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Content tagged with Internet of Things Designline posted in February 2002
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KLA-Tencor automates measurement, reporting in lithography metrology tool
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2/28/2002   Post a comment
SAN JOSE -- KLA-Tencor Corp. today introduced a new line of critical-dimension metrology systems for volume production of 0.13-micron (130-nm) and below devices, including fully-automated, Web-based CD process window measurement, analysis, and reporting capabilities.
Philips opens LCD, optical storage plants in China
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2/28/2002   Post a comment
Royal Philips Electronics of the Netherlands has opened two plants in Shanghai to support the liquid crystal display (LCD) and optical storage activities of its Components division.
IBM will steer PowerPC into mobile mart
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2/28/2002   Post a comment
IBM intends to take its PowerPC processor architecture to the mobile sector and into "head-to-head competition with Intel" and that company's Xscale processor, John Kelly III, senior vice president of IBM's Technology Group, said this week.
Nova and Applied to integrate metrology in copper CMP tools
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2/28/2002   Post a comment
REHOVOTH, Israel--Nova Measuring Instruments Ltd. today announced a joint development pact with Applied Materials Inc. to integrate metrology capability in copper CMP wafer polishing tools.
Researchers challenge conventional FPGA approaches
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2/28/2002   Post a comment
Researchers from leading universities and programmable-logic companies gathered at FPGA2002 this week to poke holes in the conventional wisdom that has guided field-programmable gate array design since its inception.
Cell phone chips integrate DSP, Xscale processor
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2/28/2002   Post a comment
Integrated baseband chips are being developed for 2.5G and 3G cell phones that merge Intel Corp.'s 400-MHz PXA250 Xscale processor, 400-MHz Micro Signal Architecture DSP and enough on-board flash to handle all DSP and applications code. The company hopes the parts, made in Intel's 0.13-micron process and being worked on at its R&D lab in Israel, can help recreate in the cellular world the kind of high-volume platform Intel and Microsoft forged with the PC.
Hitachi to spin off display operation
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2/28/2002   Post a comment
Under continued pressure to regain profitability, Hitachi Ltd. this week identified its Display Group as the next division to reorganize and will spin it off into a separate company in October.
ESS raises first half 2002 estimates based on DVD growth
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2/28/2002   Post a comment
FREMONT, Calif. -- ESS Technology Inc. today upped its estimates for first-quarter sales to a range of $68-to-$70 million compared to a previous forecast of $57-to-$60 million. The digital video and home networking chip supplier also raised its forecast for sales in Q2 to a range of $66-to-$70 million from a previous estimate of $62-to-66 million.
New heat dissipation methods unveiled by Intel
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2/28/2002   Post a comment
SAN FRANCISCO -- Intel Corp. has developed a new heat sink and fan to dissipate more than 50% more heat from more powerful processors, the Intel Developers Forum was told this week.
Infineon's new VDSL chip sets support ATM, packet transmissions
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2/28/2002   Post a comment
MUNICH -- Infineon Technologies AG today announced plans to introduced a new chip-set series for 4-band very-high-bit rate digital subscriber line (VDSL) networks with support for asynchronous transfer mode (ATM) and packet-over-VDSL communications.
Applied rolls out 3-D metrology tool for 100-nm and below processes
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2/28/2002   Post a comment
SANTA CLARA, Calif.--Applied Materials Inc. today said it was offering the industry's first fully-automated, three-dimensional CD-SEM metrology system for precise control of 193-nm wavelength lithography and etch processes used to fabricate ICs with 0.10-micron (100-nm) and below feature sizes.
Opti sales surge on last-time buys as its weighs liquidation plan
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2/28/2002   Post a comment
MOUNTAIN VIEW, Calif.--Still reconsidering a plan to liquidate itself, Opti Inc. here posted a net income of $381,000 on revenues of $2.5 million in the fourth quarter of 2001. The company's sales surged 98% on a sequential basis from the third quarter of 2001 because of an increase in last-time buys of PC chip sets, said Opti's chief executive officer.
STMicro collaborates with APT to offer Serial ATA chip solutions
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2/28/2002   Post a comment
GENEVA--STMicroelectronics today announced it was jumping into the race to develop new chips for the high-speed Serial ATA interface to storage peripherals and hard-disk drives by striking a product-design alliance with APT Technologies Inc. of Santa Cruz, Calif.
Speeding GPRS Data Services with Packet Relay Techniques
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2/28/2002   Post a comment
Splitting out the data packet relay plane from the control plane allows GPRS equipment to reduce retransmission through faster conversions, encapsulations, and protocol timing adjustments.
Chip equipment sales falls 41% in 2001, but market has finally hit bottom
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2/27/2002   Post a comment
SAN JOSE -- The semiconductor equipment market fell a staggering 41% in terms of worldwide sales in 2001 over 2000, but it appears that the business has finally hit the bottom, according to new figures from the Semiconductor Equipment and Materials International (SEMI) trade organization here today. Worldwide sales of semiconductor equipment totaled $28 billion in 2001, representing a year-over-year decline of 41%, according to SEMI of San Jose.
