QCOM Seeks Options Beyond Apple, Samsung News & Analysis 4/23/2015 3 comments Qualcomm’s recent earnings reports suggest significant vulnerabilities. Qualcomm is heavily dependent on a single market segment (smartphones), while its revenues are susceptible to the whims of the two top-tier smartphone vendors – Apple and Samsung.
Elvis Sees All in Russia News & Analysis 4/23/2015 17 comments A Russian company claims it has the first Russian designed smart chip. The video intelligent processor (VIP-1) is sold in surveillance systems in Russia, but may be sold as a bare-chip overseas.
WSTS Marks America Up for 2015 Boom News & Analysis 4/21/2015 Post a comment The market for semiconductors in the Americas region will grow by 15 percent in 2015, according to a revised estimate from the World Semiconductor Trade Statistics (WSTS) organization.
Athena Security IPs Designed to Mend Holes in SoCs News & Analysis 4/21/2015 6 comments We see rapidly growing needs for protecting connected systems by using security chips with crypto keys inside. But how do we know if security chips themselves (designed into such connected systems) aren’t leaking key information?
EMEA PC Shipments Resume Steady Decline News & Analysis 4/21/2015 Post a comment PC shipments in Europe, the Middle East, and Africa (EMEA) reached 20.2 million units in the first quarter of 2015, a 7.7% decrease year on year, according to International Data Corporation (IDC). After a strong 2014, the market returned to a decline as expected, with business renewals decelerating after last year's uplift prompted by the end of Windows XP support.
MINI Giving Drivers a Peek at 'Augmented Reality' News & Analysis 4/19/2015 7 comments Although most drivers have yet to embrace the idea of head-up displays on windshields, MINI is leapfrogging to the next phase of futuristic motoring, with its introduction this week of AR eyewear – powered by Qualcomm
Moore's Law: Dead or Alive News & Analysis 4/17/2015 22 comments Moore's Law is still alive and kicking after 50 years, but here are the technologies that are busting and boosting it in the 21st century.
TSMC Cuts Capex by $1 Billion News & Analysis 4/16/2015 4 comments Taiwan Semiconductor Manufacturing Co. (TSMC) is cutting its planned capital expenditure for this year by $1 billion, citing improvements in capital efficiency and a faster-than-expected migration to its leading-edge 16nm process technology.
NFC Tags Check Food Freshness News & Analysis 4/16/2015 Post a comment In December last year, researchers at the Massachusetts Institute of Technology (MIT) had designed simple gas sensors relying on nanotubes-based chemiresistors (electrical circuits whose resistance changes when exposed to a particular chemical).
IBM vs. Intel in Supercomputer Bout News & Analysis 4/15/2015 9 comments The Collaboration of Oak Ridge, Argonne and Lawrence Livermore (CORAL) project financed by the Department of Energy (DoE) will bring home to the U.S. the fastest supercomputers in the world made by Cray, IBM, Intel and Nvidia.
Imagination Tunes in Wi-Fi, BT News & Analysis 4/15/2015 Post a comment Imagination Technologies hopes to leverage the communications experience of its Ensigma division to bring low power wireless connection to Internet of Things and wearable devices. Imagination hopes its built-for-IoT IP will prove valuable in a market that currently uses dumbed-down mobile chips
Intel Does Balancing Act News & Analysis 4/15/2015 Post a comment In its Q1 results, predictably Intel's PC business is down but data center, IoT, and nonvolatile memory made up for PC loses. Surprisingly capex goes down.
Is Head-Up Display Future ADAS Screen? News & Analysis 4/15/2015 5 comments Texas Instruments, rolling out a new automotive-qualified DLP chipset, is banking on head-up display, predicting it to become “the ADAS display of the future.” But can DLP redefine the HUD market?
Moore’s Law Hits Middle Age News & Analysis 4/14/2015 6 comments Top technologists from Intel, IBM and TSMC who helped drive Moore’s Law forward share their stories and opinions on its 50th anniversary.
Graphene Spintronics Beats All News & Analysis 4/14/2015 7 comments Chalmers University of Technology claims graphene's high-electron mobility enables longer wires without repeaters for future spintronics that encode information on the spin of individual electrons instead of their charge like today.
