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Content tagged with Internet of Things Designline posted in February 2006
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EMI filters integrate ESD protection
Product News  
2/28/2006   Post a comment
Vishay has launched six EMI filter arrays with integrated ESD protection diodes in ultra-small leadless, plastic packages. These devices provide both EMI filtering and ESD protection for data lines in space critical mobile applications.
Push-pull connectors enable quick mating
Product News  
2/28/2006   Post a comment
Amphenol Industrial Operations has introduced a series of push-pull aluminum shell connectors that allow for quick mating and unmating. The Amphe-PPM series provides signal and power interconnects in medical instrumentation and process control applications.
PCI Express connectors target server applications
Product News  
2/28/2006   Post a comment
FCI has developed press-fit, vertical PCI Express card-edge connectors to extend the use of high-speed serial PCI Express architecture to thicker system boards found in server applications.
Inficon buys coating firm
News & Analysis  
2/28/2006   Post a comment
Inficon Inc., a manufacturer of instrumentation and process control software for the semiconductor and vacuum-coating industries, has acquired substantial assets of Electro Dynamics Crystal Corp. (EDC), a developer of quartz-based products.
Symbol, Terabeam settle patent suit
News & Analysis  
2/28/2006   Post a comment
Symbol Technologies Inc. has entered into a licensing agreement with Terabeam, Inc., the parent company of Proxim Wireless Corp., settling long-standing patent litigation between the two companies.
Q-Cells reports sales, earnings gains
News & Analysis  
2/28/2006   Post a comment
Solar energy products supplier Q-Cells AG posted sales of 299.9 million Euro ($356.9 million) in 2005, up 132 percent from 128.7 million Euro ($153.4 million) in 2004.
Jury finds Mohsen guilty of perjury, obstruction of justice
News & Analysis  
2/28/2006   Post a comment
A federal jury here has found former Aptix Corp. CEO Amr Mohsen guilty of 14 counts, including perjury, mail fraud and obstruction of justice in connection with a 2000 patent dispute.
Samsung, Siltronic to form wafer venture
News & Analysis  
2/28/2006   Post a comment
South Korea’s Samsung Electronics Co. Ltd. and Germany’s Siltronic AG are in talks to form a joint silicon wafer venture in Singapore, according to a report.
Evergreen's loss widens, sales up
News & Analysis  
2/28/2006   Post a comment
Solar cell maker Evergreen Solar Inc. said revenues increased 25 percent to $11.6 million from $9.3 million for the fourth quarter of 2004 and rose 4 percent from $11.1 million for the third quarter of 2005.
Lower system costs with tiny D/A converter
Product News  
2/28/2006   Post a comment
Analog Devices, Inc. expanded its nanoDAC family with eight devices including a 16-bit, quad, digital-to-analog converter in a 3 x 3-mm, 10-lead LFCSP.
ATCA platform supports DSP, network processors for WiMAX
Product News  
2/28/2006   Post a comment
Mercury Computer Systems is rolling out a modular AdvancedTCA platform for the dataplane that's built around the performance, scalability, and reliability of the serial RapidIO embedded system interconnect. The platform's architecture supports DSP, communications processors, FPGAs, and network processors.
Power analysis tool suite adds SystemVerilog support
News & Analysis  
2/28/2006   Post a comment
Sequence Design released the next generation of its PowerTheater design suite, targeting requirements for wireless, mobile, and large system-on-chip designs below the 90 nanometer node.
Innovation, not scaling key to future ICs, says IBM exec
News & Analysis  
2/28/2006   Post a comment
In a keynote at the Global Press Summit in Monterey, IBM chief technical officer Dr. Bernard Meyerson said that innovation, not scaling would drive next-generation IC development.
Tensions high in China, Taiwan
News & Analysis  
2/28/2006   Post a comment
Tensions are running high again between Beijing and Taipei -- a move that could rattle the worldwide electronics supply chain.
Firms partner on PCIe verification
News & Analysis  
2/28/2006   Post a comment
PLDApplications and EVE have forged a partnership whereby, PLDA's x4 PCIe Xpress intellectual property will be embedded in EVE's ZeBu hardware-assisted verification platform.
Asat posts loss, speeds move to China
News & Analysis  
2/28/2006   Post a comment
Amid ongoing losses, Asat Holdings Ltd. said that the transfer of all manufacturing operations to its new facility in Dongguan, China is anticipated to be completed by the end of April -- or about four months ahead of schedule.
