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Content tagged with Internet of Things Designline posted in February 2010
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ARM's weak Q4 outperforms the market
News & Analysis  
2/2/2010   Post a comment
Processor IP licensor ARM Holdings plc (Cambridge, England) reported falling profits and sales for the fourth quarter and full year ended Dec. 31, 2009, but the company said it expects to see improving conditions in 2010.
Adoption of copper wire-bonding is growing slowly says SEMI
News & Analysis  
2/2/2010   Post a comment
SEMI completed a survey on behalf the World Gold Council to gain insight into current attitudes regarding the use of gold bonding wire versus copper bonding wire.
Intel-Micron JV orders litho for Singapore fab
News & Analysis  
2/1/2010   1 comment
Intel Corp. and Micron Technology Inc. are mum about the production schedule of its joint NAND fab in Singapore--despite the fact the venture has begun ordering lithography tools and other gear for that plant.
Qualcomm makes up with Korea
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2/1/2010   Post a comment
Qualcomm Inc. (San Diego) will establish a research and development center in South Korea and will invest in Seoul-based Pulsus Technologies Inc.
Samsung rolls 30-nm-class DRAMs
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2/1/2010   Post a comment
South Korea's Samsung Electronics Co. Ltd. has rolled out the industry's first 30-nm-class DRAMs.
TranSwitch to cut jobs as sales slow
News & Analysis  
2/1/2010   Post a comment
Communications chip maker TranSwitch Corp. has announced a layoff.
ON Semiconductor expands 100-V N-Channel MOSFET family to offer high current capability
Product News  
2/1/2010   Post a comment
ON Semiconductor has expanded its N-channel power MOSFET portfolio with the addition of 12 new 100 V devices.
45-V input 100-mA LDO Offers low noise and output down to 0.6-V
Product News  
2/1/2010   Post a comment
Linear Technology Corporation has introduced a high voltage, low noise, low dropout voltage linear regulator that delivers up to 100 mA continuous output current with a 300 mV dropout voltage at full load.
High Power Card Edge connector offers low power loss and high linear current density
Product News  
2/1/2010   Post a comment
Connectors and interconnect systems specialist, FCI, has released the High Power Card Edge (HPCE) connector which is a next generation power card edge connector targeting applications demanding low power loss and high linear current density.
Digital isolation solutions cuts costs in half, reduces board space by 70 percent
Product News  
2/1/2010   Post a comment
Analog Devices, Inc., is expanding its portfolio of AEC-Q100 products with the introduction of quad-channel digital isolators with integrated, isolated power to address the safety and reliability requirements of HEV batteries that operate at high voltages of up to 600 V.
RS Components becomes strategic supplier partner for ABB
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2/1/2010   Post a comment
RS Components has signed a new global agreement with ABB, a major supplier with a profile of more than 3000 stocked lines spanning power, electrical, interconnect and control products.
DuPont opens photovoltaic application facility in Switzerland
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2/1/2010   Post a comment
DuPont has opened a new photovoltaic application laboratory at its European Technical Center in Geneva, Switzerland.
Forum describes 25G backplane, standard
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2/1/2010   Post a comment
The Optical Internetworking Forum has successfully demonstrated a 25 Gbit/second backplane, more than twice the speed to today's typical systems and reported on it at an open workshop hosted by the Optical Internetworking Forum that is drafting a standard for 25G interconnect.
AuthenTec rejects Upek's merger plan
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2/1/2010   Post a comment
AuthenTec Inc. has rejected Upek Inc.'s proposed plan to merge the two companies.
Samsung, Toshiba retain lead in Q4 NAND ranking
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2/1/2010   Post a comment
The six companies fighting for NAND flash memory market share retained their positions in the fourth quarter of 2009. Samsung and Toshiba led with market shares of 38.6 percent and 3.7 percent respectively, according market research company DRAMexchange.
