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Content tagged with Internet of Things Designline posted in May 2001
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SOI wafer supplier Ibis lays off 14% of workforce
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5/31/2001   Post a comment
DANVERS, Mass--Silicon-on-insulator wafer supplier Ibis Technology Corp. today announced it was laying off 14% of its workers, cutting executive salaries, and reducing overall spending in response to the chip industry's downturn.
Intel sets up flash program in Taiwan
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5/31/2001   Post a comment
SANTA CLARA, Calif. -- In a move to capitalize on the new manufacturing model in cellular phones, Intel Corp. has established a supply-chain program for its flash memory customers in Taiwan. But the program is also aimed at keeping its flash chip competitors at bay in Taiwan, most notably Advanced Micro Devices Inc., according to analysts.
Intel sets up flash-memory supply program with Taiwan's cell-phone makers
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5/31/2001   Post a comment
SANTA CLARA, Calif. -- In a move to capitalize on the new manufacturing model in cellular phones, Intel Corp. has established a supply-chain program for its flash memory customers in Taiwan. But the program is also aimed at keeping its flash chip competitors at bay in Taiwan, most notably Advanced Micro Devices Inc., according to analysts.
Altera expects sales to sequentially drop 25% in Q2
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5/31/2001   Post a comment
SAN JOSE -- Altera Corp. here today cut its forecast for second-quarter revenues, warning that sales will drop 25% from $287.4 million in Q1.
IDT projects 44% quarterly decline in revenues
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5/31/2001   Post a comment
Integrated Device Technology, Inc.; today announced during its regular mid-quarter investor teleconference that it has reduced its revenue and earnings outlook for the quarter ending July 1, 2001.
AMCC and Plexus enter into reference design pact
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5/31/2001   Post a comment
Applied Micro Circuits Corp., San Diego, and Plexus Corp., Neenah, Wisc., announced today that they have entered into a strategic design partnership.
Altera now expects revenue decline of 25%
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5/31/2001   Post a comment
Altera Corp. today reduced its revenue guidance for the second quarter ending June 30, saying it now expects that revenues in quarter are likely to decline in the range of 25% from first quarter revenues of $287.4 million compared with earlier guidance for a 20% sequential decline.
Chip equipment trade groups merge, creating new SEMI North America division
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5/31/2001   Post a comment
AUSTIN, Tex. -- A U.S. industry group, previous called SEMI/Sematech, has merged with the Semiconductor Equipment and Materials International (SEMI) trade group.
KLA-Tencor taps third-party tests for compatibility to 300-mm standards
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5/31/2001   Post a comment
WILLISTON, Vt. -- CCS Technology Inc. here announced it will supply communications testing capability to KLA-Tencor Corp., which will use the technology to ensure that new equipment interfaces comply with plug-and-play interface standards.
Taiwan EMS firm lands China contract
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5/31/2001   Post a comment
TAIPEI, Taiwan -- Legend Holdings Ltd., the biggest PC company in China, will raise its notebook PCs procurement from Taiwan's First International Computer Inc.
Fujitsu, Infineon add app-specific DRAMs
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5/31/2001   Post a comment
Fujitsu Microelectronics Inc. and Infineon Technologies NA Corp. will roll out two new application-specific DRAMs later this year, adding to the list of specialty memory parts each company is now separately gearing up to produce.
Agere sues Proxim in growing patent fight over wireless LAN technology
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5/31/2001   Post a comment
ALLENTOWN, Pa. -- Agere Systems Inc. today announced it was suing Proxim Inc. for patent infringement in a growing legal fight over technology rights in high-speed wireless local area networks.
STMicro to close Ottawa fab, cut capital spending to $1.5 billion
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5/31/2001   Post a comment
GENEVA--STMicroelectronics today announced it was cutting its capital spending plans to $1.5 billion from a previous budget of $1.9 billion this year and closing down its production wafer fab in Ottawa in response to the semiconductor downturn.
Philips Semi, Cadence's Tality unit team up in Bluetooth solutions
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5/31/2001   Post a comment
EINDHOVEN, the Netherlands -- Philips Semiconductors here today announced a strategic partnership with the design services subsidiary of Cadence Design Systems Inc. to provide complete embedded solutions for wireless connections using Bluetooth radio-frequency links.
SigmaRAM group to roll out memory roadmap, first products for fast networks
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5/31/2001   Post a comment
SAN JOSE -- Attempting to play catch up in the market, the SigmaRAM Consortium next month will finally unveil its roadmap and first wave of SRAM products for high-performance networking applications.
Corrent to unveil next-generation security processor next month
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5/31/2001   Post a comment
TEMPE, Ariz. -- Look for Corrent Corp. next month to roll out its first product--a high-end security processor for next-generation networking applications.
Three activate OLED
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5/31/2001   Post a comment
DuPont Displays is joining forces with Philips Components and US start-up Alien Technology to develop active matrix polymer organic LED (OLED) on plastic technology.