May 23 to be called Blu-ray day
Product News  
2/28/2006   Post a comment
Sony Pictures Home Entertainment (SPHE) and Lionsgate are targeting May 23 to deliver the first wave of Blu-ray Disc (BD) titles at retail, it was announced. Delivery will coincide with the launch that day of the first commercially available BD player from Samsung Electronics, which will be followed shortly by BD players from Pioneer and Sony along with a BD compatible VAIO PC from Sony.
Cypress offering eval kit for auto image sensor technology
Product News  
2/28/2006   Post a comment
Cypress Semiconductor introduced an evaluation kit for its automotive image sensor technology. The company said the kit enables designers to quickly develop automotive safety systems using Cypress's image sensor technology for various applications.
Actel offers development kit for ARM7-enabled FPGAs
Product News  
2/28/2006   Post a comment
Actel introduced what the company described as a complete hardware and software development environment for the implementation of Actel's CoreMP7 soft ARM7 processor core.
Lab test system gets handset trace capability
Product News  
2/28/2006   Post a comment
RF test equipment vendor Aeroflex adds handset trace capability to its existing SystemAT test system. The SystemAT is used for regression testing wireless network software prior to rollout, and handset validation/interoperability testing. It also accommodates network load and capacity testing.
Evergreen Solar inks pact with Vermont company
News & Analysis  
2/28/2006   Post a comment
Solar power product supplier Evergreen Solar Inc. has entered a four-year photovoltaic module supply contract worth $88 million with Global Resource Options Inc. (GRO), a Vermont-based solar power distributor and system integrator.
Online chip estimation tool claims 4,000 users
News & Analysis  
2/28/2006   Post a comment
Giga Scale Integration more than 22,000 IC designs have been estimated through ChipEstimate.com since its introduction. The company claims more than 4,000 individual users.
India readies high-tech manufacturing policy
News & Analysis  
2/28/2006   Post a comment
The Indian government will soon announce a policy that will enable it take equity in and help boost the manufacture of high-technology products, such as semiconductors, wafers, storage devices, plasma and LCD panels.
Cadence project becomes Russian graduate program
News & Analysis  
2/28/2006   Post a comment
A three-year joint curriculum development project co-developed by Cadence Design Systems Inc. and the Moscow Institute of Electronic Technology (MIET) will become a self-sustaining two-year graduate program.
DSP development tools target Serial RapidI/O
Product News  
2/28/2006   Post a comment
Texas Instruments has launched its TMS320C6455 DSP evaluation module (EVM) and a TMS320C6455 DSP developers starter kit (DSK), both with a Serial RapidIO (sRIO) bus interface.
RFID reader module targets embedded designs
Product News  
2/28/2006   Post a comment
Sirit introduces 13.56-MHz RFID reader module for secure transactions in portable and fixed devices.
7-phase DC/DC boosts supply efficiency 3 percent
Product News  
2/28/2006   Post a comment
International Rectifier‘s improved XPhase family of scalable multi-phase DC/DC chipset devices, the IR3084 and IR3084U control ICs, help achieve up to three percent higher efficiency in 130-amp applications with seven phases, as compared to five-phase designs.
Green Hills adds tools, OS to TI's video effort
Product News  
2/28/2006   Post a comment
Green Hills Software announced an integrated development environment and real-time operating system to support Texas Instruments' DaVinci video technology.
PDU monitors current on each phase
Product News  
2/28/2006   Post a comment
Pulizzi Engineering‘s VPC2864 series of 3-phase power distribution units includes current metering on each phase to properly balance and load the system.
Intel confirms Vietnam plant investment, expands Israeli R&D
News & Analysis  
2/28/2006   1 comment
As expected, Intel Corp. said that it will invest $300 million to build a semiconductor assembly and test facility in Ho Chi Minh City, Vietnam.
Sipex inks agreement with Chinese foundry
News & Analysis  
2/28/2006   Post a comment
Analog IC supplier Sipex has signed a definitive foundry services agreement with Hangzhou Silan Microelectronics and Hangzhou Silan Integrated Circuit. Financial terms were not disclosed.
IPextreme to make Power.org member IP available
News & Analysis  
2/28/2006   Post a comment
Semiconductor intellectual property vendor IPextreme is working with Power.org to accelerate the adoption of the Power Architecture by making member IP available.
SystemC IDE requires no license for executables creation
News & Analysis  
2/28/2006   Post a comment
Electronic system level and hardware description language design solution provider Summit Design said its Vista integrated development environment for SystemC design and debug can now easily create and compile executables of SystemC designs based on the OSCI simulation kernel.
