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Content tagged with Internet of Things Designline posted in April 2004
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Terminal blocks packed with options
Product News  
4/28/2004   Post a comment
Phoenix Contact has added three new series of double level, SMT compatible PC-board terminal block headers to its product portfolio. These high temperature terminal blocks allow parts to be easily integrated into surface-mount production processes, eliminating hand soldering and providing cost and time savings.
Chip reliability concerns seen growing
News & Analysis  
4/28/2004   Post a comment
Reliability concerns "are at the very center" of the chip industry today. New failure modes threaten as the industry moves to new materials, and to complex system-on-chip solutions with multiple device types on the same die, said Stork, now the chief technology officer at Texas Instruments Inc. (Dallas).
Speakers challenge APIs for EDA interoperability
News & Analysis  
4/28/2004   Post a comment
A standard API and database implementation may not be the best approach to EDA tool interoperability, according to Synopsys speakers at the Electronic Design Processes (EDP-2004) workshop Monday. The speakers challenged advocates of the OpenAccess coalition by proposing alternatives that don't rely on C language APIs.
Chip reliability concerns seen growing
News & Analysis  
4/28/2004   Post a comment
In 1982, reliability concerns were "out there on the edge," away from the real action of developing new process technologies. Now, reliability concerns "are at the very center" of the chip industry.
Desktop safety tester checks insulation-resistance, leakage
Product News  
4/28/2004   Post a comment
A new electrical safety tester meets the requirements of design, engineering, production line or type-testing applications. The digital instrument can perform a suite of standard electrical safety tests, with traceability of test results and records.
Fujitsu rolls out first copper XENPAK module for networking apps
Product News  
4/28/2004   Post a comment
eeProductCenter exclusive Enabling copper connections for 10 Gbit Ethernet links using InfiniBand 24 AWG cable and connectors, Fujitsu Components America, Inc., claims it has launched the industry's first copper XENPAK module (xMGC) that is compliant to the new 10GBASE-CX4 specification also known as IEEE 802.03ak/D4.2 for low-cost copper 10-Gigabit Ethernet. The company touts that the new electrical transceiver module reduces the cost per port in short reach rack-to-rack connections in d
Li+ charger chip won't overheat
News & Analysis  
4/28/2004   Post a comment
Linear Technology's LTC4059A is a fully integrated linear battery charger in a 2-by-2 mm DFN package that can charge a single-cell Li-Ion battery at 900 mA without danger of overheating itself or surrounding components. A patented thermal regulation scheme prevents the junction temperature of the IC from exceeding 115°C by reducing charge current during high-power or high-ambient-temperature operation. The charger, suited to digital still cameras, cell phones, PDAs and USB-equipped handheld d
Ballast ICs bring transformerless dimming
News & Analysis  
4/28/2004   Post a comment
International Rectifier's 600-volt IR21592 and IR21593 dimming ballast ICs, each with a phase control loop and half-bridge driver for fluorescent lamps, eliminate the need for a current-sensing transformer. IR says these new devices offer the most comprehensive set of sense and control features available, including ignition detection and full-scale dimming, as well as brownout- and over-temperature protection. A microcontroller interface is included for maximum flexibility in programming such pa
Smallest D/A converter resolves space, performance challenge
News & Analysis  
4/28/2004   Post a comment
Analog Devices introduced the first members of its new nanoDAC family of digital-to-analog converters that provide breakthrough performance in smaller packages. The compact size and low power consumption of these new converters provide significant advantages in space-constrained applications.
600-V MOSFETs simplify switchmode, PWM designs
News & Analysis  
4/28/2004   Post a comment
ON Semiconductor's new NTD4N60, NTP6N60, and NTP10N60 600-volt n-channel MOSFETs are intended to ease the design of switchmode supplies, PWM motor controllers, and bridge circuits.
A/D converter offers outstanding -95dB peak harmonic and 93 dB SNR
News & Analysis  
4/28/2004   Post a comment
DATEL's ADS-953 optimizes signal return paths and provides internal, local decoupling to obtain an outstanding "95dB peak harmonic specification and 76μVrms noise-level performance.
TIA offers temperature and long-term stability for photodiode applications
News & Analysis  
4/28/2004   Post a comment
TI announced a transimpedance amplifier featuring 90MHz gain bandwidth, less than 25uV offset and inherent temperature and long-term stability. The device is ideal for high-speed photodiode applications, including optical power monitoring, security scanners, medical diagnostics and current measurement in test equipment.
