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Content tagged with Internet of Things Designline posted in July 2011
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GreenPeak launches ZigBee RF4CE USB stick
Product News  
7/30/2011   Post a comment
RF4CE reference design for plug-and-play USB stick for the integration of RF4CE technology in PCs and home entertainment applications like set-top boxes, TVs and media players.
Hittite releases automatic gain control products
Product News  
7/30/2011   Post a comment
The HMC992LP5E is well suited for AGC implementation in the 50 to 800 MHz frequency range in LTE/WiMAX/4G, microwave radio, VSAT, test equipment and sensor applications.
M/A COM expands CATV line with 8-way active splitter
Product News  
7/30/2011   Post a comment
Featuring a default-on loop-through path, the MAAM-010237 allows for access to the cable signal even when the CPE box is powered down.
Toshiba embedded NAND supports JEDEC's e-MMC
Product News  
7/30/2011   Post a comment
Toshiba America Electronic Components, Inc. (TAEC) has introduced a family of 24-nanometer (nm) e-MMC devices.
TI SRAM targets rad-hard apps
Product News  
7/30/2011   2 comments
The SMV512K32 is a high performance asynchronous CMOS SRAM organized as 524,288 words by 32 bits.
FDA defends 510(k) as debate begins
News & Analysis  
7/29/2011   5 comments
Launching a public debate, U.S. regulators were quick to reject the conclusion of a report saying it should scrap its most widely used process for approving medical devices.
Intersil rolls AEC-Q100 qualified dual synchronous step-down DC/DC regulator
Product News  
7/29/2011   Post a comment
Device targets secondary power automotive applications such as infotainment, camera, and systems modules.
Semtech SX8654/55/56/57/58 low-power 4/5-wire resistive touchscreen controllers
Product News  
7/29/2011   1 comment
Semtech's 4D touchscreen controller, which integrates proximity and pressure inputs with no additional components, is targeted at next-generation handheld applications.
NXP grew again in Q2; may decline in Q3
News & Analysis  
7/29/2011   4 comments
NXP Semiconductors reported a sequential increase in product revenue for the ninth consecutive quarter, but said the streak could come to an end in the third quarter because of a pause in demand from automotive customers, slower-than-expected deployment of near field communications technology and global macroeconomic weakness.
Cadence lifts sales target after strong Q2
News & Analysis  
7/29/2011   1 comment
Cadence Design Systems adjusted its sales target for 2011 after reporting revenue for the second quarter that beat consensus analysts' expectations.
NXP KMA210 position sensors for automotive applications
Product News  
7/28/2011   3 comments
NXP Semiconductors' new generation of automotive position sensors incorporates its latest magnetoresistive sensor chip and a signal conditioning ASIC developed using its advanced Silicon on Insulator (SOI) process technology.
Earnings: Maxim, LSI, KLA beat estimates
News & Analysis  
7/28/2011   1 comment
Chip makers Maxim Integrated Products and LSI and semiconductor capital equipment vendor KLA-Tencor delivered quarterly results that exceeded analysts' expectations.
Trident signs IP license deal amid Q2 loss
News & Analysis  
7/28/2011   Post a comment
Trident Microsystems announced it reached an agreement to license some of its video processing technology and reported a narrower second quarter loss on sales that fell short of consensus analysts' expectations.
Crystek CVCO55FLM-0137-0171 VCO
Product News  
7/28/2011   Post a comment
Crystek's latest VCOs contain an extra modulation port (TX modulation), making the family an smart choice for transmitter applications.
Silicon Laboratories' Si86xx digital isolators
Product News  
7/28/2011   1 comment
These new six-channel 5 kV digital isolators from Silicon Labs can replace optocouplers in industrial automation and drives, motor control and medical systems.
Tablets, smartphones hit sales of CE devices
News & Analysis  
7/28/2011   7 comments
As sales of multi-function electronics devices like tablets and smartphones rise, sales of single-task products like MP3 players and digital still cameras are projected to decline or stay flat, according to IHS iSuppli.
Microchip MCP3903 analog front end for three-phase energy metering
Product News  
7/28/2011   Post a comment
Microchip's latest device includes six 16-/24-bit ADCs, integrated programmable gain amplifiers, low-drift voltage reference, phase-delay compensation and modulator output block.
Next iPhone looks to be an underachiever
News & Analysis  
7/28/2011   23 comments
Apple's iPhone 5 may be little more than an incremental upgrade, analysts predict.
