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Content tagged with Internet of Things Designline posted in August 2002
Zoran carves DVD niche, but looks to branch out
News & Analysis  
8/30/2002   Post a comment
Zoran Corp. for the last two years has watched sales of its high-end DVD controllers triple, accounting for more than 85% of the company's revenue of $131 million. That growth has also helped Zoran establish itself as the leading supplier of high-end DVD controllers.
Component inventory overhang persists
News & Analysis  
8/30/2002   Post a comment
Last year's massive inventory glut continues to linger for component suppliers as poor end-market conditions, shifting product designs, and fierce global competition mar suppliers' recovery efforts.
TSMC takes another step toward China
News & Analysis  
8/29/2002   Post a comment
TSMC has signed a memorandum of understanding (MOU) to build wafer fabs in China, paving the way for Taiwan's foundries to enter the thriving Chinese market from which they had until recently been barred.
Methode reports flat earnings
News & Analysis  
8/29/2002   Post a comment
OC-768: Jumping Physical Design Hurdles
News & Analysis  
8/29/2002   Post a comment
The jump from the OC-192 to OC-768 level will be an even tougher hurdle for design engineers to leap. Here's a look at the design hurdles engineers will face and some solutions to these problems.
Semtech posts gain amidst customer dispute
News & Analysis  
8/27/2002   Post a comment
Semtech posts gain but tries to resolve a potentially costly dispute over allegedly deficient ICs it shipped to a customer.
Lattice completes Cerdelinx acquisition
News & Analysis  
8/27/2002   Post a comment
Lattice Semiconductor Corp. today announced it has completed its acquisition of Cerdelinx Technologies Inc., bolstering its efforts to integrate high-speed serial I/Os in its FPGA devices.
Carrier Grade Linux: What You Need to Know
News & Analysis  
8/27/2002   Post a comment
Interest is building around the use of Linux in telecom equipment designs. To accelerate acceptance, the OSDL is developing a set of specs that will turn Linux into a carrier-grade OS. Here's a look at these efforts.
RF system-in-package competes with SoCs
News & Analysis  
8/26/2002   Post a comment
We regard multichip module (MCM) BGA as an enabling technology that provides high-reliability, compact size, faster time to market and reduced costs for RF circuits.
QFN packages quell noise, cost, space in handhelds
News & Analysis  
8/26/2002   Post a comment
One of the most cutting-edge packaging technologies to recently emerge in the electronics marketplace is the quad flat no leads (QFN)-type package.
IC packaging raises modeling, layout concerns in communications design
News & Analysis  
8/26/2002   Post a comment
IC packaging, typically an afterthought in the design of a new-generation SoC, is particularly troublesome for communications circuits and high-speed interface circuits.
CAD tackles package parasitics
News & Analysis  
8/26/2002   Post a comment
RF and mixed-signal (RF-AMS) IC design is already very challenging today, without designers' having to worry about the electrical, thermal and yield effects of the chip package.
BGAs jump speed/density barrier
News & Analysis  
8/26/2002   Post a comment
The combination of large, complex devices with hundreds of pins and densely packed system layouts has led to the proliferation of ball grid array packages.
Uncovering the Challenges of Delivering GigE Over Cat5
News & Analysis  
8/22/2002   Post a comment
Designers must deal with SNR, attenuation, and real-life cable problems when architecting NIC cards, switches, and more for Gigabit Ethernet.
Current feedback op amps save power in fast photodiode applications
News & Analysis  
8/20/2002   Post a comment
Current Feedback Amplifiers offer high bandwidth with minimal power supply current draw. However, they are rarely used as transimpedance amplifiers in photodiode applications because of the high current noise associated with their inverting inputs. A Linear Technology apps engineer shows how to get mileage from a unity gain configuration.
Prepping Residential Gateways for WAN Access
News & Analysis  
8/20/2002   Post a comment
Broadband pipes lie at the heart of all residential gateway designs. Here we'll look at the key elements required to build an ADSL WAN interface for home networking apps.
Method ensures on-track designs
News & Analysis  
8/19/2002   Post a comment
Achieving functional closure on register-transfer-level designs continues to be one of the greatest challenges for today's ASIC and system-on-chip design teams.
Dc-dc converter serves MEMS bias voltages
News & Analysis  
8/18/2002   Post a comment
MEMs bias often require up to 100V, albeit with a low current output. A Maxim engineer shows a boost dc-dc with outputs 36V from a 5V supply.
Spreadsheet explains decibels as voltage and power
News & Analysis  
8/18/2002   Post a comment
dB, or decibels -- are one of the most useful -- but misunderstood units in all of electronic design. Part of this confusion comes from the fact that some decibel units are units of power, and some are units of voltage. More confusion arises when it is necessary to convert between decibel units, or to convert from a power measurement to a voltage measurement. TI's Bruce Carter describes the decibel, and holds out a spreadsheet that will help designers with their dB measurements.
