analysis 6/22/2015 1 comment Freescale announced a new set of microcontrollers with integrated communications as part of its Kinetis family. The multi-protocol chips are designed for home automation and industrial control devices in the Internet of Things
Freescale i.MX 7 Finally Here News & Analysis 6/22/2015 3 comments Freescale's latest application processor, the i.MX 7 comes with one or two ARM Cortex-A7 microprocessors as well as one Cortex-M4 micro controller resulting in a unique heterogeneous architecture that consumes as little as 250 microAmps in its Low Power State Retention mode (LPSR).
Wearables, Home Devices Likely to Lead IoT Growth News & Analysis 6/12/2015 1 comment Wearables and home devices are likely to lead growth in the IoT business during the rest of this decade, according to semiconductor companies and industry analysts at the Computex Taipei show that wrapped up last week.
Xiaomi 1, Qualcomm 0 News & Analysis 6/11/2015 4 comments The shift of momentum in smartphone market couldn’t have been more explicit: Qualcomm named its former executive as the new China chairman, while Xiaomi announced it hired Qualcomm’s China chief as its new senior vice president.
Full-Duplex Comm Almost Here News & Analysis 6/11/2015 4 comments Kumu Networks (Sunnyvale, Calif.) offers full-duplex operation for traditional wireless networks with add-on modules that allow the use of same frequency at same time for transmit and receive thus doubling bandwidth.
FD-SOI Development as a Service News & Analysis 6/10/2015 3 comments CEA-Leti announced its partners for its Silicon Impulse FD-SOI development program, with the goal to broaden the use of FD-SOI for low-power applications.
Synopsys IP Speeds Automotive SoC Design News & Analysis 6/10/2015 Post a comment Targeting safety-critical IP for automotive applications, Synopsys widens its offerings. They include Ethernet Audio Video Bridging (AVB), Low-power DDR3 memory, non-volatile memories, data converters and other functional units, all powered by Synopsys ARC microprocessor architecture.
Atmel on the Block News & Analysis 6/9/2015 Post a comment Atmel Corp. is on the block, looking for a potential buyer, Reuters reported Monday. If true, the move feeds further fuel into the M&A frenzy currently affecting the global semiconductor market.
IBM Demos III-V on Silicon News & Analysis 6/9/2015 9 comments IBM has fabricated a variety of nanowire structures from III-V compounds of indium (In), gallium arsenide (GaAs) atop a silicon-on-insulator (SOI) wafer that it claims proves the concept for advancing Moore's Law with smaller devices with increased performance.
Synthesis Engine Boasts 10X RTL Design Productivity News & Analysis 6/8/2015 Post a comment The Cadence Genus Synthesis Solution is the EDA company's next-generation register-transfer level (RTL) synthesis and physical synthesis engine, incorporating a multi-level massively parallel architecture that is claimed to deliver up to 5X faster synthesis turnaround times while scaling linearly beyond 10M instances.
IBM Renting Its EDA Tools News & Analysis 6/7/2015 5 comments Ever since IBM started designing systems over 100 years ago, it has used it own internally developed toolkits, the envy of designers who have to use brand-x electronic design automation (EDA) suites. Now IBM is renting the use of its famous tools online at one-half the price of licensing brand-x tools.
Nanoscale Sensor Breakthrough May Lower Costs News & Analysis 6/5/2015 1 comment University of Buffalo researchers invent universal nanoscale substrate that acts as a "skeleton key" for one of the most popular substance sensor technologies--surface-enhanced Raman spectroscopy (SERS)--potentially enabling inexpensive single-chip versions.
Xiaomi: Behind Closed Doors News & Analysis 6/5/2015 1 comment How Xiaomi, a barely known Chinese company, has burst into the most competitive mobile handset market to become -- in just five years -- the world’s third largest smartphone vendor is the sort of classic underdog story everyone loves.
Intel Unveils Cores and Xeons News & Analysis 6/3/2015 3 comments At Computex 2015 (June 1-7, Taipei, Taiwan) Intel announced five new members of its Xeon E3 family, dubbed v4, as well as 10 new members of its Core family, both with integrated graphics that typically double graphics performance albeit at higher power envelopes.
AMD Unveils Carrizo Power Details News & Analysis 6/2/2015 Post a comment Advanced Micro Devices filled in details about its latest x86 processor, Carrizo, highlighting the chip’s single, scalable architecture and video processing capabilities for the notebook segment. The company divulged a few of its engineering secrets for squeezing out more performance at lower power at a media event last month.
Pixelworks Scores Design Win with Asus News & Analysis 6/2/2015 Post a comment Asus is using MediaTek competitor Pixelworks’ mobile display processor chip to eliminate judder and mobile blur in ZenPad S 8.0. Already designed into other mobile products, Pixelworks' Iris gets its first public shout out from Asus.
ARM, TSMC to Roll 55nm IoT Chips for Smart Homes News & Analysis 6/1/2015 2 comments ARM and Taiwan Semiconductor Manufacturing Co. (TSMC) today (June 1) announced their development of an IoT subsystem for ARM Cortex-M processors that they expect will simplify design of chips used in devices for smart homes and smart cities.
Intel, Altera: Math in Question News & Analysis 6/1/2015 35 comments Analysts said Intel and FPGA vendor Altera will see benefits from their $16.7 billion merger, but question the math and assumptions behind the deal.
Intel to Buy Altera for $16.7B News & Analysis 6/1/2015 11 comments This acquisition opens the door to some very interesting possibilities, such as presenting multiple processor cores and FPGA die in the same package.
Huawei vs. Xiaomi: China in Microcosm News & Analysis 5/29/2015 7 comments Huawei’s technological prowess in telecom and Xiaomi’s agility in China’s consumer electronics market illustrate both companies’ potential and their weaknesses. Understanding the differences offers a glimpse into the future -- where China is guiding the global electronics industry.
Drones are, in essence, flying autonomous vehicles. Pros and cons surrounding drones today might well foreshadow the debate over the development of self-driving cars. In the context of a strongly regulated aviation industry, "self-flying" drones pose a fresh challenge. How safe is it to fly drones in different environments? Should drones be required for visual line of sight – as are piloted airplanes? Join EE Times' Junko Yoshida as she moderates a panel of drone experts.