Avago AFBR-5972Z Fast Ethernet transceiver
Product News  
7/28/2011   Post a comment
Avago’s latest small-footprint device offers reliable data transmission at up to 100 Mbps for industrial automation and renewable energy applications.
DIDO promises wireless breakthroughs
News & Analysis  
7/28/2011   51 comments
A new white paper describes a wireless technology that can deliver more than ten-fold increases in spectrum utilization compared to today's cellular systems.
TSMC forecasts falling sales in Q3
News & Analysis  
7/28/2011   Post a comment
Foundry Taiwan Semiconductor Manufacturing Co. Ltd. has announced that its net income fell in the second quarter and has forecast its revenue will decline by about 7 percent in the third quarter.
Infineon profits as car woes no-show
News & Analysis  
7/28/2011   Post a comment
Expected problems in the automotive supply chain failed to materialize for Infineon Technologies AG in the second quarter and helped the German chip maker turn in higher than expected sales and profits.
VIA launches dual core VB8004 Mini-ITX Mainboard
Product News  
7/27/2011   Post a comment
VIA Technologies, Inc has announced a dual core version of the low power VIA VB8004 Mini-ITX board. Coupling the 1.6GHz VIA Nano X2 E-series processor with the VIA VX900 media system processor, the VIA VB8004 provides a high performance and highly scalable solution for advanced digital signage and gaming systems.
Lam sees steep decline in tool spending
News & Analysis  
7/27/2011   Post a comment
Lam Research reported quarterly results that beat analysts' expectations but warned of a significant decline equipment spending that would cause its revenue to contract in the current quarter.
Atmel adds five SAM9 MCUs with DDR2 support, enhanced LCD control, soft modem implementation
Product News  
7/27/2011   Post a comment
Atmel Corporation has added five new devices to the Atmel SAM9 ARM926-based family of microcontrollers (MCUs): the SAM9G15, SAM9G25, SAM9G35, SAM9X25, and SAM9X35.
Portable COTS test interface brings lab capabilities to the field
Product News  
7/27/2011   Post a comment
Field-portable test and simulation unit gives users a comprehensive menu of interface options.
Ruggedized six-channel power supply sports VITA 62 power connector pin-out
Product News  
7/27/2011   Post a comment
MIL-STD-810F-compliant 3U VPX power supply generates 400 W for land, sea, and air defense applications.
ZigBee gets gateway specification
News & Analysis  
7/27/2011   12 comments
The ZigBee Alliance has released ZigBee Gateway, its tenth standard and the first in a new family of planned ZigBee Network Device standards.
Researchers to link brain, artificial limbs
News & Analysis  
7/27/2011   12 comments
Four universities won a $1.2 million grant to develop prosthetics that deliver sensory information to patients and can be controlled by their thoughts.
ST-Ericsson to close R&D sites
News & Analysis  
7/27/2011   12 comments
Mobile chip company ST-Ericsson is set to close R&D sites as part of the latest round of restructuring, according to CEO Gilles Delfassy. A site in Basingstoke, England, has already been earmarked for closure with a loss of up to 139 jobs, according to a local report.
TI touts 3-D packaging technology
News & Analysis  
7/27/2011   9 comments
Texas Instruments said it has shipped more than 30 million power management devices featuring its PowerStack 3-D packaging technology, which the company says offers performance, thermal, power consumption and board space advantages compared with conventional packaging technologies.
Israel offers Intel $290 million to expand
News & Analysis  
7/27/2011   11 comments
The Israeli government is offering semiconductor giant Intel up to 1 billion shekels (about $290 million) to expand its manufacturing operations in the country, according to local reports.
DRAM price declines suggest tough second half
News & Analysis  
7/27/2011   5 comments
The contract price of 2-GB DRAM modules has decreased nearly 16 percent in July compared with June, a warning sign that the DRAM market outlook for the second half of 2011 could be bleak, according to DRAMeXchange.
Mouser launches new audio applications site
News & Analysis  
7/27/2011   1 comment
Mouser Electronics launched an audio applications training site devoted to the newest products and developments for sound engineering.
STMicroelectronics collaborates with Soundchip to bring HD-PA to market
News & Analysis  
7/27/2011   Post a comment
STMicroelectronics is to collaborate with Soundchip SA, a Swiss-based electro-acoustics consultancy and originator of the High Definition Personal Audio (HD-PA) Standard, to bring HD-PA to market by applying their respective strengths in audio system and semiconductor technology, product design and industrialization methods, audio software and sales and marketing.
