Intel-Micron JV orders litho for Singapore fab News & Analysis 2/1/2010 1 comment Intel Corp. and Micron Technology Inc. are mum about the production schedule of its joint NAND fab in Singapore--despite the fact the venture has begun ordering lithography tools and other gear for that plant.
Qualcomm makes up with Korea News & Analysis 2/1/2010 Post a comment Qualcomm Inc. (San Diego) will establish a research and development center in South Korea and will invest in Seoul-based Pulsus Technologies Inc.
Forum describes 25G backplane, standard News & Analysis 2/1/2010 Post a comment The Optical Internetworking Forum has successfully demonstrated a 25 Gbit/second backplane, more than twice the speed to today's typical systems and reported on it at an open workshop hosted by the Optical Internetworking Forum that is drafting a standard for 25G interconnect.
Samsung, Toshiba retain lead in Q4 NAND ranking News & Analysis 2/1/2010 Post a comment The six companies fighting for NAND flash memory market share retained their positions in the fourth quarter of 2009. Samsung and Toshiba led with market shares of 38.6 percent and 3.7 percent respectively, according market research company DRAMexchange.
Full-year chip sales fell 9% in 2009, says SIA News & Analysis 2/1/2010 1 comment Global semiconductor sales were $226.3 billion in 2009, a decline of 9 percent from 2008 when sales were $248.6 billion, according to the Semiconductor Industry Association (SIA). The full-year decline was as had been expected in the last month but much less than had been predicted in the first months of 2009.
Nujira starts to roll out Coolteq.L silicon News & Analysis 2/1/2010 Post a comment Nujira Ltd. (Cambridge, England) has said it intends to demonstrate the world's most efficient RF power amplifier for 3G/4G at Mobile World Congress which takes place in Barcelona, Feb. 15 to 18. The demonstration is based on Nujira's Coolteq.L silicon.
D&R launches IP_SoC 2010 World Tour News & Analysis 2/1/2010 Post a comment Design & Reuse SA (D&R), a global collaboration network for sharing system-on-chip design resources, announced it is exporting its IP-SoC conference and exhibition concept to the world.
Rumor mill: B'com, Cavium eye Teknovus acquisition News & Analysis 2/1/2010 1 comment Chatter in the rumor mill says Broadcom Corp. or Cavium Networks may be about to acquire startup Teknovus Inc. for its passive optical networking technology, just as Marvell is expected to roll out its first PON products this week.
What are the engineering and design challenges in creating successful IoT devices? These devices are usually small, resource-constrained electronics designed to sense, collect, send, and/or interpret data. Some of the devices need to be smart enough to act upon data in real time, 24/7. Specifically the guests will discuss sensors, security, and lessons from IoT deployments.