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Content tagged with Internet of Things Designline posted in May 2012
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Arizona display center develops 7.4-inch protoype OLED
News & Analysis  
5/31/2012   3 comments
An Arizona State University display center working with Army researchers have developed a 7.4-inch OLED prototype device using mixed oxide thin film transistors.
JST PNI series crimp-style connectors
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5/31/2012   Post a comment
JST's crimp-style connectors offer both wire-to-board and wire-to-wire applications on a 2mm pitch.
Cortus APS5 32-bit MCU IP core has high max frequency
Product News  
5/31/2012   Post a comment
Cortus has launched the high performance, high throughput 32-bit APS5 RISC microcontroller IP core, which combines good integer computational performance with a high maximum clock frequency.
Vishay VJ5301M868MXBSR, VJ5601M868MXBSR, VJ5301M915MXBSR and VJ5601M915MXBSR multilayer ceramic chip antennas
Product News  
5/31/2012   Post a comment
Vishay's surface-mount multilayer ceramic chip antennas for operation at 868 MHz and 915 MHz offer small 35 mm x 5 mm x 1.2 mm and 15.5 mm x 10.5 mm x 1.2 mm outlines.
Texas Instruments TPS92550 and TPS92551 DC/DC LED driver modules
Product News  
5/31/2012   2 comments
TI's latest DC/DC LED driver modules incorporate all the required power and passive circuitry into a single IC package to deliver up to 23W of power to the LED.
Slideshow: Pinpoint splashdown ends first visit to space station
News & Analysis  
5/31/2012   27 comments
The Dragon cargo ship returned to Earth on May 31 after completing a nearly flawless first mission to the International Space Station. We present a mission summary.
Snapped up before DAC – there will be no Missing Link
News & Analysis  
5/31/2012   1 comment
One of the new exhibitors for DAC this year has been snapped up before the show begins….
Nissan turns auto/home power-sharing into reality
News & Analysis  
5/31/2012   13 comments
Nissan launched here what it calls its “Leaf-to-home” power supply system, designed to turn Nissan’s electric vehicle Leaf into a backup electricity supply for residential homes.
Samsung, LG lead on tablet displays
News & Analysis  
5/31/2012   4 comments
Thanks to continued strong sales of Apple iPad and Amazon Kindle Fire, Korean display makers Samsung Electronics Co. Ltd. and LG Electronics Inc. remained the top suppliers of tablet screens in 2011, with more than 80 percent of all shipments combined, according to IHS iSuppli.
Intel phone debuts in China
News & Analysis  
5/31/2012   11 comments
Intel has released another Atom-powered smartphone, this time by Chinese electronics vendor Lenovo Group, which said it will put out an Intel Inside device at CES 2012 back in January.
Freescale pushes wireless recharge
News & Analysis  
5/31/2012   15 comments
Freescale Semiconductor's reference designs for recharging tablets and smartphones allow automobiles, airports, coffee shops and other public areas to supply almost invisible recharging stations built into tables, kiosks or nearly any horizontal surface.
Meshlium Xtreme enables 3G connectivity to ZigBee, Wifi, and Bluetooth sensors
Product News  
5/30/2012   Post a comment
Meshlium Xtreme is the new multiprotocol router for wireless sensor networks designed to connect ZigBee, Wifi and Bluetooth sensors to the Internet through 3G connectivity, opening a wide range of possibilities for Internet of Things development.
TSMC to use Mentor YieldEnhancer SmartFill at 20-nm
Product News  
5/30/2012   Post a comment
Mentor Graphics said TSMC would use the SmartFill capability in its Calibre YieldEnhancer product in 20-nm semiconductor manufacturing.
Insufficient baseband chip supply hurting LTE smartphone sales
News & Analysis  
5/30/2012   9 comments
Since there has been greater than originally expected demand for LTE smartphones and tablets, international vendors are worried that their shipments are not enough to meet demand due to short supply of LTE solution chips from Qualcomm, currently the only provider of integrated multimode 3G/4G LTE baseband chips.
Breakthrough automatic partitioning tool from Flexras Technologies
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5/30/2012   Post a comment
New automatic partitioning tool boosts FPGA-based prototyping performance by 10X.
HP cuts data center power in lab tests
News & Analysis  
5/30/2012   13 comments
Engineers at HP Labs claim they have demonstrated software in a research setting that significantly lowers power consumption for large data centers.
