TEL enhances prober to handle mix of 200- and 300-mm wafers News & Analysis 11/30/2001 Post a comment TOKYO -- In a move to increase flexibility and throughput in wafer-test operations, Tokyo Electron Ltd. today announced an enhanced version of its P-12XL prober, which adds a new sort loader, semi-automatic probe card changer, and an improved wide area probe polish feature.
ATE, IC-packaging gear, and other tool segments hit hard in Q3, says SEMI News & Analysis 11/30/2001 Post a comment SAN JOSE -- It's safe to say that the chip-equipment market was terrible in the third quarter of 2001, especially for suppliers of back-end gear, according to statistics from the Semiconductor Equipment & Materials International (SEMI) trade group here.
Shipments and bookings for all chip-equipment segments were depressed in the third quarter of 2001, but the back-end segments like testers and IC-packaging tools were especially hit hard. In some cases, shipments of automatic-test equipment (A
Electronics industry may finally have hit bottom News & Analysis 11/30/2001 Post a comment The long-awaited bottom of the industry downturn may finally have been reached, if recent financial statements issued by key companies are any indication.
A host of companies, including Dell, Flextronics, and Intel, have confirmed their earlier forecasts for the current quarter, a refreshing change from previous quarters, when revenue and earnings projections were routinely downgraded as the market continued to deteriorate.
Dainippon Screen teams with IMEC to develop ultra-clean processes for fabs News & Analysis 11/30/2001 Post a comment LEUVEN, Belgium -- Dainippon Screen Mfg. Co. Ltd. of Japan and the IMEC research group here announced plans to collaborate in the development of ultra-clean processes for wafer fabrication. The goal is to create new single-wafer cleaning steps that will be four-to-five years ahead of process requirements in the chip industry.
Sematech warns of bottleneck for 157-nm lithography News & Analysis 11/30/2001 Post a comment While semiconductor industry officials in California upped the ante for advanced IC production technology with the rollout of the 2001 International Technology Roadmap for Semiconductors on Thursday (Nov. 29), a gathering of mostly U.S.-based researchers warned a group of Taiwanese chip manufacturers that numerous obstacles jeopardize a smooth transition to implementing 157-nanometer lithography.
Sirenza claims 25 million-unit milestone in SiGe products News & Analysis 11/30/2001 Post a comment SUNNYVALE, Calif.--Sirenza Microdevices Inc. today said it has now shipped over 25 million products, based on high-performance silicon-germanium (SiGe) process technology. The SiGe chips--including a range of radio-frequency (RF) devices--are fabricated by Atmel Corp., which is supplying foundry services to Sirenza.
Lattice prepares to enter FPGA fray News & Analysis 11/29/2001 Post a comment Altera Corp. and Xilinx Inc. may soon be looking over their shoulders at Lattice Semiconductor Corp., which is planning to join the FPGA fray sometime next year. The company's newly appointed president Steven Laub called FPGAs "a natural extension for us, both customerwise and technologywise."
Fujitsu to close Gresham flash memory fab News & Analysis 11/29/2001 Post a comment Fujitsu Ltd. today announced its decision to cease production operations at its Gresham, Oregon semiconductor manufacturing facility, Fujitsu Microelectronics, Inc (FMI), by the end of January 2002, and to close the plant and liquidate its assets.
2001 technology roadmap packs some 'unexpected' surprises News & Analysis 11/29/2001 Post a comment SANTA CLARA, Calif. -- While it may not be a complete surprise that IC technology continues to accelerate faster than expected, there are some unanticipated conclusions in the new 2001 International Technology Roadmap for Semiconductors (ITRS), which is scheduled to be formally presented to the chip industry here today.
Rambus court cases begin to overlap News & Analysis 11/28/2001 Post a comment The interlocking nature of separate Rambus Inc. SDRAM patent cases was expanded when Federal Judge Ronald Whyte of the San Jose, Calif., district court ordered the memory design firm to provide Hynix Semiconductor Inc. all the discovery materials on Rambus uncovered by Micron Technology in a separate case in
Wilmington, Del., federal court.
Alchemy rolls out processor with 66-MHz PCI controller and Internet peripherals News & Analysis 11/28/2001 Post a comment LAS VEGAS--At the Microsoft Windows Embedded Developers Conference today, Alchemy Semiconductor Inc. today launched its second integrated processor for communications and networking applications. The new Au1500 is based on a 32-bit RISC core from MIPS Technologies Inc. It includes PCI interface, on-chip memory controllers, and Internet access peripherals.
Pentium 4 shortage expected to last until January News & Analysis 11/28/2001 Post a comment A recent shortage of Socket 478 Pentium 4 microprocessors has analysts and PC component makers wondering whether Intel Corp. dropped the ball in its planning or if it is trying to manipulate customers into using more expensive, high-end chips.
Pipelined A/D and Quadrature transceiver simplifies set-top box design News & Analysis 11/28/2001 Post a comment The name set-top box, because of its usual location, is used for many related types of devices. Some simply allow a television set to become the user interface to the Internet. Others allow a TV to receive and decode digital television broadcasts. Others combine a Web browser with email, an Internet picture phone, video-on-demand, TV picture-in-picture, interactive TV, and other features. Analog Devices' engineers suggest a front-end topology that supports a wide variety of these configurations.
New techniques re-time data signals for plesiochronous communication News & Analysis 11/27/2001 Post a comment In large systems, where designs are typically partitioned into two or more subsystems, clock distribution becomes prohibitively complex. Each subsystem may have its own local clock. The intra-system interfaces require data transmitted synchronously from one subsystem, to be re-timed or synchronized to the local reference in the receiving subsystem. A communications expert examines some techniques for doing this well.
ATI and Nvidia set sights on integrated graphics ICs News & Analysis 11/27/2001 Post a comment In a move to expand their respective territories by offering PC OEMs a greater range of options, ATI Technologies Inc. and Nvidia Corp. are turning their attention to the underserved integrated graphics IC market.
With Intel Corp. as a formidable opponent, the companies are banking that their successes in the discrete graphics sector will translate into new classes of performance in the embedded space.
Micron and Infineon to launch RLDRAM next year News & Analysis 11/27/2001 Post a comment BOISE, Ida. -- The new Reduced Latency DRAM for networks and communications will launch production late next year, beginning a long life cycle through 10-gigabit/sec and OC-765 optical generation systems, according to a just-released roadmap.
Rambus to appeal injunction preventing DDR patent suits against Infineon News & Analysis 11/27/2001 Post a comment LOS ALTOS, Calif. -- Rambus Inc. here vowed to "swiftly appeal" a final ruling from a Virginia federal court, which has issued a permanent injunction barring the company from filing new patent suits against Infineon Technologies AG involving double data rate (DDR) synchronous DRAMs based on JEDEC industry standards.
ASML drops SVG-developed 193-nm scanner to focus on Twinscan platform News & Analysis 11/27/2001 Post a comment VELDHOVEN, the Netherlands -- Plagued by chronic delays and a change of heart at Intel Corp., the Micrascan V 193-nm lithography system is being discontinued by ASM Lithography, which today said it will converge all 193-nm wavelength tool offerings onto a single platform--the company's dual-stage Twinscan system.
Intel picks up pace in bus, DDR333 chipset race News & Analysis 11/27/2001 Post a comment Intel Corp. is locked in another time-to-market race with its rivals in Taiwan as the company moves to accelerate the introduction of its latest bus and chipset products, according to sources with knowledge of the company's roadmap.