Agilent plans major upgrade of SoC chip testers News & Analysis 3/28/2002 Post a comment SANTA CLARA, Calif. -- During a series of presentations here this week, Agilent Technologies Inc. gave a sneak preview of plans to upgrade its IC testers for cutting-edge communications semiconductors, system-on-a-chip products and other devices.
Centillium sees stronger demand for DSL chips in Japan News & Analysis 3/28/2002 Post a comment FREMONT, Calif.--Centillium Communications Inc. here said a strong pickup in demand for digital subscriber line (DSL) products in Japan has caused the company to re-evaluate its chip inventory, which had been previously written down in value because it was believed to be obsolete or excessive for market conditions.
Advanced Energy buys German supplier of power systems for fab tools News & Analysis 3/28/2002 Post a comment FORT COLLINS, Colo. -- In a move to strengthen its European presence in chip fabs and other manufacturing facilities, Advanced Energy Industries Inc. today announced it has purchased Dressler HF Technik GmbH in Stolberg, Germany, which is a privately-held supplier of radio-frequency power systems for plasma-based equipment and processes.
Zarlink to sell U.K. plant to X-Fab and receive foundry services News & Analysis 3/28/2002 Post a comment PLYMOUTH, England -- Canada's Zarlink Semiconductor Inc. today announced it has found a buyer for its wafer fab here. X-Fab Semiconductor Foundries AG of Erfurt, Germany, has agreed to buy the facility for $30 million--$12 million in cash on closing of the transaction and $18 million in secured notes payable over three years, the two companies said.
Alpha Industries cuts forecast due to weakness in wireless systems News & Analysis 3/28/2002 Post a comment WOBURN, Mass.--Alpha Industries Inc. today lowered its forecast for revenues in the current fiscal quarter to $28 million and it predicted an adjusted net loss of $0.11-to-$0.13 per share because unexpected weakness in wireless infrastructure markets and delays in orders for radio-frequency (RF) semiconductors used in handsets.
The SPI-5 Spec: A Tutorial News & Analysis 3/28/2002 Post a comment Recently ratified, the SPI-5 specification will play an important role in the development of emerging 40-Gb optical systems. Richard Cam of PMC-Sierra takes us on a tour of this hot new spec.
ESS ups Q1 guidance again, predicting more than $75 million in sales News & Analysis 3/27/2002 Post a comment FREMONT, Calif. -- ESS Technology Inc. today increased its revenue forecast for the first quarter to more than $75 million, compared to last month's guidance of $68-to-$70 million. ESS has now increased its forecast for Q1 revenues twice since originally estimating sales in the $57-to-$60 million range.
Infineon executive urges memory makers to standardize News & Analysis 3/27/2002 Post a comment SANTA CLARA, Calif. -- During a speech here, the top U.S. executive for Munich-based Infineon Technologies AG pulled no punches and urged memory device makers to adopt standards in order to change an ongoing pattern of confusion and "island solutions" in the PC and semiconductor markets.
Infineon executive urges chip makers to adopt more standards News & Analysis 3/27/2002 Post a comment SANTA CLARA, Calif. -- During a speech here, the top U.S. executive for Munich-based Infineon Technologies AG pulled no punches and urged memory device makers to adopt standards in order to change an ongoing pattern of confusion and "island solutions" in the PC and semiconductor markets.
Applied launches fast inspection tool for 100-nm, below copper processes News & Analysis 3/27/2002 Post a comment SANTA CLARA, Calif.--Applied Materials Inc. today rolled out a new high-speed wafer inspection system for 100-nm (0.10-micron) and below process technologies. The CompassPro system uses several new features, including what Applied calls All Optical Dynamic Range and Multi-Perspective Grain Suppression technologies, to quickly identify yield-impacting defects at lower cost and at higher speeds.
China PC maker turns to wireless future News & Analysis 3/27/2002 Post a comment
Legend Holdings Ltd. is taking China's bullish electronics industry by the horns in an effort to translate its leading PC market share into new growth areas. With China's booming wireless handset sector as its next target, Legend is stitching together a network of suppliers and EMS providers to give it quick access to what has become the world's largest market for cell phones.
Though growth in China's wireless and PC markets slowed last year, the industries are back on track, according to Qia
SpeedFam-IPEC posts $10.4 million loss in quarter News & Analysis 3/26/2002 Post a comment CHANDLER, Ariz.--SpeedFam-IPEC Inc. today reported a 2.7% sequential decline in revenues to $25.1 million in its fiscal third quarter, ended March 2, compared to $25.8 million in the prior three-month period. The company's revenues were 57% lower than $58.8 million in the quarter last year.
Apple's iPod packs a pricey punch Teardown 3/26/2002 1 comment The Apple iPod portable MP3 player combines style and skillful engineering in a small package. At $399, it is not cheap, but iPod's 1,000-song capability and automatic file synchronization with Apple's iTune software deliver a nifty overall package.
PDA chip content to 'inch up' in 2002, says report News & Analysis 3/26/2002 Post a comment EL SEGUNDO, Calif. -- Unit shipments of personal digital assistants (PDAs), also known handheld computers, are expected to grow from 12.1 million systems in 2001 to about 50 million units in 2006, according to a new report from iSuppli Corp.