Tegal refutes TEL's claim of victory in appellate court ruling
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2/27/2002   Post a comment
PETALUMA, Calif. -- Tegal Corp. here today shot back at Tokyo Electron Ltd., refuting TEL's claim of a "total" legal victory in an appellate court ruling over patent rights to dual-frequency etch technology.
Agilent names head of chip group as new chief operating officer
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2/27/2002   Post a comment
PALO ALTO, Calif.--Agilent Technologies Inc. today named the head of its semiconductor division as its new chief operating officer, replacing Alain Couder, who has decided to leave Agilent to join another unidentified company as chief executive officer.
Altera updates guidance on revenue and profit margins
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2/27/2002   Post a comment
Altera Corp. today said it expects first-quarter revenue to grow between 3% and 5% sequentially, to approximately $170 million, based on sales in January and February and orders for March.
Gain enters analog IC market with physical-layer transceiver for USB 2.0
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2/27/2002   Post a comment
SAN FRANCISCO -- Gain Technology Corp. rolled out its first analog front-end interface chip for high-speed USB peripherals during the Intel Developer Forum here this week. The GT3200 is compliant with the USB 2.0 Transceiver Macrocell Interface (UTMI) specification, said Gain, which is based in Tucson, Ariz.
Five chip suppliers form DMT-VDSL initiative for interoperable devices
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2/27/2002   Post a comment
SAN JOSE -- An alliance of five chip suppliers--Alcatel Microelectronics, GlobespanVirata, Ikanos, STMicroelectronics, and Zarlink--today announced an initiative to create interoperable semiconductors for broadband VDSL communications using Discrete Multi-Tone (DMT) line coding technology.
Simtek receives patent for metal-programmed gate arrays
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2/27/2002   Post a comment
COLORADO SPRINGS, Colo. -- Simtek Corp. here today announced it has received a U.S. patent for technology used to customize programmable gate arrays with one metal layer.
Taiwan may allow $5.7 billion in fab investments in China, says report
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2/27/2002   Post a comment
TAIPEI -- Taiwan's cabinet will give the island's semiconductor companies approval to build 200-mm wafer fabrication plants in mainland China by the end of March, according to a local newspaper here quoted by the Reuters news service today.
DRAM contract, spot prices show steady rise
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2/27/2002   Post a comment
Spot prices for DRAMs have risen rapidly since Samsung Electronics Co. Ltd. and Hynix Semiconductor Inc. increased DRAM contract prices.
IMP's profit turnaround continues despite drop in sales
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2/27/2002   Post a comment
SAN JOSE -- Analog chip maker IMP Inc. here increased its profitability in the last fiscal quarter after staging a dramatic turnaround in 2001. The company this week reported a net profit of $17,000 in the fiscal quarter, ended Dec. 31, compared to a loss of $1.2 million in the period last year.
Mattson to sell AG Associates RTP tool line to Metron
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2/27/2002   Post a comment
FREMONT, Calif. -- In a move to spin off mature chip-fabrication tools, Mattson Technology Inc. today announced it will sell its AG Associates rapid thermal processing (RTP) product line to Metron Technology N.V., a supplier of wafer fab support and maintenance services based in Burlingame, Calif.
Intel works toward ramp of 90-nm process in 2003
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2/27/2002   Post a comment
SAN FRANCISCO -- In a move to keep up in the IC technology race, Intel Corp. plans to soon announce its 90-nm (0.09-micron) process for use in high-speed microprocessors, flash memories, and other chips, said company executives at the Intel Developer Forum (IDF) here.
Serial backplane protocols to slug it out
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2/27/2002   Post a comment
US market research company Venture Development (VDC) says switched serial fabrics will be used in 30% of CompactPCI systems by the end of 2006.
Malaysia's 1st Silicon works with Singapore's FTD on IP core verification
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2/26/2002   Post a comment
KUCHING, Malaysia -- Semiconductor foundry supplier 1st Silicon (Malaysia) Sdn. Bhd. here today announced a marketing and technical support agreement with Singapore-based FTD Technology Pte. Ltd., a provider of analog and mixed-signal intellectual property (IP) for chip designs.
Intel to drop support of Rambus in new CPU products
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2/26/2002   Post a comment
Intel Corp. in the second half of this year will drop its final Direct Rambus DRAMs support in new products, it was learned Tuesday at the Intel Developers Forum. The last RDRAMs used in Xeon workstations will be replaced by new chipsets supporting double data rate (DDR memory). An Intel workstation roadmap secured by EBN showed a Placer chipset with DDR SDRAMs for dual processor Xeon workstations, and a Granite Bay DDR chipset for uniprocessor Xeon workstations. They will replace the
Demand for DRAM stronger than expected in PCs
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2/26/2002   Post a comment
Demand for DRAM from PC makers is exceeding expectations for this quarter, and some of that is being driven by renewed growth in the lagging corporate environment, according to an executive of Micron Technology Inc. "Going into last December, our customers were setting us up to think about a 10% down first quarter compared to the fourth quarter," said Kipp Bedard, vice president of corporate affairs. "They have revised that to think more in the down 5% to flattish" range, he said at the Roberts
Conexant shows Bluetooth-enabled digital camera platform
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2/26/2002   Post a comment
ORLANDO, Fla. -- Conexant Systems Inc. here at a photography trade show demonstrated a Bluetooth-enabled digital still camera platform. The digital camera platform is the first to include support for wireless transmissions via Bluetooth connections, said the Newport Beach, Calif., company.
