MOST Forum sketches 5-Gbps future News & Analysis 5/28/2013 Post a comment At the recent MOST Forum in Germany, experts discussed the presence and future of the MOST data bus used in automotive environments against the background of the AVB/Ethernet camp seemingly having gained ground recently.
Intel invests in Irish R&D News & Analysis 5/28/2013 10 comments Intel is investing $1.5 million in the Tyndall National Institute at University College Cork to help collaboration in R&D in photonics, microsystems and nanoelectronics.
Global FDSOI ecosystem rising News & Analysis 5/24/2013 5 comments So far, STMicroelectronics has been identified as the only company tilting at the FDSOI windmill. That perception, and a lonely market landscape, are about to change.
Europe backs FDSOI wafer fabs News & Analysis 5/21/2013 3 comments A $465 million collaborative R&D project is set to support pilot lines in Dresden and Grenoble for production of fully depleted silicon on insulator manufacturing process.
Battle-hardened veterans of the electronics industry have heard of the “connected car” so often that they assume it’s a done deal. But do we really know what it takes to get a car connected and what its future entails? Join EE Times editor Junko Yoshida as she moderates a panel of movers and shakers in the connected car business. Executives from Cisco, Siemens and NXP will share ideas, plans and hopes for connected cars and their future. After the first 30 minutes of the radio show, our listeners will have the opportunity to ask questions via live online chat.