2.4-kW ETSI-spec'd power system saves space
Product News  
4/28/2004   Post a comment
XPiQ's low-profile AC/DC power shelf, with 1.8, 2.1 and 2.4 kW capacity (depending on output voltage), fits into a 1U-high 19-inch rack and, at 11.56 inches deep meets European Telecommunications Standards Institute (ETSI) requirements. The ZCA-1U3R-R system, comprising three of the company's ZC8 800-watt rectifiers and the rack, is designed to allow more space for system electronics in telecom, networking, storage and wireless base-station applications. It can be applied in bulk power situation
Ericsson's DSP shift rekindles basestation debate
Product News  
4/28/2004   Post a comment
Ericsson has shifted to a DSP-only, software-defined approach to basestation design in response to the cost, processing and flexibility requirements of third-generation wireless infrastructure. In doing so, the company -- the leading basestation manufacturer -- has rekindled the debate over the optimum mix of ASICs, FPGAs, DSPs and reconfigurable processors for advanced wireless systems.
Robots readied to take on search-and-rescue duties
News & Analysis  
4/28/2004   Post a comment
Microminiaturization has made possible swarms of autonomous robots using nothing more than off-the-shelf parts. But concentrating their wireless chatter and getting them to cooperate to solve problems may be five years away, the National Science Foundation cautions. It's putting $2.6 million into a five-year effort to turn multiple wireless robots into an emergency search-and-rescue team. Colin Johnson has this report.
Bad signals interfere with 90-nm designs
News & Analysis  
4/28/2004   Post a comment
When Agilent Technologies Inc.'s ASIC products division first moved from 130- to 90-nanometer chip design, it got a nasty surprise. "Signal integrity," said Jay McDougal, microprocessor design methodology manager at Agilent, "was really an order of magnitude worse." McDougal's experience seems to track with that of other users and matches what EDA vendor representatives are saying. Such problems as crosstalk-induced delays, crosstalk-induced glitches and power noise due to voltage drop are all
Synopsys keynoter cites crosstalk, power challenges
News & Analysis  
4/28/2004   Post a comment
Crosstalk and power are extremely difficult problems to solve, and will require significant changes to the existing chip design flow, according to Li-Pen Yuan, R&D director for extraction and signal integrity at Synopsys. Yuan offered a keynote speech at the Electronic Design Processes (EDP-2004) methodology conference here Monday (April 26). Richard Goering was there.
ST to launch single-chip satellite tuner IC
News & Analysis  
4/28/2004   Post a comment
In hopes of increasing its share in the global satellite set-top box market, STMicroelectronics on Tuesday (April 27) unveiled a single-chip silicon tuner designed to receive digital TV or Web-based material via satellite. ST, the world's largest IC supplier for set-top boxes, hopes to reinforce its market position by introducing the new silicon tuner that can be paired with ST's own multi-standard demodulator. That device is widely used in current satellite TV applications. From Paris, Junko Yo
Hybrid Change Makes WLAN QoS Come to Life
News & Analysis  
4/28/2004   Post a comment
HCCA and EDCA channel access mechanisms provides a standardized, interoperable method for enabling QoS capabilities in WLAN-enabled consumer electronics devices.
PMC-Sierra, Vativ Technologies collaborate on interoperable DS3 line cards
Product News  
4/27/2004   Post a comment
Broadband equipment supplier PMC-Sierra, and fab-less semiconductor maker Vativ Technologies announce a collaborative plan to deliver interoperable framer/mapper and line interface units for next-gen voice and data communications. A planned high density, multi-channel DS3 equipment line-card will be the industry's lowest power and highest performance framer/mapper and LIU.
Synopsys keynoter cites crosstalk, power challenges
News & Analysis  
4/27/2004   Post a comment
Crosstalk and power are extremely difficult problems to solve, and will require significant changes to the existing chip design flow, according to Li-Pen Yuan, R&D director for extraction and signal integrity at Synopsys. Yuan offered a keynote speech at the Electronic Design Processes (EDP-2004) methodology conference Monday (April 26).
Freescale creates semi-custom chip operation
News & Analysis  
4/27/2004   Post a comment
Freescale Semiconductor Inc., the former Motorola Inc. unit, has established a semi-custom operation to provide application- and customer-specific chips for networking, communications and embedded-processing applications.
Smallest D/A converter resolves space, performance challenge
Product News  
4/27/2004   Post a comment
Analog Devices introduced the first members of its new nanoDAC family of digital-to-analog converters that provide breakthrough performance in smaller packages. The compact size and low power consumption of these new converters provide significant advantages in space-constrained applications.
Module conditions bridge sensors
Product News  
4/27/2004   Post a comment
Here's news of a signal-conditioning module for bridge-type sensors. It's designed to power and signal-condition most strain gauge or piezoresistive sensors, configured as single-, half-, or full-bridge types.
