Audio test & measurement seminar in UK (June 2-3) News & Analysis 5/25/2011 Post a comment A two-day audio test and measurement training seminar held by Prism Sound and its UK distribution partner, TTi distribution, will introduce engineers to the practical and theoretical aspects of accurately measuring audio for a wide variety of applications.
Mixed-signal MCUs on 90nm process Product News 5/25/2011 Post a comment Targeting designers of industrial and consumer applications who need solutions with low power consumption and increased integration, Freescale has introduced the ColdFire+ MCF51Qx and MCF51Jx microcontroller families.
IBM to test wafer pruning News & Analysis 5/25/2011 10 comments IBM will test a wafer pruning technique developed at the University of California at Los Angeles said to spot bad wafers early with test structures in-between die that can reject wafers before costly metallization steps.
Nomura sees 2011 chip market growth of 4.4% News & Analysis 5/25/2011 5 comments Brokerage firm Nomura Securities has raised its forecast for growth in the value of the global semiconductor market to 4.4 percent, an increase from its previous projection of 3.1 percent given in December 2010.
Applied braces for sales decline News & Analysis 5/24/2011 Post a comment Applied Materials, the largest maker of semiconductor production equipment, reported second quarter sales and earnings that exceeded analysts' expectations but said it expects sales for the current quarter to decline due to sluggish near-term economic conditions.
IHS: Tablet's rise hurt Q1 PC sales News & Analysis 5/24/2011 10 comments First quarter global PC sales declined by 0.3 percent compared to the first quarter of 2010, in part because of rising interested in Apple's iPad and other tablets, according to IHS iSuppli.
Tessera loses appeal of ITC ruling News & Analysis 5/24/2011 1 comment The U.S. Court of Appeals for the Federal Circuit affirmed a decision by the U.S. International Trade Commission that DRAM vendors did not infringe on a Tessera patent by using wBGA laminate-based package substrates.
IMEC, Atrenta to show 3-D design flow at DAC Product News 5/24/2011 3 comments EDA company Atrenta Inc., working with the IMEC research institute on a 3-D integration project, has developed a planning and partitioning design flow for heterogeneous 3-D stacked IC assemblies. They plan to demo the flow at the DAC exhibition.
Analyst predicts OLED lighting market News & Analysis 5/24/2011 4 comments The global market for OLED lighting will be $4.8 billion in 2016, according to market research firm NanoMarkets LLC. Of that Europe will be responsible for $1.5 billion in OLED lighting panel sales and Asia is expected to provide $2.1 billion.
PMC-Sierra leaps into 40G optical News & Analysis 5/24/2011 1 comment PMC-Sierra announced a 40G coherent optical transceiver in 40nm CMOS, one day after startup ClariPhy revealed its progress on a similar part.
Foxconn blast may cause iPad shortfall News & Analysis 5/23/2011 9 comments The explosion that ripped through a Foxconn plant in Chengdu, China, late last week—killing three—could result in a production loss of 500,000 Apple iPad 2 tablets in the second quarter, according to a report by market research firm IHS iSuppli.
ClariPhy samples 40G coherent chip News & Analysis 5/23/2011 1 comment Clarify is sampling a chip aimed for upgrading long distance optical networks to 40G, part of a rising tide of silicon for next-generation carrier and data center nets.
Plastic optics boosted to 25 Gbit/s News & Analysis 5/23/2011 1 comment Scientists at the Georgia Institute of Technology reporting successful operation of s new vertical-cavity surface-emitting laser technology from VI Systems at 25 Gbits per second.
NI to buy EDA vendor and RF design firm News & Analysis 5/23/2011 6 comments National Instruments Inc. has signed a definitive agreement to acquire AWR Corp. a supplier of EDA software for designing high-frequency components and systems. The purchase price of $58 million includes $7 million in cash on the AWR balance sheet, NI said.
Marvell to invest $200 million in Israel R&D News & Analysis 5/23/2011 1 comment Communications chip company Marvell Technology Group Ltd., is reportedly planning to invest $200 million in its Israel R&D operation. The company's co-founders – Sehat Sutardja, CEO, chairman, and Weili Dai, chief operating officer – who are also husband and wife, are reportedly visiting Israel.
Redpine rolls flexible Wi-Fi chip set News & Analysis 5/23/2011 1 comment The Maxi-Fi Beam450 from Redpine Signals can be configured to deliver a single 450 Mbits/s link or simultaneous 150 and 300 Mbits/s links over 2.4 and 5 GHz bands.
Open source protocol targets 'Internet of things' Product News 5/22/2011 Post a comment NXP Semiconductors has announced it will make the IEEE 802.15.4 based wireless connectivity network layer software it inherited from the acquisition of Jennic, JenNET-IP, open source, in a bid to generate greater interest in the 'Internet of Things' concept.
EEPROM features AES-CCM Authentication Product News 5/22/2011 Post a comment An extension to Atmel’s CryptoAuthentication family, the ATAES132 devices, offer secure data storage using the AES authentication for industrial, consumer, computing and embedded applications with flexible key management features and secure counters.
What are the engineering and design challenges in creating successful IoT devices? These devices are usually small, resource-constrained electronics designed to sense, collect, send, and/or interpret data. Some of the devices need to be smart enough to act upon data in real time, 24/7. Are the design challenges the same as with embedded systems, but with a little developer- and IT-skills added in? What do engineers need to know? Rick Merritt talks with two experts about the tools and best options for designing IoT devices in 2016. Specifically the guests will discuss sensors, security, and lessons from IoT deployments.