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Content tagged with Internet of Things Designline posted in May 2002
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TEL's cleaning tool picked by Sematech for low-k process evaluations
News & Analysis  
5/31/2002   Post a comment
AUSTIN, Tex. -- Tokyo Electron Ltd. today announced that its PR200Z polymer removal system has been chosen as the process tool of record for International Sematech's Advanced Tool Development Facility and copper-oxide frontend line.
Agere re-enters USB chip market with analog companion to digital ASICs
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5/31/2002   Post a comment
ALLENTOWN, Pa. -- Agere Systems Inc. today introduced a USB 2.0 analog chip for customized digital-only ASICs serving the Universal Serial Bus 2.0 standard. The introduction is a change in course for Agere, which last year announced it was pulling out of the USB 2.0 market to focus more attention of 1394b serial links (see July 16 story).
Agilent supplies ASICs for HP's Itanium 2-based systems
News & Analysis  
5/30/2002   Post a comment
PALO ALTO, Calif.--Agilent Technologies Inc. here today disclosed it is using 0.18-micron ASIC technology to ship a three-chip set solution to Hewlett-Packard Co. for workstations and servers based on Intel Corp.'s 64-bit Itanium 2 microprocessors.
Intel fills out development support for network processor lineup
News & Analysis  
5/30/2002   Post a comment
SANTA CLARA, Calif.--Intel Corp. today rolled out two new hardware development platforms aimed at easing the job of designing communications systems, based on the company's IXP2800 and IXP2400 network processors. The two new platforms fill out Intel's development tools for its new network processors.
Agere works with Silicon Labs to offer new soft modem chip sets
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5/30/2002   Post a comment
ALLENTOWN, Pa. -- Agere Systems Inc. today said it has developed two next-generation chip sets for "soft" modem functions in desktop personal computers and notebook PCs that could dramatically reduce the space and cost of analog dial-up communications.
Philips design team wins EDAC award
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5/30/2002   Post a comment
Circuit inverts temperature sensor output with accuracy
News & Analysis  
5/29/2002   Post a comment
Jerry Steele returns: A well known apps engineer cracks his knuckles on a signal conditioning circuit for Maxim.
Current Mirrors with a DCP offer precision and current gain control
News & Analysis  
5/29/2002   Post a comment
For applications that require or desire a computer controlled variable current, the use of a digitally controlled potentiometer and a current mirror with degeneration provides a low cost solution. A Xicor apps engineer examines some circuits.
Denali's on-chip bandwidth processor core targets memory efficiency
News & Analysis  
5/29/2002   Post a comment
PALO ALTO, Calif. -- Denali Software Inc. here said it has developed an on-die programmable memory controller core to allow system-on-a-chip designers get much higher memory efficiency in their products.
Intel predicts Itanium 2 will double performance of enterprise computing
News & Analysis  
5/29/2002   Post a comment
MUNICH -- During a meeting with European systems developers here, Intel Corp. today predicted that its upcoming 64-bit Itanium 2 microprocessor will deliver up to 1.5-to-2 times the performance of today's enterprise computers, based on existing Itanium processors.
Networking Systems Require Tight Control/Data Plane Integration
News & Analysis  
5/29/2002   Post a comment
Treating data plane and control plane processors as separate entities won't work in next-generation networking architectures. System architectures must optimally share resources between these two planes to hit 10-Gbps data rates and beyond.
Silicon fingerprint sensor enables low-cost security
News & Analysis  
5/28/2002   Post a comment
Forgot your PIN? Lost your access card? Password hacked? Put these security woes to bed. Your fingerprint neatly carries all that's needed to ensure secure access for a host of applications. A capacitive-based sensing chip makes fingerprint access practical.
Intel cuts MPU prices thanks to yields from 300-mm wafers, 0.13-micron process
News & Analysis  
5/28/2002   Post a comment
SANTA CLARA, Calif. -- Intel Corp. has cut the prices of 21 microprocessor products by a range of 9-to-53% as the company's investments in 300-mm wafer fabs and 0.13-micron processes helped to drive down production costs, according to a spokesman here today.
Agilent claims first single-chip mapper for Gigabit-over-Sonet solutions
News & Analysis  
5/28/2002   Post a comment
PALO ALTO, Calif.--Agilent Technologies Inc. today announced the first single-chip solution for Gigabit Ethernet over Sonet and Synchronous Digital Hierarchy (SDH) networks. The Ethernet-over-Sonet (EoS) mapper chip integrates a serializer/deserializer (SerDes), clock data recovery and OC-3 to OC-48 framer functions, Agilent said
Mentor's Calibre, IMEC labs formalize R&D efforts in 193- and 157-nm lithography
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5/28/2002   Post a comment
WILSONVILLE, Ore.--Mentor Graphics Corp. here today announced its Calibre division has struck an R&D alliance with the IMEC research group in Europe to jointly pursue new resolution enhancement technology (RET) for subwavelength lithography used with 193- and 157-nm exposure tools.
