ICCAD keynote reaches for cloud computing News & Analysis 10/31/2009 Post a comment The IEEE Council on Electronic Design Automation and Cadence Design Systems will offer a live webcast of the International Conference on Computer-Aided Design Keynote Monday, November 2, from 9-10:30 a.m. (P.S.T.).
Jennic : Wireless MCU uses energy harvesting Product News 10/30/2009 Post a comment Jennic has demonstrated the capability of its JN5148 wireless microcontroller to perform multiple packet transmissions from 100 uJ of energy harvested from an electro-mechanical switch, thus enabling ZigBee communication with very low energy consumption.
SensorDynamics plans energy-harvesting TPMs News & Analysis 10/30/2009 Post a comment Austrian sensor technology vendor SensorDynamics AG (Lebring, Austria) has signed a license agreement with EnOcean GmbH (Unterhaching, Germany) on the latter ones' energy harvesting technology. SensorDynamics plans to use the technology for automotive products.
Customization makes the difference, Dialog CEO Bagherli says Product News 10/30/2009 Post a comment With a share price hike of more than 1000 percent in less than a year, Dialog Semiconductor (Kirchheim, Germany) currently is one of the most successful chip vendors in Europe. The fabless company has built its remarkable success on power management applications for portable devices. But isn't power management a rather commonplace application with little chances to differentiate? Dialog CEO Jalal Bagherli says no if some critical factors are taken into account.
Samsung triples Q3 profit on better chip ASPs News & Analysis 10/30/2009 1 comment South Korea's Samsung Electronics recorded a sharply better operating profit in the third quarter, thanks largely to better demand and higher average selling prices for memory chips, the company said.
Maxim posts profit News & Analysis 10/30/2009 Post a comment Maxim Integrated Products posted a sequential double-digit increase in sales for the second consecutive quarter in the period ended Sept. 26, the company said.
KLA-Tencor back to profit on stronger demand News & Analysis 10/29/2009 Post a comment Thanks largely to a sharp increase in demand from foundry customers, chip equipment supplier KLA-Tencor logged better-than-expected sales and returned to profitability in the quarter ended Sept. 30, the company said.
Exec details ST's ARM Cortex-A9 licensing choice for HDTVs News & Analysis 10/29/2009 Post a comment In an interview with EE Times, Laurent Remont, director, R&D/Architecture Group, Home Entertainment and Displays Group at STMicroelectronics NV (Geneva, Switzerland), provided details on ST's decision to build its next-generation HDTV consumer device around the high-performance ARM architecture.
Updated: Juniper challenges Cisco on the edge News & Analysis 10/29/2009 Post a comment In a splashy New York City event, Juniper Networks announced its next generation of silicon, systems, software and partnerships around a family of networking products geared to serve businesses and service providers and attack archrival Cisco Systems.
Motorola swings to Q3 profit on cost cutting News & Analysis 10/29/2009 Post a comment Motorola Inc. fought its way back into black territory in the third quarter by sharply reducing costs throughout its operations although sales continues to fall and the company yielded market share in the mobile handset segment.
Viewpoint: In defense of Hector Ruiz News & Analysis 10/29/2009 2 comments Ex-AMD boss Hector Ruiz might have been justified in providing confidential information about the company's reorganization to a group being investigated for insider trading but he alone can end the controversy by disclosing why he talked so candidly about his former employer.
A PROFINET Competence Centre opens in France News & Analysis 10/29/2009 Post a comment Molex has been accredited as PROFINET Competence Centre (PICC) for France for a period of two years. The PICC which consists of employees of Molex and Testlab, has demonstrated the necessary competence and has the necessary equipment to offer full support.
Acal to acquire electronics, photonics component supplier News & Analysis 10/29/2009 Post a comment Components and systems distributor Acal plc announced it is acquiring the entire issued share capital of France-based BFi Optilas SAS for 10 million euros ($14.78 million) payable in cash and 2 million euros ($2.95 million) of Acal ordinary shares to be issued on completion.
Bluetooth group drops ultrawideband, eyes 60 GHz News & Analysis 10/29/2009 6 comments The Bluetooth Special Interest Group has shelved any plans to use the ultrawideband technology it acquired from the WiMedia Alliance when that group decided in March it would fold, and in its place is conducting due diligence on 60 GHz technology as a possible transport for a future high-rate Bluetooth.
4 reasons for 3-D TV, 7 more for why it's a long shot News & Analysis 10/29/2009 8 comments The possibility of 3-D entertainment in the home is a foregone conclusion according to Japanese consumer electronics giants Sony and Panasonic. But here are four reasons for their 3-D push, and seven reasons for why it's still a long shot.
Microsemi to close Arizona fab News & Analysis 10/28/2009 Post a comment Analog mixed-signal semiconductor vendor Microsemi plans to close its manufacturing facility in Scottsdale, Ariz., by April 2011, eliminating an undisclosed number of jobs.
Verizon to OEMs: Get the heat out News & Analysis 10/28/2009 2 comments Verizon Communications Inc. will require OEMs starting in July 2010 to supply thermal models for circuit boards and cabinets for any equipment they want to sell to the carrier as part of a new energy-saving strategy.
Intel, Numonyx claim phase-change memory milestone News & Analysis 10/28/2009 13 comments Researchers from Intel and its flash memory joint venture, Numonyx, have demonstrated the ability to stack multiple layers of phase-change memory (PCM) arrays within a single die, a breakthrough that could pave the way for PCM to one day displace multiple existing memory technologies in various applications, they said.
What are the engineering and design challenges in creating successful IoT devices? These devices are usually small, resource-constrained electronics designed to sense, collect, send, and/or interpret data. Some of the devices need to be smart enough to act upon data in real time, 24/7. Specifically the guests will discuss sensors, security, and lessons from IoT deployments.