Incubation for frozen switch
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5/31/2001   Post a comment
US-based incubator Atlantic Technology Ventures has signed an agreement to license optical technology from the University of Rochester, New York, for use in its refrigerated network kit.
Twin-DAB decoder steps in for fast WAP
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5/31/2001   Post a comment
Panasonic is developing a demonstration handheld device that will use digital audio broadcasting (DAB) to send data and avoid the waiting times of WAP phones.
Band-gap control boost to displays
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5/31/2001   Post a comment
Toronto-based company Luxell Technologies has developed a technique to improve the efficiency of thin-film electroluminescent (EL) displays by controlling the band-gap within the active layer.
Tiny moulds make 3D structures
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5/31/2001   Post a comment
Engineers at the NanoStructure Laboratory at Princeton University have developed a lithographic printing technique to produce 3D structures smaller than 40nm.
Cypress acquires USB designer ScanLogic
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5/30/2001   Post a comment
Cypress Semiconductor Corp. today announced the acquisition of ScanLogic Corp., a privately-held company specializing in Universal Serial Bus (USB) controllers for embedded applications.
Trikon aims new CVD low-k dielectric materials at 90-nm copper processes
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5/30/2001   Post a comment
NEWPORT, Wales --Trikon Technologies Inc. today announced a new series low-k dielectric materials for chemical vapor deposition (CVD) of insulating layers in copper dual damascene interconnect processes at the 0.90-nm (0.09-micron) technology node.
LG Electronics to use E2open for design
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5/30/2001   Post a comment
Building on the success of a pilot program, LG Electronics Inc. will implement E2open's product collaboration offering to coordinate its design process.
Catalyst posts 27% sequential drop in sales during quarter
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5/30/2001   Post a comment
SUNNYVALE, Calif.--Catalyst Semiconductor Inc. here today reported a 27% sequential drop in revenues to $17.3 million in the company's fiscal fourth quarter, ended April 30, compared to $23.6 million in the prior three-month period. Catalyst's sales were up 1% from $17.1 million in the fiscal fourth quarter last year.
Cypress acquires ScanLogic to bring USB into non-PC markets
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5/30/2001   Post a comment
SAN JOSE -- In a move to expand its presence in the Universal Serial Bus (USB) device market, Cypress Semiconductor Corp. here today announced it will acquire ScanLogic Corp. of Burlington, Mass. With the acquisition of ScanLogic, Cypress will expand its USB presence into some new and emerging non-PC markets. ScanLogic's host/slave USB chip family is designed for use in PDAs, cellular phones, set-top boxes, digital cameras, Internet appliances and automotive communication systems.
Toshiba licenses IP cores from Germany's sci-worx for SOC designs
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5/30/2001   Post a comment
TOKYO -- In a move to expand its system-on-a-chip portfolio, Japan's Toshiba Corp. has licensed the intellectual-property (IP) cores from sci-worx GmbH of Hanover, Germany. Under the agreement, sci-worx will license its DesignObjects family of IP cores to Toshiba. The DesignObjects library consists of over 65 soft cores, including a complete portfolio of products for multimedia and networking applications.
Silicon material shipments fall 14% in Q1 from prior quarter
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5/30/2001   Post a comment
SAN JOSE--Worldwide shipments of blank wafer substrates declined by 14% in the first quarter compared to volumes in Q4 of 2000, reported the Semiconductor Equipment and Materials International (SEMI) trade group here today.
JEDEC adopts standard for DDR333
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5/30/2001   Post a comment
JEDEC Tuesday announced that a new industry standard has been adopted for DDR333, the highest yet approved for double data rate 167-MHz clock rate SDRAMs.
Intel to bundle RealNetworks' Internet-enabled software on motherboard lines
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5/30/2001   Post a comment
SEATTLE -- RealNetworks Inc. here today announced an agreement with Intel Corp. under which RealNetworks' Internet-enabled, media-management software will be bundled with Intel's new PC motherboard lines. Under the terms, RealNetworks' RealPlayer and RealJukebox software will be offered with Intel's new D815EEA2 and D815EFV line of motherboards. The boards themselves support Intel's Pentium III and Celeron processors.
Kingston no longer paying DRAM royalties to Sun
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5/30/2001   Post a comment
Kingston Technology Inc. Tuesday said the firm no longer is paying 5% royalties to Sun Microsystems as part of its recent settlement of a patent infringement lawsuit.
Avnet to distribute Raychem circuit protection devices
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5/30/2001   Post a comment
Tyco Electronics Corp. has signed Avnet as an authorized distributor for the PolySwitch, Power Switch, and SiBar circuit protection components from its Raychem Circuit Protection division in North and South America.
Peregrine to create rad-hard SOS process for U.S. defense foundry
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5/30/2001   Post a comment
SAN DIEGO--Peregrine Semiconductor Corp. here today announced a development and technology supply agreement with the U.S. Department of Defense for radiation hardened ICs based on submicron ultra-thin silicon-on-sapphire (SOS) processes.