Intel aims R&D center in Spain at low-power processor designs
News & Analysis  
5/28/2002   Post a comment
MUNICH -- During the European version of the Intel Developer Forum (IDF) here today, Intel Corp. and a major university in Spain announced plans to team up and open a new R&D laboratory to develop next-generation microprocessor designs.
Nazomi sues ARM for patent infringement in Java acceleration circuits
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5/28/2002   Post a comment
SANTA CLARA, Calif.--Nazomi Communications Inc. here today announced a patent infringement lawsuit against ARM Ltd., accusing the U.K.-based processor core supplier of violating its technology for Java-software acceleration.
Samsung speeds ramp of 512-Mbit DDR-II chips after evaluations with IBM
News & Analysis  
5/28/2002   Post a comment
SEOUL -- Samsung Electronics Co. Ltd. today announced plans to begin volume production of 512-megabit DDR-II synchronous DRAMs in the third quarter this year after successfully completing system-level evaluation on prototype 128-Mbit DDR-II devices with IBM Corp.
Intel quits InfiniBand, but will support its deployment
News & Analysis  
5/24/2002   Post a comment
Despite Intel's announcement yesterday that it would no longer produce InfiniBand host channel adapters (HCAs), Intel and observers were quick to say that the semiconductor giant will continue to support and play an instrumental role in InfiniBand's deployment.
DRAM prices tumble, but 3Q shortage looms
News & Analysis  
5/24/2002   Post a comment
Weak demand sent contract prices for 128Mbit SDRAM plummeting as much as 20% in May.
ITC to review Toshiba vs. Samsung patent case
News & Analysis  
5/24/2002   Post a comment
The U.S. International Trade Commission voted to investigate Toshiba's patent infringement complaint against Samsung Electronics and its U.S. subsidiaries.
Asyst will spend $66 million to set up AMHS venture with Japan's Shinko
News & Analysis  
5/24/2002   Post a comment
FREMONT, Calif.--Asyst Technologies Inc. today announced a definitive agreement in its previously announced plans to set up a joint venture for wafer fab automated material handling systems (AMHS) with Shinko Electric Co. Ltd. of Japan.
SIA applauds passage of trade bill
News & Analysis  
5/23/2002   Post a comment
The Semiconductor Industry Association today applauded the United States Senate's passage of the Trade Promotion Authority, which will allow the Administration to negotiate to further open foreign markets to U.S. high technology exports.
Synergy Needed For 10-Gbps Backplanes
News & Analysis  
5/23/2002   Post a comment
Designers can no longer view passive and adaptive backplane components as separate islands. To hit the 10-Gbps range, designers must develop interconnects, board traces and adaptive equalization techniques in tandem.
IBM, Sony to jointly offer chip solutions for digital TV in Europe
News & Analysis  
5/22/2002   Post a comment
LONDON -- Sony Corp.'s Semiconductor & Devices Europe (SDE) subsidiary and IBM Corp.'s Microelectronics Division today announced plans to offer complementary and compatible products for set-top box developers in the European market.
TI claims one of the densest SRAM blocks on processor with 0.13-micron process
News & Analysis  
5/22/2002   Post a comment
DALLAS -- Texas Instruments Inc. today announced it is using a 0.13-micron copper CMOS process to fabricate and begin shipments of a 180-million transistor multiprocessor IC for telecom applications, providing more than 200 pulse-code modulation (PCM) channels on a chip.
Cutting Power in Turbo Coding Architectures
News & Analysis  
5/22/2002   Post a comment
Turbo coding schemes can be a power hog in 3G wireless system designs. This article lays out a decoding architecture that reduces power requirements through improvements in SNR and BER.
Cymer, LTB to develop measurement tools for DUV light sources
News & Analysis  
5/21/2002   Post a comment
SAN DIEGO -- Cymer Inc. here and Germany's LTB Lasertechnik Berlin GmbH today announced plans to jointly develop advanced spectrometer systems for measuring the spectral performance of deep-ultraviolet (DUV) light sources.
Advantest, Synopsys team up on failure diagnostics for complex ICs
News & Analysis  
5/21/2002   Post a comment
SANTA CLARA, Calif. -- Advantest Corp. announced it was collaborating with Synopsys Inc. to develop a fast, accurate failure diagnostics system for deep-submicron system-on-chip (SoC) designs. The failure diagnostics tools will leverage Synopsys' TetraMAX automatic test pattern generation (ATPG) technology, said Advantest.
Advanced Energy plans to appeal verdict in MKS patent suit
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5/21/2002   Post a comment
FORT COLLINS, Colo. -- Advanced Energy Industries Inc. today promised to appeal a jury's verdict awarding $4.2 million in damages to MKS Instruments Inc. in a patent lawsuit against the Colorado-based company.
Counteracting Impairments in Comm Interface Designs
News & Analysis  
5/21/2002   Post a comment
Skew and lossy interconnects plague today's networking chip interfaces. Fortunately, automatic skew compensation, equalization, and more are here to help.
MKS says it won $4.2 million in patent suit against Advanced Energy
News & Analysis  
5/20/2002   Post a comment
ANDOVER, Mass. -- MKS Instruments Inc. today announced it won $4.2 million in damages from a federal court jury in a patent lawsuit against Advanced Energy Industries Inc. of Fort Collins, Colo.