TRW raises bar in laser sources to enable EUV beta tools News & Analysis 3/26/2002 Post a comment ST. CHARLES, Mo. -- Raising the bar for next-generation lithography (NGL) sources, TRW Inc.'s Cutting Edge Optronics subsidiary here today demonstrated a 1500-watt laser module for an NGL technology called extreme ultraviolet (EUV). The new laser has been integrated with a xenon jet target and is producing EUV output. Cutting Edge has demonstrated one 1500-watt module thus far, but it plans to develop and integrate three modules in a compact enclosure, which will produce a total of 4500 watts of
Memory chip makers demur on 400MHz DDR-I News & Analysis 3/26/2002 Post a comment Santa Clara, Calif. -- Three major DRAM makers -- Elpida Memory, Hynix Semiconductor and Infineon Technologies -- told the Jedex conference here Monday that they didn't plan to make 400-MHz speed memory in the DDR-I standard.
"Better Design Productivity" Pervasive at Board-Design Show News & Analysis 3/26/2002 Post a comment The recent Silicon-Valley based PCB Design conference and exhibition concentrated on new tools and tool enhancements to help board engineers and designers improve existing design methodologies. TechOnLine's Jim Lipman discusses how the show's exhibitors concentrated on new tool bundles, Web-based collaborative design, and enhanced design functionality for mainstream board designers.
JEDEC describes new DDR-II specs, says first parts due out in late 2002 News & Analysis 3/26/2002 Post a comment SANTA CLARA, Calif. -- During the JEDEX conference here on Monday, representatives from the DRAM and PC markets outlined some of the first public details, specifications and updates for a second-generation, double-data-rate SDRAM standard called DDR-II.
The proposed DDR-II standard has been in the works for months and is supposed to replace existing DDR SDRAMs or DDR-I. The "mainstream DRAM" market is also supposed to migrate from the 200/266-MHz versions of DDR SDRAMs in the market today, to t
JMAR plans to significantly increase X-ray stepper throughput News & Analysis 3/25/2002 Post a comment SAN DIEGO--JMAR Technologies Inc. today said it was on schedule with plans to demonstrate an integrated compact X-ray source with a newly-developed X-ray stepper for gallium-arsenide (GaAs) processes using lithography feature sizes below 130 nm (0.13 micron) and 150-mm (6-inch) substrates.
ESEC replaces CEO with former Siemens Semiconductor chief News & Analysis 3/25/2002 Post a comment CHAM, Switzerland -- Chip-assembly tool supplier ESEC Group today announced its board had replaced the company's chief executive officer after a disagreement about strategies to turnaround the struggling company. ESEC named Jürgen Knorr--former head of the Siemens Semiconductor Group in the 1980s and 1990s--as its new CEO.
Xilinx looks to ease path to custom FPGAs News & Analysis 3/25/2002 Post a comment Several years after exiting the FPGA-to-ASIC conversion business, Xilinx Inc. (San Jose, Calif.) has come up with a "no-risk" alternative for customers who want a lower piece price for higher volume orders, the company said.
TI's new DSP cuts cost of multiple/accumulate function in half News & Analysis 3/25/2002 Post a comment HOUSTON -- Texas Instruments Inc. today announced it has expanded the scope of its TMS320C64x series of digital signal processors to address low-power consuming applications with a DSP chip that cuts the cost of multiply/accumulate functions in half, compared to its nearest competitors.
Samsung VP sees paradigm shift in memories due to new applications News & Analysis 3/25/2002 Post a comment SANTA CLARA, Calif. -- At the JEDEX conference today, an executive from Samsung Electronics Co. Ltd. insisted the memory market is alive and well despite the current IC downturn, saying that a new class of digital applications will "digest" and propel the need for existing and next-generation devices in the market.
Toshiba claims smallest four-chip stacked flash/SRAM package News & Analysis 3/25/2002 Post a comment TOKYO -- Toshiba Corp. today said it is offering the industry's smallest multi-chip package for stacked memory in portable phones. The four-chip NOR flash/SRAM memory products measure 10-mm long and 7-mm wide, combining 8 megabits of static RAM and 32 Mbits of pseudo SRAM with two 64 Mbits of nonvolatile flash memories.
Denali Software sells market research to memory design customers News & Analysis 3/25/2002 Post a comment PALO ALTO, Calif. -- In an unusual move to expand services to customers of design automation and intellectual property (IP) products, Denali Software Inc. today launched a subscription-based market research program to help product development teams analyze changing standards, the proliferation of memories into new applications, and the revenue potential for new ICs.
Multipoint standard boosts LVDS News & Analysis 3/25/2002 Post a comment Low-voltage differential signaling, or LVDS (TIA/EIA-644), has become extremely popular because of its high-speed and low-power characteristics for a wide range of applications.
Diverse IP cranks noise control headaches News & Analysis 3/25/2002 Post a comment If you ask designers of high-speed printed-circuit boards about signal integrity, chances are they know all about the interactions of "aggressors" and "victims" and the nasty things that can happen to logic signals clocked at near-gigahertz rates.
What are the engineering and design challenges in creating successful IoT devices? These devices are usually small, resource-constrained electronics designed to sense, collect, send, and/or interpret data. Some of the devices need to be smart enough to act upon data in real time, 24/7. Are the design challenges the same as with embedded systems, but with a little developer- and IT-skills added in? What do engineers need to know? Rick Merritt talks with two experts about the tools and best options for designing IoT devices in 2016. Specifically the guests will discuss sensors, security, and lessons from IoT deployments.