Dual current sense amplifiers deliver fast response, precision Product News 1/31/2007 Post a comment Linear's LTC6103 contains two independent, high side current sense amplifiers that feature input bias current of 170-nA max and maximum input offset voltage of 450-µV. This precision performance allows the part to resolve very small currents and still operate over a large dynamic range.
GloNav taps Jazz to produce low-power GPS RFIC Product News 1/31/2007 Post a comment Using Jazz's 0.18-micron SiGe BiCMOS process, GloNav has developed a low-power L1 GPS RFIC that operates from a single 1.8-V supply to consume just 15-mW of power, a key requirement for today's cellular handsets, portable consumer devices and battery-operated GPS devices.
Xilinx CEO says IC models under pressure News & Analysis 1/31/2007 Post a comment The semiconductor industry is projected to experience moderate growth in the near term -- with only three IC-manufacturing business models evolving over time, warned Wim Roelandts, president, chairman and chief executive of Xilinx Inc.
WUSA-TV brings HD to the Web Product News 1/31/2007 Post a comment Digital Rapids' format-agile StreamZHD media encoding and streaming system was used by Washington, D.C. CBS affiliate WUSA-TV delivered the President's January 23 State of the Union Address live on the Web in high definition.
DVD platform boasts Wi-Fi capability Product News 1/31/2007 Post a comment Zoran has teamed with middleware provider Kestrelink to offer a wireless-connected DVD player platform with Wi-Fi capability, based on Zoran's Vaddis DVD multimedia processor and the KestrelMedia networking connectivity suite.
Sony Ericsson to make mobile handsets in India News & Analysis 1/31/2007 Post a comment Sony Ericsson is joining the growing list of mobile phone suppliers that will make or have made for them handsets in India, perhaps the fastest growing market for mobile communications. The company will start making handsets in Chennai through a deal with its global CEM partners, Flextronics and Foxconn.
IBM, CeRoma team for Power PC-enabled media chips Product News 1/31/2007 Post a comment IBM and CeRoma Ltd. (Caesarea, Israel) have formed a partnership to develop, manufacture and sell digital media chips based on the PowerPC architecture for applications such as set-top boxes, internet protocol television (IPTV), digital television (DTV) and multiple transmission standards.
Hynix 4Q sales up on strong DRAM demand News & Analysis 1/31/2007 Post a comment Hynix Semiconductor posted a fourth quarter 2006 net profit of 1.04 trillion won (about $1.1 billion) on consolidated revenues of 2.61 trillion won (about $2.8 billion), the company said. Hynix said favorable DRAM market conditions persisted through the quarter.
Actel expands channel in China News & Analysis 1/30/2007 Post a comment To promote wider use of its field-programmable gate array devices by Chinese designers, Actel Corp. announced a significant expansion of its sales channel in Greater China.
Enhanced Xilinx FPGA tool extends serial I/O debug capabilities Product News 1/30/2007 Post a comment Check out Xilinx's latest version of its ChipScope Pro software and Serial I/O toolkit. Version 9.1i extends serial I/O debug capabilities to support 65-nm Virtex-5LXT FPGAs. This release also delivers 60% faster clock speeds and comprehensive low-cost BERT capabilities for RocketIO multi-gigabit transceivers.
Cypress Semi to sell R&D fab News & Analysis 1/30/2007 Post a comment Cypress Semiconductor agreed to sell its Silicon Valley Technology Center to private equity firms for approximately $53 million in cash, but will remain a customer of the research fab.
Submini relay switches up to 10 amps Product News 1/30/2007 Post a comment CIT Relay & Switch has released the subminiature J105E series relay for low voltage signal change-over in a variety of instrumentation, computer, security, telecommunications, test and medical equipment applications.
What are the engineering and design challenges in creating successful IoT devices? These devices are usually small, resource-constrained electronics designed to sense, collect, send, and/or interpret data. Some of the devices need to be smart enough to act upon data in real time, 24/7. Are the design challenges the same as with embedded systems, but with a little developer- and IT-skills added in? What do engineers need to know? Rick Merritt talks with two experts about the tools and best options for designing IoT devices in 2016. Specifically the guests will discuss sensors, security, and lessons from IoT deployments.