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CORNAMI's sea-of-cores solution may defuse data explosion
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9/29/2016   Post a comment
1U sea-of-cores server provides equivalent processing capabilities to 40 x 1U rack of traditional servers.
Samsung Calls for New CPU Design
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9/28/2016   5 comments
Samsung is working on a new processor architecture that leverages its dominance in memory, said a corporate strategist.
Allied with Intel, CEA-Leti Shoots for Moon
News & Analysis  
9/27/2016   2 comments
CEA-Leti's CEA calls the new five-year research contract with Intel a "moonshot." Included in the research framework is for the French institute to provide technologies that enable the next-generation communicationo for Internet of Things.
Baidu Releases AI Benchmark
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9/26/2016   2 comments
Calling for 100x faster processors, Baidu released DeepBench, a benchmark for how fast processors train neural networks.
Chip Market to Go Down, says Future Horizons
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9/26/2016   Post a comment
Malcolm Penn, the founder and CEO of Future Horizons Ltd. and usually one of the most bullish of chip market forecasters, thinks 2017 could be a third year of decline for the global semiconductor industry.
Imagination 2.0 Update Ships
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9/26/2016   Post a comment
Imagination Technologies predicts profits this year with streamlined operations under a new CEO and thoughts of new core IP licensing models.
Massive Sensor Fusion for Cars Is HERE
News & Analysis  
9/26/2016   1 comment
HERE’s new live traffic/map offerings are the world’s first services created from real-time sensor data from competing car brands. From technical perspectives, though, bigger issues include: how open the specifications will be for collected sensory data.
TSMC Expands its 3D Menu
News & Analysis  
9/22/2016   14 comments
TSMC showed an expanding array of foundry process technologies, packaging options and applications-specific platforms at an event.
Amazon Echo & How It Resonates
News & Analysis  
9/22/2016   4 comments
Amazon’s Echo-like smart speakers are on the rise. The voice interface is emerging as one of the most natural interface to control IoT devices. Analysts expect the voice interface in home automation hubs, TVs, set-top boxes, HVAC/environmental control hubs and more.
Robo-Car's Safety Challenges DoT
News & Analysis  
9/21/2016   27 comments
The federal policy places self-driving cars directly under the purview of federal regulators. Stripped from the privilege of “self-certifying” their vehicles, carmakers will need “pre-market approval” from the DoT. The key question, however, is testing of AI cars’ safety.
Get Online Help for Memory, I/O Optimization
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9/21/2016   Post a comment
eSilicon is upgrading with the launch of Star Navigator, new additions to the company’s online tool suite, this time focused on memory IP and I/O libraries.
Startup Tips Machine Learning Chip
News & Analysis  
9/21/2016   3 comments
Wave Computing will describe a machine-learning chip at an event showing increasing specialization in microprocessor designs.
Persistent Memory Needs Apps
News & Analysis  
9/20/2016   6 comments
A researcher from Hewlett Packard Enterprise called for apps that use persistent memory on servers although the chips are still more than a year away.
Peratech 'Print' Smart Buttons on Any Surface
News & Analysis  
9/20/2016   2 comments
Peratech, which invented quantum tunneling composites (QTC) materials, is now allowing its clients to print a smart button, which people can push with force, on any surface of any materials – including laminated wood.
Emerging Memories: Ship First, Perfect Later
News & Analysis  
9/20/2016   1 comment
MRAM maker Everspin sees perfection as a barrier to getting traction; Everspin sees putting its technology into production as a way to improve processes and lower costs--the keys to adoption.
ARM Raises Bar for Safety, Determinism
News & Analysis  
9/19/2016   3 comments
ARM is rolling out what the company describes as its “most advanced processor for safety.” The new processor, dubbed Cortex-R52, is aimed at automotive, industrial and healthcare applications that demand functional safety.
Biometrics Upgrade to AirPod-like Earbuds
News & Analysis  
9/15/2016   2 comments
Valencell Inc's PerformTek biometric measurement module adds biometric sensing function to accelerometer-equipped wireless earbuds.
GF Debuts 7nm, Embedded MRAM
News & Analysis  
9/15/2016   18 comments
Globalfoundries described its 7nm FinFET process for 2018 and an embedded MRAM option for its 22nm FD-SOI process.
