Kyocera offers lifetime LCD supply News & Analysis 12/30/2011 9 comments A lifetime supply of liquid-crystal displays is being guaranteed to original equipment manufacturers by Kyocera, which recently extended its acquisition of LCD and touchscreen suppliers by purchasing Optrex.
Chinese foundries confirm merger News & Analysis 12/29/2011 9 comments Hua Hong Semiconductor and Grace Semiconductor Manufacturing, China's second and third largest foundries, said they completed a merger between the two companies.
Intel's Medfield benchmarks leaked News & Analysis 12/27/2011 13 comments Purported specifications and benchmarks of Intel’s upcoming 32nm Medfield platform have been leaked online, detailing performance figures set to rival if not beat current chip market leaders in the tablet space.
NTT Docomo tips fabless JV for mobile chips News & Analysis 12/27/2011 4 comments NTT Docomo, Japan's largest wireless carrier, said it reached a basic agreement with five chip companies to establish a fabless joint venture to develop and sell semiconductors for handsets and other mobile devices.
Can Apple make a better Web TV? News & Analysis 12/27/2011 23 comments Can Apple crystallize the emerging concept of a Web-connected TV into a must-have product as it has done with MP3 players, smartphones and tablets?
Soitec to acquire Alatech Semi News & Analysis 12/27/2011 Post a comment Electronic materials vendor Soitec said it would acquire all of the outstanding shares of French chip equipment company Alatech Semiconductor by the end of January 2012.
Back Story News & Analysis 12/27/2011 6 comments We have compiled our “Confidential Top 10,” the ten most well-read EE Times Confidential stories this year. We have also put together "back stories," illustrating what have motivated us to go after a specific story.
ESL, down under style News & Analysis 12/26/2011 2 comments I love it when I discover new EDA companies, especially those in the ESL field. Introducing VWorks…
Touchscreens adopt on-cover over in-cell News & Analysis 12/22/2011 3 comments LCD vendors worldwide are being pressured by smartphone and tablet makers to quickly integrate touch into the display itself, using in- or on-cell sensors, but slow development has prompted add-on touchscreen vendors to offer interim sensor-on-cover, touch-on-lens, and similar one-glass solutions, at least for 2012.
Indian chip firm hits rare milestone News & Analysis 12/22/2011 11 comments An announcement by Cosmic Circuits that it has shipped 12 million ICs so far didn't garner a lot of attention internationally, but made waves here because it marks the first time an Indian chip company has attained such numbers.
Accelerated Android 4.0 available on ARM development boards News & Analysis 12/22/2011 5 comments Linaro, a not-for-profit engineering organization that works with open-source software for the ARM processor architecture, has announced downloadable builds of v4.0 of the Android operating system on development boards from Samsung and ST-Ericsson.
Chip sales for smart meters set to double News & Analysis 12/21/2011 13 comments Sales of semiconductors used in smart electricity meters are projected to grow to $1.1 billion in 2016 from $505.6 million in 2011, due to rapid growth expected for the devices, according to market research firm IHS iSuppli.
Space firsts, lasts in 2011 News & Analysis 12/21/2011 9 comments We reprise space firsts and lasts of 2011, a year during which planetary exploration thrived and the work-horse space shuttle flew its last mission to the International Space Station.
Vivante claims top GPU spot in China TD phones News & Analysis 12/21/2011 3 comments Graphics IP licensor Vivante Corp. claims to be providing graphics cores for the majority of TD-SCDMA based smartphones. This would put Vivante ahead of better known graphics core licensors Imagination Technologies Group plc and ARM Holdings plc, albeit in just a part of the Chinese mobile phone market.
DMP opens U.S. office to push graphics IP News & Analysis 12/21/2011 1 comment Digital Media Professionals Inc. (DMP), a provider of 2- and 3-D graphics rendering intellectual property (IP) cores, has announced the establishment of a U.S. subsidiary located in Campbell, California.
Fabless smart grid startup raises $12 million News & Analysis 12/21/2011 2 comments Fabless communications chip company EnVerv Inc. has announced it has raised $12 million in a Series B round of funding led by Benchmark Capital. Previous investors, NEA and Walden International also participated in the round.
Irwin Jacobs to retire from Qualcomm's board News & Analysis 12/20/2011 3 comments Irwin Jacobs, a co-founder of Qualcomm who served as the company's CEO for its first 20 years and as its chairman for almost 24 years, will step down from Qualcomm's board of directors after his current term expires in 2012, the company said.
Sematech identifies top tech challenges to 3-D ICs News & Analysis 12/20/2011 1 comment Semiconductor technology research consortium Sematech's 3D Enablement Center, together with the Semiconductor Industry Association and Semiconductor Research Corp., has identified the top technical challenges for new "killer" applications to enable future development of heterogeneous 3-D integrations beyond mobile wide I/O DRAM, Sematech said Tuesday (Dec. 20).
Gartner: Chip sales grew 1% in 2011 News & Analysis 12/20/2011 3 comments Market research firm Gartner again trimmed its forecast for 2011 semiconductor sales, saying its preliminary analysis shows chip revenue will grow by slightly less than 1 percent this year.
Thin-film solar startup raises $130 million News & Analysis 12/20/2011 4 comments Stion Corp., a startup formed to manufacture thin-film solar modules, has announced a $130 million equity investment led by AVACO and a number of Korean private equity funds. Existing investors Khosla Ventures, TSMC (through its VentureTech Alliance), Lightspeed Venture Partners, Braemar Energy Ventures, and General Catalyst Partners all participated in the round.
Broadcom rolls 40G PHY chips News & Analysis 12/20/2011 3 comments
Broadcom announced availability of an optical transceiver capable of handling long haul optical transmissions at 40 Gbit/second while consuming about 2.3 W.