Silicon Design Chain claims methodology validation
News & Analysis  
2/28/2006   Post a comment
The Silicon Design Chain Initiative claimed that a second, enhanced version of its power-management methodology and implementation up to tapeout of the ARM 1136JF-S processor is proof of the methodology and its interdependent technologies.
Firms tout low-power, 90-nm Common Platform flows
News & Analysis  
2/27/2006   Post a comment
EDA heavyweights Cadence Design Systems, Synopsys and Magma Design Automation each announced low-power, 90-nanometer reference flows for the IBM-Chartered Semiconductor Manufacturing common manufacturing platform.
Report: Western Digital expects to meet guidance
News & Analysis  
2/27/2006   Post a comment
Hard drive supplier Western Digital Corp. said that shipments and OEM demand are tracking to expectations for the March fiscal quarter, according to a Lehman Brothers analyst's note citing an 8-K filing from the company as the source.
Safenet exec: Printer security next network trend
News & Analysis  
2/27/2006   Post a comment
While bulk of security development efforts in computer networks focus at the PC level, there's also a growing need to protect printers in these networks, according to a cryptography and embedded security expert.
20-W amp boosts commercial and military signals
Product News  
2/27/2006   Post a comment
M/A-COM introduces a 20 W X-band high-power amplifier that operates across 7.5 to 10.5 GHz.
Pentium-M chassis to underscore software productivity
Product News  
2/27/2006   Post a comment
Thales Computers and IBM are readying a chassis called the PowerMP6. When it debuts in the near future, it will consist of multiple Pentium-M boards in a 19-in. rack. The PowerMP6 will be available in various customized configurations with up to eight processor boards per rack.
IBM debuts FPU for PowerPC
News & Analysis  
2/27/2006   Post a comment
IBM Corp. has announced the availability of a 90-nm version of its floating-point unit (FPU) for its PowerPC processor line.
China's Vimicro sees flat profits, sales
News & Analysis  
2/27/2006   Post a comment
Vimicro International Corp., a fledging fabless semiconductor company in China, said revenue in the fourth quarter of 2005 was $27.5 million, compared with $27.4 million in the third quarter and up 113 percent from the $12.9 million reported in the fourth quarter of 2004.
Mentor to offers $175 million in debt
News & Analysis  
2/27/2006   Post a comment
Mentor Graphics plans to offer a private placement of $175 million of convertible subordinated debentures due in 2026.
Op amps draw 13 uA per amp
Product News  
2/27/2006   Post a comment
Exclusive to eeProductCenter: Linear Technology Corp. says its 1.8-volt dual and quad operational amplifiers are the first available in a tiny DFN package.
Memory Bulletin: NAND prices dive
News & Analysis  
2/27/2006   Post a comment
Spot prices for NAND-based flash memories continue to fall at an alarming rate amid ongoing rumors of product order cancellations from Apple Computer Inc. and Sony Corp., according to Gartner Inc.
STATS puts pop in PoP packages
News & Analysis  
2/27/2006   Post a comment
Singapore’s STATS ChipPAC Ltd. said that it has increased the performance of its package-on-package (PoP) technology with a two-die stack capability in the bottom package.
Trading firm takes stake in Pac Tech
News & Analysis  
2/27/2006   Post a comment
Nagase and Co., a trading company in Japan, has acquired a 60 percent stake in chip-packaging equipment maker Pac Tech GmbH for an undisclosed amount.
Shockley Labs marks 50th anniversary
News & Analysis  
2/27/2006   Post a comment
Civic and industry leaders gathered at a produce market to commemorate the 50th anniversary of Shockley Semiconductor Laboratory -- sometimes considered the birthplace of Silicon Valley.
Programmable power management solutions from Lattice
Product News  
2/27/2006   Post a comment
Lattice expands its Power Manager II family with programmable power management solutions for high-volume applications
16-bit MCU boasts 1.8 mW/MIPS power consumption
Product News  
2/27/2006   Post a comment
NEC Electronics America’s 16-bit 78KOR series flash microcontrollers boasts low power consumption of 1.8 milliwatts per million instructions per second and six times the power/performance ratio of NEC Electronics' 8-bit 78K0 MCUs.
PCI-X board runs parallel TI DSPs
Product News  
2/27/2006   Post a comment
Designed for high-speed I/O and processing, here's news of a board-level PCI-X drop-in that harnesses the power of up to nine TI TMS320C6414T DSPs. With that you can get over 2000-Mbytes/s of concurrent I/O, and the ability to combine any number of customer-specific channels of data for up to 500-Mbytes/s of continuous data input from an external source.
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