Linde Starts Specialty Gases R&D in Taiwan
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9/14/2016   Post a comment
Linde Group, one of the world’s largest suppliers of specialty gases for the semiconductor industry, has established what it says will be a world-leading R&D facility in Taiwan.
Processor Cores Feature Improved Security
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9/14/2016   Post a comment
The ARC SEM processor cores from Synopsys provide protections against intrusion and side channel attacks.
FPGA cores offered for TSMC's 40ULP process
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9/14/2016   Post a comment
Flex Logix Technologies Inc. (Mountain View, Calif.) has completed the design of a family of reconfigurable FPGA cores for implementation in TSMC's 40nm ultra-low power manufacturing process.
Transistor Trick Beats Moore
News & Analysis  
9/14/2016   7 comments
Zeno Semiconductor, a Zvi-OrBach startup, claims it has discovered a More-that-Moore architecture that can instantly convert any MOSFET to a high-power bipolar-junction transistor (BJT), or even FinFETs.
Intersil Deal: Renesas' Survival Bid
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9/13/2016   Post a comment
In an exclusive telephone interview with EE Times, Renesas CEO said the Intersil deal won't be the last big M&A for Renesas. Intersil CEO will stay with the new company in a senior management position.
Chip Process War Heats Up
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9/12/2016   Post a comment
Fully-depleted silicon-on-insulator is on the rise but FinFETs are strong and planar will be the big winner, says veteran chip watcher Handel Jones.
SGI Supercomputes Ireland
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9/8/2016   Post a comment
SGI and Irish Centre for High-End Computing (ICHEC) collaborate on the world's most accurate climate modeling aiming to provide accurate weather forecasts.
Apple Heralds Dawn of Dual Lens Camera
News & Analysis  
9/8/2016   1 comment
Apple’s iPhone 7 Plus comes with a dual-lens camera, providing both telephoto-zoom and depth of field features. Corephotonics, who pioneered the computational dual camera for smartphones, is enabling Apple’s competitors to develop similar dual camera smartphones.
Globalfoundries Preps 12nm FDSOI Process
News & Analysis  
9/8/2016   7 comments
Globalfoundries has announced a next-generation FDSOI process, called12FDX, to follow on from the 22FDX process that is nearing production. The new process nominally at 12nm minimum geometry is intended for mobile computing, 5G, artificial intelligence and autonomous vehicles.
IC Insights Trims IoT Chip Market Forecast
News & Analysis  
9/8/2016   1 comment
IC Insights reduced the IoT semiconductor market’s projected compound annual growth rate (CAGR) -- between 2014 and 2019 -- from originally projected 21.1 percent to 19.9 percent.
IBM Bests Intel's HPCs
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9/8/2016   Post a comment
IBM+Nvidia claim to have produced supercomputers in a single rack slot that are faster and cheaper than equivalent Intel-based configurations.
Intel Spins out Security Group
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9/7/2016   Post a comment
Intel will spin out its security group into an independent company renamed McAfee, selling 51% of it to a private equity firm for $3.1 billion.
Apple Debuts Three Custom Chips
News & Analysis  
9/7/2016   16 comments
Apple described three new chips powering its iPhone 7, Apple Watch 2 and a new family of wireless earbuds and headphones.
LTE IoT: Sequans Claims 'Big Lead' over Rivals
News & Analysis  
9/6/2016   3 comments
With the recent ratification of the Cat M1 and Cat NB1 standards, Cellular IoT is getting hot. Sequans claims it’s the first to sample CAT M1/NB1 chips, 9 months ahead of its rivals including Qualcomm, Intel and Altair.
Intel Buys Movidius: Automotive Vision in Play?
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9/6/2016   Post a comment
The Movidius deal is a big win for Intel. Where analysts’ opinions diverge is whether Intel has a long-term ambition to extend Movidius’ technology to autonomous cars, and if Movidius is equally hungry for the automotive market.
TSMC, Renesas Partner in 28nm for Robotic Cars
News & Analysis  
9/5/2016   14 comments
Renesas will combine its Metal-Oxide-Nitride-Oxide-Silicon (MONOS) eFlash technology with TSMC’s 28nm high-K metal gate process to make MCUs for applications such as autonomous vehicle sensor control, coordination of ECUs, fuel-efficient engine management and motor inverter control for EVs.
