ASML, TEL to speed up litho cooperation News & Analysis 11/30/2011 3 comments Dutch lithography equipment specialist ASML has announced an agreement made with semiconductor production equipment supplier Tokyo Electron Ltd. to accelerate joint development activities in extreme ultraviolet and ArF immersion lithography clusters.
Toshiba to close wafer fabs, slow IC production News & Analysis 11/30/2011 5 comments Toshiba Corp. has announced it plans to close three manufacturing facilities and consolidate much of its discrete, analog and imaging IC production into three others, as part of a response to a fall off in demand for consumer products from the western hemisphere.
UMC, Kilopass extend license agreement News & Analysis 11/30/2011 Post a comment Non-volatile memory IP vendor Kilopass Technology expanded its manufacturing license agreement with Taiwanese foundry UMC to cover process technology spanning from 55 nm to 130 nm.
Globalfoundries replaces CFO, appoints CTO News & Analysis 11/30/2011 3 comments Globalfoundries appointed Daniel Durn, a former executive at the firm's parent company, to the position of chief financial officer and assigned two other senior executives to key positions.
Tegal invests in Israeli medtech startup News & Analysis 11/30/2011 Post a comment Semiconductor equipment supplier Tegal said it made a $300,000 strategic investment in NanoVibronix, a privately held firm that develops medical devices and products that implement its proprietary therapeutic ultrasound technology.
Tsubame 2.0 supercomputer wins Gordon Bell award News & Analysis 11/30/2011 2 comments The Tokyo Institute of Technology’s Global Scientific Information Computing Center has won the the supercomputing industry’s highest honor, the Gordon Bell Prize, with its Nvidia GPU-accelerated Tsubame 2.0 supercomputer.
Microchip Tech rolls low-cost MCU dev tool Product News 11/29/2011 2 comments Microchip Technology rolled out what it claimed is the lowest cost development tool supporting 3.3V, 16-bit and 32-bit PIC microcontrollers and 16-bit dsPIC digital signal controllers in 28-pin SPDIP packages.
Android market hack for Kindle Fire News & Analysis 11/29/2011 10 comments While Amazon’s wildly popular Kindle Fire tablet launched recently without official access to the Google Android Market, it hasn’t taken developers long to hack the code and make it work.
Seagate: HDD shortages to last for months News & Analysis 11/29/2011 8 comments Seagate said it expects revenue for the quarter ending in December to be above consensus analysts' expectations, but warned that the recent flooding in Thailand will lead to a shortage of hard disk drives that will last several quarters.
Report: Powerchip mulls fab sale News & Analysis 11/28/2011 3 comments Taiwanese memory chip vendor Powerchip Technology is considering the sale of one of its 300-mm fabs to help pay off debt at the request of one of its creditors, according to a report.
SATS firm takes stake in Elpida finance unit News & Analysis 11/28/2011 1 comment Memory test and assembly services provider Walton Advanced Engineering paid about $50 million to acquire 7,500 preferred shares in a finance subsidiary of memory chip vendor Elpida Memory.
VeriSilicon takes ARM license News & Analysis 11/28/2011 1 comment IC design foundry and custom silicon provider VeriSilicon has licensed intellectual property from ARM Holdings, including Cortex processor and Mali graphics processing unit cores and Artisan physical IP, ARM said.
MEMS enters world of precision archery News & Analysis 11/28/2011 9 comments If you like to go bow shooting, now you can do so with a high-tech measurement system that uses a MEMS as part of an arrow-mounted device which provides detailed information about arrow speed, flight dynamics and bow performance.
ST-Ericsson replaces CEO with ST's Lamouche News & Analysis 11/28/2011 3 comments ST-Ericsson NV, the struggling mobile phone chip joint venture, has announced the appointment of Didier Lamouche as president and CEO, with effect from Dec. 1, 2011. Lamouche, who is chief operating officer of STMicroelectronics NV, replaces Gilles Delfassy who has led ST-Ericsson since September 2009.
Die-cast enclosures in three interesting new shapes Product News 11/26/2011 Post a comment Responding to customer requests from several different sectors for die-cast enclosures to provide a strong and robust environmentally sealed housing with good EMC screening in a non-rectangular shape, Hammond Electronics has extended its popular 1590 family with the introduction of the 1590TRP and STP models.
What are the engineering and design challenges in creating successful IoT devices? These devices are usually small, resource-constrained electronics designed to sense, collect, send, and/or interpret data. Some of the devices need to be smart enough to act upon data in real time, 24/7. Specifically the guests will discuss sensors, security, and lessons from IoT deployments.