Audio Pixels Holdings Limited signs joint development agreement with Sony Corporation of Japan
News & Analysis  
7/27/2011   Post a comment
Audio Pixels Holdings Limited has announced that it has signed a Joint Development Agreement with Sony Corporation of Japan for the development of its patented low cost micro-electro mechanical ("MEMS") digital speakers.
Design and selector guide for high-precision resistors
News & Analysis  
7/27/2011   3 comments
Vishay Precision Group has released its Vishay Foil Resistors division's Design and Selector Guide for High-Precision Resistors, available as a free download.
CML Microsystems acquires leading-edge vocoder technology
News & Analysis  
7/27/2011   Post a comment
CML Microsystems has acquired the exclusive rights to the RALCWI low bit-rate vocoder products from Spirit Corp., (Spirit), a Moscow based software company.
Ultra-low power DAC delivers crystal-clear audio
Product News  
7/27/2011   Post a comment
Wolfson Microelectronics plc has unveiled the company's latest high performance ultra-low power stereo digital-to-analog converter (DAC) which delivers superior audio to portable applications including mobile phones, tablet PCs, wireless headsets, multimedia players and handheld gaming devices.
USB data acquisition module for audio and acoustic testing
Product News  
7/27/2011   Post a comment
Data Translation released the DT9837C data acquisition module, featuring four 24-bit A/D inputs and specifically designed for audio testing and acoustic measurement applications.
Audio streamer delivers class-leading cost and power optimization for mono wireless audio
Product News  
7/27/2011   Post a comment
Nordic Semiconductor ASA has announced the nRF2460 audio streamer IC that offers class-leading power optimization and performance specifically for cost-sensitive battery-powered mono (single channel) C applications such as microphones, subwoofers, musical instruments, and gaming.
Audio SoC gives access to DSP cores
Product News  
7/26/2011   Post a comment
Wolfson Microelectronics has announced a single-chip audio processor that could, potentially, replace up to five of its discrete ICs in mobile devices, including mobile phones, tablet PCs and other handheld media devices.
VoIP SLIC promises smaller BoM
Product News  
7/26/2011   Post a comment
Silicon Laboratories is claiming the title of industry's most integrated, cost-effective and power-efficient subscriber line interface circuit (SLIC) solution for voice-over-IP (VoIP) gateways, with its new Si3226x Dual ProSLIC family.
Low power audio codec optimizes performance and prevents speaker damage
Product News  
7/26/2011   Post a comment
Maxim Integrated Products has introduced the MAX98089, a highly integrated stereo audio codec targeted at portable multimedia applications such as tablets, netbooks, and mobile phones.
Class-G headphone and Class-D speaker amplifiers balance audio power versus battery life
Product News  
7/26/2011   Post a comment
Fairchild Semiconductor has developed the FAB1200 stereo Class-G ground-referenced headphone amplifier with integrated buck converter, as well as the FAB2200 audio subsystem with stereo Class-G headphone amplifier and 1.2 W Class-D mono speaker amplifier.
Fab tool vet Cutini to lead solar startup
News & Analysis  
7/26/2011   Post a comment
Longtime semiconductor capital equipment executive Jerry Cutini has joined elQ Energy, a developer of DC-to-DC parallel solar technology, as president and CEO.
DisplayLink USB virtual graphics technology enables low-power, low-cost embedded displays
Product News  
7/26/2011   Post a comment
DisplayLink USB virtual graphics technology enables embedded applications to provide detailed information to the consumer in multiple displays in different or remote locations without requiring power cords, delivering current via a USB 2.0 or USB 3.0 cable.
Former CFO to become Intel's next chairman
News & Analysis  
7/26/2011   10 comments
Intel Chief Administrative Officer Andy Bryant was elected to the new position of vice chairman of the board of directors in preparation for him to be elected the company's next chairman following Intel's annual stockholder meeting next May.
U.S. group calls for cloud-friendly policies
News & Analysis  
7/26/2011   4 comments
A group of experts from industry and academia made 14 recommendations for best practices and policies to accelerate adoption of cloud computing in the U.S.
Cracking the code on a next-gen software strategy
News & Analysis  
7/26/2011   Post a comment
Whether you are a chip, board or systems maker, you cannot afford to remain aloof from the shifts in software, unless you don’t mind getting lost in a jungle of code.
Page 1 / 5   >   >>


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