High-speed data-storage tester meets industry conformance specs
Product News  
4/27/2004   Post a comment
Network and data-storage test house I-TECH is rolling out a test suite that's recognized under the Fibre Channel Industry Association's SANmark Qualified Program.
Li+ charger chip won't overheat
Product News  
4/27/2004   Post a comment
Linear Technology's LTC4059A is a fully integrated linear battery charger in a 2-by-2 mm DFN package that can charge a single-cell Li-Ion battery at 900 mA without danger of overheating itself or surrounding components. A patented thermal regulation scheme prevents the junction temperature of the IC from exceeding 115°C by reducing charge current during high-power or high-ambient-temperature operation. The charger, suited to digital still cameras, cell phones, PDAs and USB-equipped handheld d
Telecom PCI mezzanine card targets high-density connectivity apps
Product News  
4/27/2004   Post a comment
Check out this single-site PCI bus mezzanine card for full-DUX channelized DS3 connectivity. It's designed for data applications requiring high-density connectivity using up to 28 T1 lines, and up to 672 DSOs in clear channel, fractional, and channelized DS3 applications.
Production tester addresses high-speed serial chip tests
Product News  
4/27/2004   Post a comment
Here's news of what may be the semiconductor test industry's first high-speed production tester for identifying the maximum number of product defects at the lowest cost. This system enables signal-integrity testing of high-speed serial links operating as fast as 6.4-Gbits/s, using a loopback/built-in self-test approach. The system promises to deliver cost savings in excess of 50% over conventional at-speed production approaches.
IrDA protocol stack offered with ZiLOG's eZ80Acclaim! MCUs
Product News  
4/27/2004   Post a comment
ZiLOG, Inc. claims to have the embedded industry's first 8-bit flash-based solution for wireless IrDA connectivity. The new solution called ZirDA, is an embedded software product that will be offered with the company's eZ80Acclaim! microcontrollers.
StarCore-based DSPs target VoIP apps
Product News  
4/27/2004   Post a comment
Eying the voice-over-Internet protocol (VoIP) market, Freescale Semiconductor, a wholly owned subsidiary of Motorola Inc., has expanded its solutions for VoIP system designs based on StarCore DSP technology.
Testing 10GE in Transport Environments
News & Analysis  
4/27/2004   Post a comment
The information available at the PCS layer can be a valuable tool in evaluating the performance of 10GE LAN transport applications.
Japanese joint venture to develop super capacitors
News & Analysis  
4/26/2004   Post a comment
Four companies have agreed to form a joint venture company to promote an electric double-layer capacitor system.
Ballast ICs bring transformerless dimming
Product News  
4/26/2004   Post a comment
International Rectifier's 600-volt IR21592 and IR21593 dimming ballast ICs, each with a phase control loop and half-bridge driver for fluorescent lamps, eliminate the need for a current-sensing transformer. IR says these new devices offer the most comprehensive set of sense and control features available, including ignition detection and full-scale dimming, as well as brownout- and over-temperature protection. A microcontroller interface is included for maximum flexibility in programming such pa
Two stretch configurable-CPU arena with new entries
Product News  
4/26/2004   Post a comment
The ranks of configurable CPUs " processors designed to be augmented by customer-specified execution units " will expand significantly today with independent announcements by Faraday Technology Corp. and startup Stretch Inc. The two architectures, both derived from CPU designs, bring new dimensions to the market.
Distributors are ready for a recovery in 2004
Product News  
4/26/2004   Post a comment
An economic recovery in the electronics industry, the transition of U.S. manufacturing to China, demand creation, and the lead-free initiative will highlight the discussions between distributors and components suppliers as they meet for their annual Electronic Distribution Show (EDS) this week in Las Vegas.
Japanese joint venture to develop super capacitors
Product News  
4/26/2004   Post a comment
Four companies have agreed to form a joint venture company to promote an electric double-layer capacitor system. Also know as super, or ultra, capacitors, the next-generation electric charge capacitor could eventually replace nickel-metal-hydride and lithium-ion batteries in certain areas.
Nvidia, Xilinx use CellMath, Arithmatica goes to 65-nm
Product News  
4/26/2004   Post a comment
Arithmatica announces two licensees of its CellMath libraries. Arithmatica claims its technology improves silicon performance and reduces die area through innovations in mathematical circuit blocks.
CompactPCI plug-in serves LEON processor developers
Product News  
4/26/2004   Post a comment
Here's news from a Swiss company offering an FPGA development platform. The Compact PCI development board also supports the early development and fast prototyping of LEON 32-bit microprocessor designs.
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