Xilinx ships the world’s first heterogeneous 3D FPGA
Product News  
5/30/2012   5 comments
The 3D integration of 28 Gbps transceivers enables breakthrough bandwidth and signal integrity for Nx100G and 400G line card solutions.
Globalfoundries selects Synopsys' tool for yield management
News & Analysis  
5/30/2012   Post a comment
Globalfoundries has selected Synopsys' Yield Explorer tool for use as part of its next-generation yield management system for faster yield ramp based on volume diagnostics, Synopsys said.
Invisible bike helmet protects with air-bag shell
News & Analysis  
5/30/2012   31 comments
Motion sensors and microcontrollers from STMicroelectronics enable the operation of the airbag bicycle helmet invented by Hövding, a Swedish design house.
R&S interlock unit ensures safe operation of ATE
Product News  
5/30/2012   Post a comment
The unit can be customized to meet specific requirements.
UIS turnkey service automates leak-testing operations
Product News  
5/30/2012   Post a comment
UIS offers a single-source turnkey service for both semiautomated and fully automated leak-testing applications.
Tektronix optical analyzer teams with sampling scope
Product News  
5/30/2012   Post a comment
Analyzer is compatible with both real-time and equivalent-time oscilloscopes.
Marvell wins as Dell starts shipping ARM-based servers
News & Analysis  
5/30/2012   7 comments
Dell Inc. said it has started shipping server computers called Copper based on the ARM processor architecture to selected customers. The servers are based on Marvell's quad-core Armada XP SoC products.
ASTC, Tanner EDA to deliver ASIC design services
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5/30/2012   Post a comment
Australian Semiconductor Technology Co. and Tanner EDA have reached an agreement to deliver analog/mixed signal IP and custom ASIC design services.
Industrial apps go multi-platform
News & Analysis  
5/30/2012   3 comments
Motorola Solutions has crafted a universal app platform for its developers, enabling a single HTML5 app to be deployed on iOS, Android, Windows Phone, Windows Mobile, Windows CE and Blackberry mobile devices.
Ansys to acquire embedded software firm
News & Analysis  
5/29/2012   2 comments
Simulation software provider Ansys said it signed a definitive agreement to acquire France-based Esterel Technologies, a provider of embedded software simulation tools for mission critical applications, for about $53 million in cash.
Globalfoundries to use Mentor's SmartFill at 20-nm
News & Analysis  
5/29/2012   Post a comment
EDA vendor Mentor Graphics said Globalfoundries would use the SmartFill facilities of its Calibre YieldEnhancer product to enable advanced fill techniques for 20-nm manufacturing processes.
Black solar cells have lowest reflectance for silicon solar cells
News & Analysis  
5/29/2012   4 comments
Scientists at Natcore Technology using simple liquid bath processes said they have created a black surface on a silicon wafer with an average reflectance in the visible and near-infrared region of the solar spectrum of 0.3 percent.
AMI/AMR smart energy transmit/receive front end modules
Product News  
5/29/2012   Post a comment
The RF65x9 series of transmit/receive modules from RFMD integrate a complete solution in a single front-end module for AMI/AMR and smart grid solutions.
Lfoundry announces 110-nm PDK with embedded flash
News & Analysis  
5/29/2012   Post a comment
Lfoundry Rousset SAS has announced the availability of its physical design kit (PDK) for 110-nm aluminum process. The PDK includes options including an embedded flash memory which is proposed in 90-nm resolution.
Intel invests in Dnote audio for use in ultrabooks
News & Analysis  
5/29/2012   14 comments
Intel Capital has invested an undisclosed sum of money in Trigence Semiconductor Inc. to help expand use of its Dnote audio technology in computers based on Intel processors.
Cortus APS3R 32-bit MCU IP core targets low energy embedded apps
Product News  
5/28/2012   Post a comment
Cortus has extended its family of 32-bit modern RISC microcontroller IP cores with the energy efficient APS3R, which is targeted for low power embedded applications.
Omnivision launches 16-megapixel image sensor
Product News  
5/28/2012   13 comments
Omnivision Technologies Inc. has launched the OV16820 and OV16825 images sensors, which provide 16-megapixel resolution, for use in digital still and video cameras.
Renesas, TSMC tout licensable MCU platform using 40-nm eFlash
News & Analysis  
5/28/2012   7 comments
Renesas and TSMC Monday outlined joint plans to develop an embedded flash-based MCU platform licensable to other chip suppliers around the world.