Storage switches need fast, programmable data path processors
News & Analysis  
5/20/2002   Post a comment
To effectively consolidate networked attached storage (NAS), SANs and other emerging storage solutions into a single storage infrastructure, will require an intelligent storage networking switch that includes data path processing performance in the tens of Gigabits/second.
Scalable virtual ring detector aims at fault tolerant distributed computing
News & Analysis  
5/20/2002   Post a comment
In many distributed computer systems, there are large numbers of computers or processing nodes that control various facets of the system.
Infiniband backs 'blade' servers
News & Analysis  
5/20/2002   Post a comment
With the convergence of telecom/datacom switching centers and traditional LAN and Internet-based data centers, a distributed server architecture based on "blades" is emerging.
AMD's Austin fab ramps flash memories, plans last processor in Q3
News & Analysis  
5/20/2002   Post a comment
AUSTIN, Tex. -- Advanced Micro Devices Inc. today said its 200-mm wafer Fab 25 here is now ramping volume production of 32- and 64-megabit flash chips using a 0.17-micron process technology after beginning a transition from microprocessor production to nonvolatile memories.
'Linda' spans telecom/Web servers
News & Analysis  
5/20/2002   Post a comment
Many limitations of current servers and the failover techniques used to achieve the appropriate level of reliability necessitate compromises when applied to telecom services.
TI aims to beat 300-mm savings estimates with layouts, shrinks, and automation
News & Analysis  
5/17/2002   Post a comment
DALLAS -- Texas Instruments Inc. figures it can beat industry estimates for cost savings from 300-mm wafers with chip-layout tricks and by aggressively pushing device shrinks after the company completes qualification of its new 0.13-micron (130-nm) process technology in a 300-mm fab here next month.
Valley control: One power management trick for new generation PCs
News & Analysis  
5/15/2002   Post a comment
Pentium-based computers can demand up to 60 amps from 1-V line. But powering the CPU core is only one challenge: clocks, peripherals, PCI and graphics bus drivers - even DDR memory - demand a variety of voltages and currents from an otherwise "Green PC." IMVP demands more aggressive power management techniques. This Fairchild engineer explores the main challenges for powering both desktop and notebook PCs.
Soitec qualifies ASM's vertical furnace for 300-mm SOI wafer production
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5/15/2002   Post a comment
BERNIN, France -- Silicon-On-Insulator Technologies SA (Soitec) here has qualified a 300-mm wafer vertical furnace supplied by ASM International N.V. for mass production of silicon-on-insulator (SOI) substrates.
157-nm lithography will be ready when needed, concludes Sematech meeting
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5/15/2002   Post a comment
AUSTIN, TEX. -- Optimism is growing over the prospects of 157-nm lithography being ready sooner than other next-generation exposure technologies, said International Sematech today following an annual meeting of experts.
Credence cuts mixed-signal test costs with building-block approach
News & Analysis  
5/15/2002   Post a comment
FREMONT, Calif. -- Credence Systems Corp. today rolled out its newest configurable chip tester for mixed-signal ICs, saying that the ASL 2000MS system will support low-cost testing with a highly-flexible "building-block" architecture.
Motorola licenses MoSys' one-transistor SRAM technology for embedded memory
News & Analysis  
5/15/2002   Post a comment
SUNNYVALE, Calif.--MoSys Inc. today announced it has licensed its one-transistor SRAM technology to Motorola Inc. for embedded memory applications in IC designs. Terms of the agreement were not released.
Validating digital products with simple analogue techniques
News & Analysis  
5/15/2002   Post a comment
Digital signals travelling along a circuit board or between logic chips do have measurable analogue characteristics, and overlooking these characteristics can compromise the reliability of the final product.
Developing Flows for 3G FDD Modem Designs
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5/15/2002   Post a comment
Frequency division duplexing (FDD) has emerged as the early modem winner in 3G wireless architectures. Now design engineers must implement and rework design flows to build these complex modem designs.
Brooks-PRI says its double size of nearest competitor in fab automation
News & Analysis  
5/15/2002   Post a comment
CHELMSFORD, Mass.--After seven months of planning and antitrust review, Brooks Automation Inc. today announced completion of its acquisition of PRI Automation Inc. to form the industry's largest supplier of fab automation systems.
Compact silicon drives color phones
Teardown  
5/14/2002   Post a comment
The Sony-Ericsson T68 mobile phone exemplifies the kind of feature-rich, high-margin handset the wireless industry is banking on for future profits. Its hardware design reflects the trend toward more compact, powerful silicon.
Infineon offers 1,200-V transistors with TrenchStop, FieldStop technologies
News & Analysis  
5/14/2002   Post a comment
NUREMBERG, Germany-- During a power electronics trade show here today, Infineon Technologies AG announced a new generation of insulated-gate bipolar transistors (IGBTs) for voltage ranges up to 1,200 V in compact system designs.
Page 1 / 3   >   >>


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