IMS rolls out new test automation software for complex IC designs
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2/26/2002   Post a comment
BEAVERTON, Ore. -- Integrated Measurement Systems Inc. today introduced its next-generation test automation software line to accelerate the development test programs for complex chip designs.
TEL says it won appeal in Tegal suit over etch patent
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2/26/2002   Post a comment
TOKYO--Tokyo Electron Ltd. today announced it has won an appeal in a U.S. patent lawsuit filed by Tegal Corp., and it is now able to continue selling its A-IEM oxide etchers in the United States "without fear of any further interference by Tegal."
AMD demos 64-bit Hammer's ability to run 64- and 32-bit software
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2/26/2002   Post a comment
SAN FRANCISCO--In an attempt to steal some of the spotlight from its archrival, Advanced Micro Devices Inc. here today held the first public demonstration of its 64-bit "Hammer" processor while much of the industry's attention was focused at the Intel Developer Forum in San Francisco.
Intel launches net processors running at 22,400 MIPS
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2/26/2002   Post a comment
AN FRANCISCO -- In a move to corner the network processor market, Intel Corp. here today announced a line of new products, including a 1.4-GHz part that supports Rambus Inc.'s RDRAM memories and runs at an eye-popping 22,400 million of instructions per second (MIPS).
On Semi to add 6-inch fab line to plant in Slovakia for power devices
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2/26/2002   Post a comment
PIESTANY, Slovakia-- On Semiconductor Corp. today announced plans to expand its chip-processing facility here with the addition of a second wafer-fab line to produce low-voltage MOS power devices.
RF Solutions, Ellipsis to develop wireless LAN chip sets for multiple standards
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2/26/2002   Post a comment
NORCROSS, Ga. -- RF Solutions Inc. and Ellipsis Digital Systems Inc. today announced a partnership to develop a chip set for dual-band, multi-protocol wireless local area networks (WLANs) supporting 2.4 and 5-GHz standards.
Zarlink adds flexible TDM switch chip for 8K-by-8K channels in networks
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2/26/2002   Post a comment
OTTAWA -- Zarlink Semiconductor Inc. today expanded its high-density non-blocking time-division multiplexing (TDM) chip offering for switching 8,192-by-8,192 channels of voice/data traffic in next-generation networking systems.
Philips, STMicro to bundle hardware/software platforms for digital TV, set-top boxes
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2/26/2002   Post a comment
EINDHOVEN, the Netherlands -- Royal Philips Electronics N.V. and STMicroelectronics today announced an agreement to jointly develop platform products for set-top boxes and digital television sets. The alliance will apply Philips' software for multimedia home platforms and STMicroelectronics' single-chip digital decoder to provide new turnkey solutions.
Intel targets 'modular infrastructure' shift in communications systems
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2/26/2002   Post a comment
SAN FRANCISCO -- The year-and-a-half slump in communications markets is causing a sea of change in the industry, prompting systems houses to shift product development strategies from proprietary ASIC designs to standard ICs and a "modular infrastructure" business model, said Intel Corp.'s top networking executive during briefing with journalists on Monday evening.
MIPS to go configurable
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2/26/2002   Post a comment
MIPS Technologies plans to make its processors more configurable. The approach will be one strand of a mixture of parallelism and multiprocessing techniques the company will use as it shifts emphasis to the high end of the cores market.
Delivering Ethernet over Sonet using Virtual Concatenation
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2/26/2002   1 comment
Operators are being pushed to provide transparent Ethernet networks. Fortunately, MAN equipment designs are on the way that support Ethernet over Sonet operation.
Foundries opt for technology spending
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2/26/2002   Post a comment
As foundry UMC exited a 300mm joint venture fab, rival Chartered Semiconductor signalled a preference for spending on technology rather than capacity.
'Put more designs on wafers' to cut costs
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2/26/2002   Post a comment
A leading photomask manufacturer has called for the greater use of multiple project wafers (MPWs) to help cut manufacturing costs.
Intel ships first 0.13-micron processors made on 300-mm wafers
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2/25/2002   Post a comment
SANTA CLARA, Calif.--As predicted earlier this year, Intel Corp. today announced it has completed first production of microprocessors on 300-mm diameter wafers using a 0.13-micron process technology. Intel claimed it is the first chip maker to produce and ship "production level processors" on 0.13-micron technology using 300-mm (12-inch) silicon substrates.
IBM tailors SiGe foundry processes for wireless chip applications
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2/25/2002   Post a comment
EAST FISHKILL, N.Y. -- IBM Corp. today announced two new versions of its existing silicon-germanium (SiGe) process technologies for foundry services in wireless ICs.
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