Renesas extends MCU work with TSMC to 40-nm
News & Analysis  
5/28/2012   1 comment
As expected Japan's Renesas and foundry TSMC have announced an increase in the collaboration between the companies on microcontrollers.
MEMS wafer maker Okmetic outsources amid SOI push
News & Analysis  
5/28/2012   1 comment
Okmetic Oyj a manufacturer of silicon wafers for sensor, semiconductor and solar applications, has begun outsourcing wafer manufacture even as it is expanding its factory at its Finland headquarters to make more silicon-on-insulator wafers.
Parallax releases four exciting new products!
Product News  
5/27/2012   Post a comment
I just received jolly friendly email from Lauren Davis, who is the Marketing Manager at Parallax. Lauren was keen for me to share some news…
Intel confirms Ireland for 14-nm silicon
News & Analysis  
5/27/2012   24 comments
The Intel wafer fab complex in Leixlip Ireland is set to receive investment to allow it to manufacture 14-nm silicon and beyond, the company revealed in a presentation to analysts on May 10. The investment is expected to be more than $1 billion.
Energy Micro and Spectrum Design Solutions to offer energy-efficient wireless designs
News & Analysis  
5/27/2012   2 comments
The folks at Energy Micro develop energy-friendly MCUs and RF transceivers based on the ARM Cortex processor core.
TI announces new DSP software and development kit
Product News  
5/27/2012   Post a comment
Jump-start real-time signal processing for biometric analytics apps; Scalable dev platform features embedded analytics for apps that require fingerprint recognition and face detection.
Video: Indy 500 pit boss talks tires
News & Analysis  
5/27/2012   Post a comment
We get down and dirty in the pits at the Indy 500, where we learn how 0.5 increments of tire pressure can make or break a race, how many laps a driver can go on one set of wheels, and how far rival tire makers will go to steal another firm's secrets.
Stuff to see at DAC: Blue Pearl Software
News & Analysis  
5/26/2012   Post a comment
Blue Pearl Software Suite accelerates FPGA implementation by generating SDCs for Synopsys Synplify Pro and Xilinx Vivado.
New Xilinx Kintex-7 FPGA Embedded Kit
Product News  
5/26/2012   4 comments
Accelerate design productivity for broadcast, aerospace and defense, industrial, and medical applications using Xilinx’s Kintex-7 FPGA Embedded Kit.
Magnetic sensor features discrete protection components integrated into IC package
Product News  
5/25/2012   1 comment
Ruggedized packaging obviates the need for a conventional PCB arrangement.
Advantest launches high-speed DRAM test system
Product News  
5/25/2012   Post a comment
Offering a maximum test speed of 8 Gb/s, the T5511 supports DDR4-SDRAM and GDDR5-SDRAM devices.
Former Conexant CEO tapped to lead Lantiq
News & Analysis  
5/25/2012   Post a comment
Dan Artusi, a former CEO of both Silicon Laboratories and Conexant Systems, was named to the same position at German broadband and networking chip vendor Lantiq.
Murata completes takeover of VTI with name change
News & Analysis  
5/25/2012   2 comments
The takeover of MEMS manufacturer VTI Technologies Oy here by Murata Manufacturing Co. Ltd. was completed with a name change to Murata Electronics Oy.
Update: Dragon docked to space station
News & Analysis  
5/25/2012   30 comments
Astronauts aboard the International Space Station reached out and grabbed a U.S. commercial spacecraft in darkness over Australia on Friday (May 25).
Sharp to transfer LCD technology to Hon Hai’s China plant
News & Analysis  
5/25/2012   11 comments
Terry Gou, founder of Taiwan’s contract manufacturer Hon Hai (known as Foxconn), has been consistent in its one naked ambition: To build technology prowess at Foxconn that surpasses Korean giant Samsung Electronics.
Intel to spend $40 million on international university research
News & Analysis  
5/24/2012   4 comments
Intel CTO Justin Rattner announced that the company plans to plow more than $40 million into a worldwide network of university research centers over the next five years in an international counterpart to the Intel's U.S.-based university research program.
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What are the engineering and design challenges in creating successful IoT devices? These devices are usually small, resource-constrained electronics designed to sense, collect, send, and/or interpret data. Some of the devices need to be smart enough to act upon data in real time, 24/7. Specifically the guests will discuss sensors, security, and lessons from IoT deployments.

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