3D Testing Standardized by SRC News & Analysis 4/14/2015 Post a comment The Semiconductor Research Corp. has standardized Design-for-Test method for 3D chips that has fast throughput by using a single probe to touch several TSV microbumps at the same time.
Parallel Processing Spawns Non-MPEG Codec News & Analysis 4/10/2015 14 comments V-Nova will next week at NAB demonstrate a new video codec called Perseus. It's designed to do hierarchical and scalable video encoding by leveraging massive parallel processing, while sidestepping the complexity of block-based compression algorithms.
Samsung Galaxy S6: A New Slate News & Analysis 4/8/2015 1 comment Samsung has invested in maturing its Shannon architecture and as such has ousted Qualcomm and others as the phone’s core chipset and system architecture, says analyst team at Teardown.com.
TSMC Outlines 16nm, 10nm Plans News & Analysis 4/8/2015 2 comments TSMC announced plans to roll out updated low-power versions of existing chips and announced its roadmap for smaller process nodes. The company will begin volume production of its 16nm FinFet+ in the middle of this year while breaking ground on 10nm development.
Vote Today! Best Nanotech News & Analysis 4/7/2015 1 comment The National Nanotechnology Initiative opens going voting on its best and brightest projects by clicking on its image in a special gallery.
Medical Chip Market on 12% CAGR News & Analysis 3/31/2015 Post a comment Moves to smaller and portable medical equipment for use away from hospitals is driving up sales of ICs and sensors in the medical semiconductor market, according to market research firm IC Insights.
3D Qualcomm SoC Testing on Horizon News & Analysis 3/31/2015 26 comments Qualcomm is doing extensive research into how to build 3D structures on a single die without having to use through-silicon-vias (TSVs) and hopes to test 3D SoCs soon.
Why MediaTek Pushes Cross-Device Sharing News & Analysis 3/30/2015 5 comments MediaTek is creating a technology, called CrossMount, that will link and share software and hardware resources of televisions and handheld devices in ways that would fulfill their unrealized potential. What’s behind the Taiwanese IC giant’s ambition?
Researchers Claim 44x Power Cuts News & Analysis 3/30/2015 2 comments Researchers at the University of Illinois invented the worlds first on/off transceiver fast enough for commercialization, saving up to $870 million per year in datacenter power bills.
How Will Deep Learning Change SoCs? News & Analysis 3/30/2015 5 comments Deep learning is changing the way computers see, hear and identify objects -- but will it ever migrate into smartphones or vision SoCs for cars? Has anybody come up with SoCs optimized for neural networks?
Core Independent MCUs Come to Power Management News & Analysis 3/26/2015 Post a comment Using redundant sets of key power management functions, Microchip has used its core independent peripheral architecture in an 8 bit MCU to bring a high degree of flexibility to power supply, automotive, battery management, and LED display apps.
Bosch Rides Apple to MEMS Dominance News & Analysis 3/26/2015 5 comments How did Bosch achieve a future “MEMS titan” status? Why is STMicroelectronics slipping? Get the lowdown of MEMS Industry status and technology breakdown.
Intel's Xeon Phi to House 72 Cores News & Analysis 3/25/2015 12 comments Intel's Xeon Phi mutiprocessor, with up to 72 cores and integrated Micron Hybrid Memory Cubes, will accelerate both enterprise and supercomputer workloads.
Panasonic: ‘747 Is Our Connected Device’ News & Analysis 3/24/2015 6 comments Panasonic unveiled its plan to offer royalty-free access to its software and patents to help speed the growth of the Internet of Things. We caught up with Panasonic’s CTO, asked him about the company's IoT patents and software.
Battle-hardened veterans of the electronics industry have heard of the “connected car” so often that they assume it’s a done deal. But do we really know what it takes to get a car connected and what its future entails? Join EE Times editor Junko Yoshida as she moderates a panel of movers and shakers in the connected car business. Executives from Cisco, Siemens and NXP will share ideas, plans and hopes for connected cars and their future. After the first 30 minutes of the radio show, our listeners will have the opportunity to ask questions via live online chat.