Nvidia readies next-gen graphics chip for Xmas
News & Analysis  
8/16/2002   Post a comment
Nvidia Corp.'s chief executive and president last week attempted to squelch rumors of a delay in the launch of its next-generation graphics processor, code-named NV30.
AMD fab unaffected by floods
News & Analysis  
8/15/2002   Post a comment
Advanced Micro Devices said Thursday that its leading-edge fab in Dresden, Germany has been unaffected by the devastating floods sweeping Europe
Troubleshooting WLAN Radio Designs: Part 2
News & Analysis  
8/15/2002   Post a comment
Optimizing 802.11b radio architectures can be a challenging task for today's system designers. This two-part series diagnose/correct problems in the transmit and receive portions of a radio design.
Synching Up Networking Equipment Designs: Part 2
News & Analysis  
8/14/2002   Post a comment
In the first part of this series, we laid out the key timing components and specifications. Now we'll look at the challenges engineers will face when building a synchronization system for their system architectures.
Why MEMS Need to Be More Like ASICs
News & Analysis  
8/12/2002   Post a comment
Microelectromechanical-system (MEMS) technology has reached a level where MEMS devices should be making a big impact in key application areas, such as communications and biotechnology. TechOnLine's Content Director, Jim Lipman, provides his take on why MEMS pervasiveness is currently much smaller than expected by many analysts and a way MEMS usage can be increased.
Using Patterns to Implement Real-Time Behavior in a UML Specification
News & Analysis  
8/9/2002   Post a comment
In his most recent in a series of UML articles, Artisan Software's Alan Moore describes the semantics of some design abstractions for a new profile of UML, the RT-Profile, and discusses a set of patterns you can apply to implement an annotated UML class in C++.
IBM to cool down servers
News & Analysis  
8/8/2002   Post a comment
IBM Corp. said it has developed a prototype of a low-power server that cuts power consumption in half when compared to the p610 server that debuted earlier this year with 450W power consumption and dissipation of 1,536 BTUs per hour.
Teradyne to close San Diego PCB plant
News & Analysis  
8/8/2002   Post a comment
Continuing to reel from a slump in the printed circuit board market, Teradyne Inc. announced it would close its San Diego board plant and lay off 125 employees by the year's end.
LVDS splitter simplifies high-speed signal distribution
News & Analysis  
8/8/2002   Post a comment
Multipoint operation speeds data distribution on a high-speed bus. This Maxim applications guru offers pointers for addressing multiple receivers on an LVDS line.
Merged voice and data means lower voltages for communications systems
News & Analysis  
8/8/2002   Post a comment
The transition from traditional telephony to converged voice and data with Internet Protocols has some interesting implications for power conversion in data communications systems. For one thing, the traditional --48V power bus must be converted to increasing lower voltages for new-generation logic. Fairchild's go-to guy on power issues, Reno Rossetti, discusses the trend and offers some power conversion examples - complete with applications schematics.
Proper board layout makes switchers work right the first time
News & Analysis  
8/8/2002   Post a comment
The stability of a switching power supply is the consequence of a number of factors, including the choice of regulator ICs and filter components. But as National's Sanjaya Maniktala points out, the printed circuit board layout can have a critical effect on switcher stability. The inductive effects of the PCB traces will effect buck and boost regulators very differently. Every once of copper makes a difference, says Sanjaya, in this thorough and informative analysis.
Motorola's Bluetooth headset: Headlong into hands-free
Teardown  
8/6/2002   Post a comment
Motorola's Bluetooth Headset shows that while OEMs can design profitable Bluetooth systems, key interoperability issues are still dogging the technology.
Fine-Tuning VoBroadband Test Capabilities
News & Analysis  
8/1/2002   Post a comment
Integrated linecard/test-head designs help reduce the cost of performing automated tests in VoB applications. But, before implementing automated tests, designers must weigh their value and determine what troubles thee automated system should target.


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Betajet
5 comments
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Max Maxfield

Recommended Reads From the Engineer's Bookshelf
Max Maxfield
27 comments
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Martin Rowe

Make This Engineering Museum a Reality
Martin Rowe
Post a comment
Vincent Valentine is a man on a mission. He wants to make the first house to ever have a telephone into a telephone museum. Without help, it may not happen.

Rich Quinnell

Making the Grade in Industrial Design
Rich Quinnell
16 comments
As every developer knows, there are the paper specifications for a product design, and then there are the real requirements. The paper specs are dry, bland, and rigidly numeric, making ...

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