2016 IC Industry: Who Grabbed What...So Far
News & Analysis  
9/2/2016   11 comments
Among M&A deals thus far in 2016, we find more transactions that are not an outright “whole” company acquisition. As deals get granular, who owns what becomes more of a tangled web. EE Times attempts to untangle it.
iPhone7 Boosts Broadcom Results
News & Analysis  
9/1/2016   1 comment
Broadcom predicted slightly better than expected results, largely due to increasing content in Apple’s iPhone 7.
Renesas, Maxim In Duel for Intersil
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8/31/2016   Post a comment
The courtship of Intersil Corp. is turning into a duel between Japan’s Renesas Electronics and San Jose, Calif.-based Maxim Integrated Products Inc. Intersil may announce a sale to Renesas as early as next week, Reuters reported.
IC Industry M&A: Who's Left to Buy?
News & Analysis  
8/31/2016   4 comments
Only eight months in, 2016 is already looking like another blockbuster year for M&A in the global chip industry. As valuations keep going up, the questions are who’s left to buy and what’s a good buy?
Embeddable FPGA IP Saves Re-Spins in Chip Design
News & Analysis  
8/31/2016   Post a comment
Embeddable FPGA blocks give chip designs the flexibility needed to weather last-minute changes.
Apple Owes $14.5 Billion Back Tax, says Europe
News & Analysis  
8/30/2016   6 comments
The European Commission has ruled that over several years Ireland has granted unjustifiable tax benefits to Apple worth up to €13 billion (about $14.5 billion), which the US computer company must now pay back to the Irish state — plus interest.
ARM Investors Nod to Its Sale to SoftBank
News & Analysis  
8/30/2016   1 comment
Shareholders of ARM overwhelmingly approved its sale to SoftBank on Tuesday. The move officially put an end to the independence of ARM, a wildly successful processor IP core company born 31 years ago in Cambridge, the U.K.
Intel Debuts 14nm+ Processors
News & Analysis  
8/30/2016   3 comments
Intel announced its Kaby Lake PC chips using an enhanced 14nm process and media engine to deliver a 12% overall boost and improved 4K video.
Auto Cybersecurity Dissected: Who, Where & What
News & Analysis  
8/25/2016   3 comments
The automotive industry’s change in perception on cybersecurity, compared to just a year ago, is seismic. We attempt to break down the layers of automotive cybersecurity. We identify where such software will reside, its functions and likely evolution.
Power9 Opens IBM to Partners
News & Analysis  
8/24/2016   3 comments
IBM’s Power9 processor reaches out to new OEMs and partners with multiple interconnects and variants of the chip, according to a talk at Hot Chips.
AMD Reveals Zen of X86
News & Analysis  
8/24/2016   Post a comment
AMD detailed Zen at Hot Chips, its next-generation x86 core aimed at head-to head competition with Intel in everything from notebooks to servers.
Advances Get a Grip on Single Photons & Molecules
News & Analysis  
8/23/2016   9 comments
Researchers are on the road to creating a single-photon emitter and a single-molecule detector.
Microsoft Gives Peek at HoloLens Chip
News & Analysis  
8/23/2016   4 comments
The HoloLens processing unit uses 24 Tensilica DSPs and an assortment of accelerators to deliver a trillion pixel-operations per second, Microsoft disclosed.
Renesas Sets Sights on Intersil
News & Analysis  
8/23/2016   Post a comment
Renesas Electronics is “in the final stages of negotiations to acquire Intersil,” reported the Japanese economic newspaper Nikkei Monday. Neither Renesas nor Intersil is confirming the report at this time.
ARM Reaches for Supercomputers
News & Analysis  
8/22/2016   1 comment
New vector extensions for 64-bit ARM cores aim to take the company into the highest reaches of supercomputer performance with partners including Fujitsu.
Laser Slicing to Slash SiC Wafer Costs, Boost Yield
News & Analysis  
8/22/2016   1 comment
Japanese ingot processing equipment manufacturer DISCO Corporation has unveiled a new laser-based technique to slice wafers out of a SiC ingot, producing 50% more wafers through reduced material losses while slashing production times by a factor of six.
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