Korean chip companies turn to foundry work to cope with downturn
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5/30/2001   Post a comment
Foundry services are becoming increasingly important to South Korea's semiconductor industry, partly as a means of utilizing aging fabs no longer useful for memory production.
Micron and Infineon to co-develop low-latency memory
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5/30/2001   Post a comment
Infineon Technologies AG and Micron Technology, Inc., today announced they signed an agreement to co-develop a new family of Reduced Latency DRAM (RLDRAM) for high-performance memory applications. Infineon and Micron are aiming RLDRAM at switches, routers and other high-bandwidth latency-sensitive applications.
Altera and Nortel sign long-term agreements
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5/30/2001   Post a comment
Altera Corp. and Nortel Networks today announced a 5-year supply pact as well as a set of long-term agreements that address cooperation on future products and technology.
Altera, Nortel strike R&D alliance and five-year PLD supply pact
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5/30/2001   Post a comment
SAN JOSE -- Altera Corp. here today announced a long-term agreement with Nortel Networks Corp. to cooperate in development of future products and technologies. In addition to the R&D pact, Nortel has signed a five-year purchasing agreement to gain access to Altera programmable logic devices and system-on-a-programmable-chip (SoPC) solutions.
ADC to restructure operations after sales drop
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5/30/2001   Post a comment
ADC, the fibre-optic network equipment company saw sales for the second quarter of 2001 decline by 15% from the same quarter's value in the previous. They were in line with the guidance that the company gave last month, coming in at $652m.
MBO at Cornish resistor maker
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5/30/2001   Post a comment
Cornwall-based resistor manufacturer Arcol UK has been bought by its management.
Infineon, Micron to develop reduced latency DRAMs for high-speed systems
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5/30/2001   Post a comment
MUNICH -- Infineon Technologies AG and Micron Technology Inc. today announced plans to co-develop a new series of reduced latency DRAMs for high-performance memory applications, such as switches, routers, and other high-bandwidth systems.
Japan's reign on top of chip gear sales will be short lived, predict analysts
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5/30/2001   Post a comment
SAN JOSE -- Japan stunned most industry observers by becoming the world's largest semiconductor equipment market in the first quarter of 2001. For a variety of reasons, equipment shipments in Japan surged 31.7% in Q1 from the prior quarter while other regions nose-dived, according to new data released last week (see May 23 story). But now, most industry analysts expect Japan's capital spending to plunge as well in the second
Intel finds more money for formal methods
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5/30/2001   Post a comment
Intel Capital, the investment arm of the world's largest chip maker, has take part in a third round of venture capital funding for France-based Esterel Technologies. The funding is worth €12.3m.
Cirrus to integrate Silicon Wave's Bluetooth technology in processors
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5/30/2001   Post a comment
SAN DIEGO--Silicon Wave Inc. here announced it has licensed Bluetooth wireless connectivity technology to Cirrus Logic Inc., which plans to integrate the function into its Maverick microprocessors for consumer products, such as Internet audio players, personal digital assistants (PDAs) and electronic books.
Applied to buy Israel's Oramir to expand wafer-defect control systems
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5/30/2001   Post a comment
SANTA CLARA, Calif.--Applied Materials Inc. today announced plans to acquire Oramir Semiconductor Equipment Ltd., an Israeli-based supplier of advanced laser cleaning technologies for wafer fabs. The acquisition will expand Applied Material's portfolio of wafer-defect control systems, said company officials.
Shipley enters spin-on low-k dielectric arena with porous film process
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5/29/2001   Post a comment
MARLBOROUGH, Mass. -- Shipley Co. L.L.C. today entered the spin-on dielectric market for next-generation interconnects on ICs with the launch of a new porous material, called Zirkon LK. The porous film can be applied with standard dielectric spin-coating tools for k values between 2.6 and 2.0, according to the company.
Kopin reports HBT advancements with band-gap engineering techniques
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5/29/2001   Post a comment
TAUNTON, Mass. -- Kopin Corp. here today claimed a key milestone in next-generation power amplifier technology using heterojunction bipolar transistors (HBTs), based on gallium-indium-arsenide-nitride (GaInAsN) substrates.
LSI Logic acquires RAID storage business
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5/29/2001   Post a comment
LSI Logic Corp., Milpitas, Calif., and American Megatrends, Inc., Atlanta, today announced an agreement in which LSI Logic will acquire the assets of AMI's RAID (Redundant Array of Independent Disks) business.
Via launches 750MHz microprocessor
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5/29/2001   Post a comment
TAIPEI, Taiwan -- In a bid to grab market share in the tough microprocessor business, Via Technologies Inc. has launched a 750 MHz CPU that targets the low-end PC and information appliance products.
How 2001 downturn will impact regions, chip segments
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5/29/2001   Post a comment
TAIPEI, Taiwan -- The big losers in chip revenues this year will be the Americas and Asia Pacific markets as well as memories, bipolar digital ICs, and "micro" product segments, according to the new World Semiconductor Trade Statistics (WSTS) forecast issued this week.
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