EDA pundits confront market projections for 2010
News & Analysis  
2/1/2010   7 comments
2010 has just started, and there is no better time to generate estimates and predictions for this year's EDA market. Three EDA industry experts have agreed to share their projections with EE Times.
High brightness blue and green 5mm through-hole LEDs
Product News  
2/1/2010   Post a comment
Avago Technologies launched a new series of high brightness blue and green 5mm through-hole LEDs for use in electronic sign and signal applications.
Tensilica targets high quality audio and smartphones with HiFi EP DSP core
Product News  
2/1/2010   Post a comment
Tensilica introduced HiFi EP, a superset of the HiFi 2 architecture that is optimized for simultaneous multichannel codec support and continuously expanding audio pre- and post-processing.
Full-year chip sales fell 9% in 2009, says SIA
News & Analysis  
2/1/2010   1 comment
Global semiconductor sales were $226.3 billion in 2009, a decline of 9 percent from 2008 when sales were $248.6 billion, according to the Semiconductor Industry Association (SIA). The full-year decline was as had been expected in the last month but much less than had been predicted in the first months of 2009.
PC, phone demand strong in 2010, says SIA's Scalise
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2/1/2010   Post a comment
Units sales of PCs and cellphones will grow in the low-to-mid teens of percent in 2010, providing a "solid platform for chip sales," according to George Scalise, president of the Semiconductor Industry Association.
Advanced probes, instrument take digital test console to full PCI Express 3.0 evaluation regime
Product News  
2/1/2010   Post a comment
Advanced probes, instrument take digital test console to full PCI Express 3.0 evaluation regime
Nujira starts to roll out Coolteq.L silicon
News & Analysis  
2/1/2010   Post a comment
Nujira Ltd. (Cambridge, England) has said it intends to demonstrate the world's most efficient RF power amplifier for 3G/4G at Mobile World Congress which takes place in Barcelona, Feb. 15 to 18. The demonstration is based on Nujira's Coolteq.L silicon.
Graphics chips shipments to rise 27% in 2010, says analyst
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2/1/2010   Post a comment
Some 544 million graphics chips will ship in 2010, up 27.9 percent on the 425.4 million shipped in 2009, according to market analyst Jon Peddie Research (Tiburon, Calif.).
Austriamicrosystems extends design collaboration with Cadence for mixed-signal SoC designs
News & Analysis  
2/1/2010   Post a comment
austriamicrosystems has broadened the company's deployment of electronic design technology from Cadence Design Systems Inc., by selecting the Cadence Encounter Digital Implementation System for the digital part of its designs.
D&R launches IP_SoC 2010 World Tour
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2/1/2010   Post a comment
Design & Reuse SA (D&R), a global collaboration network for sharing system-on-chip design resources, announced it is exporting its IP-SoC conference and exhibition concept to the world.
Synfora adds C++ support to PICO HLS tools
Product News  
2/1/2010   Post a comment
Synthesis tool vendor Synfora Inc. announced it has extended support for C++ language in its PICO Extreme and PICO Extreme FPGA C synthesis tools.
Black Sand acquires power amplifier IP from Silicon Labs
News & Analysis  
2/1/2010   Post a comment
Black Sand Technologies Inc. (Austin, Texas), a specialist in CMOS power amplifier technology for wireless applications, has said it has acquired a patent portfolio related to CMOS power amplifiers from Silicon Laboratories Inc. (Austin, Texas).
Altera to offer partial reconfiguration at 28-nm
Product News  
2/1/2010   Post a comment
FPGA vendor Altera plans to introduce several innovations for its first 28-nm chips, including partial reconfiguration, 28-gigabit-per-second transceivers and embedded hard intellectual property blocks, the company said. b
Rumor mill: B'com, Cavium eye Teknovus acquisition
News & Analysis  
2/1/2010   1 comment
Chatter in the rumor mill says Broadcom Corp. or Cavium Networks may be about to acquire startup Teknovus Inc. for its passive optical networking technology, just as Marvell is expected to roll out its first PON products this week.
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