AMD and Fujitsu merging their flash operations News & Analysis 3/31/2003 Post a comment Advanced Micro Devices Inc. and Fujitsu Ltd. on Monday said they would combine their flash memory operations into a new company based in Sunnyvale, Calif.
The companies today announced they have executed a memorandum of understanding (MOU) to establish FASL LLC.
A Japan headquarters will be located in Tokyo. The new company will be based on the integration of AMD and Fujitsu's flash memory businesses, including their existing joint manufacturing venture, Fujitsu AMD Semiconductor Ltd. The new c
Why you need RTL virtual prototyping News & Analysis 3/28/2003 Post a comment Cadence Design Systems' Suk Lee traces the evolution of silicon virtual prototyping, and proposes a "continuous convergence" methodology for solving timing closure problems.
Charger IC supports range of cell types Product News 3/28/2003 Post a comment When interfaced with a microcontroller, Linear Technology Corp.'s LTC4008, a 4-amp multicell, multichemistry battery pack charger IC, is said to be capable of charging nickel cadmium, nickel metal hydride and sealed lead-acid batteries as well as lithium-ion types.
Linux is driver for network designs News & Analysis 3/27/2003 Post a comment As we watch Internet-centric connected computing emerge as the next growth area, we will also see how modern, third-generation real-time operating system technology is refined to meet the demands of this new area.
Home connections about to open News & Analysis 3/27/2003 Post a comment Common gateway architectures that integrate broadband access with local 802.11 wireless networks are beginning to stabilize, particularly in the Docsis cable modem market and, to a lesser extent, in digital subscriber line realms.
Camera phone could come calling News & Analysis 3/27/2003 Post a comment Although industry experts disagree on how soon video will go wireless, leading semiconductor companies and handset vendors are racing to find a way to make possible what once seemed impossible.
3G rollout plagued by uncertainty News & Analysis 3/27/2003 Post a comment The 3G revolution, sparked by the merger of voice and data services in the cellular handset, has reached critical mass, say some industry watchers, while others see a slow ramp to the worldwide proliferation of third-generation handsets.
Process tricks tune radios-on-chip News & Analysis 3/27/2003 Post a comment For many of those proficient in the black art of RF design, the concept of a single-chip radio stirs up age-old arguments about how processes should be matched to the function for the best performance/cost trade-off.
IBM scores win at TSMC's expense News & Analysis 3/26/2003 Post a comment HSINCHU, Taiwan -- Just hours after IBM Corp. announced a multi-year pact to make graphics chips for Nvidia Corp., Taiwan Semiconductor Manufacturing Co. Ltd. said that it would still remain as Nvidia???s ???primary??? foundry service provider.
Hynix braces for 35% tariff on DRAMs News & Analysis 3/24/2003 Post a comment Hynix Semiconductor Inc. is taking steps to cope with a 35% duty that may soon be imposed against the chipmaker for allegedly illegal subsidies from the Korean government, an official told EBN Monday.
C-MEMS filter aims at monitoring News & Analysis 3/24/2003 Post a comment Ultradense wavelength-division multiplexing (DWDM) filters can potentially double, triple or even quadruple spectral efficiency by reducing the space separating channels to 50, 25 and 12.5 GHz, respectively.
Spreading out News & Analysis 3/24/2003 Post a comment In the past decade, DSPs have become synonymous with communications and multimedia, and along the way have helped propel cellular telephony to one of the largest end-product markets for semiconductors.
Simple techniques for making verification reusable News & Analysis 3/21/2003 Post a comment Peter Spyra, verification engineer at design services startup Integre Technologies, describes a number of techniques for verification reuse with Verisity's "e" language in this detailed tutorial. An accompanying article provides code examples.
GDDR2 getting ready for the big show News & Analysis 3/21/2003 Post a comment Confined for now to a high-end niche market, GDDR2 SDRAM is expected to stage a significant ramp late this year following the anticipated adoption of an industry standard that will open up the graphics memory to a wider audience.<
What are the engineering and design challenges in creating successful IoT devices? These devices are usually small, resource-constrained electronics designed to sense, collect, send, and/or interpret data. Some of the devices need to be smart enough to act upon data in real time, 24/7. Specifically the guests will discuss sensors, security, and lessons from IoT deployments.