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3D Qualcomm SoCs by 2016
News & Analysis  
3/31/2015   6 comments
Qualcomm is doing extensive research into how to build 3D structures on a single die without having to use through-silicon-vias (TSVs) and hopes to introduce 3D SoCs by 2016.
Neural Networks Take on Embedded Vision
News & Analysis  
3/30/2015   Post a comment
Synopsys configurable vision coprocessor architecture uses ARC-based RISC cores in tandem with specialized object detection processing engines.
Why MediaTek Pushes Cross-Device Sharing
News & Analysis  
3/30/2015   5 comments
MediaTek is creating a technology, called CrossMount, that will link and share software and hardware resources of televisions and handheld devices in ways that would fulfill their unrealized potential. What’s behind the Taiwanese IC giant’s ambition?
Researchers Claim 44x Power Cuts
News & Analysis  
3/30/2015   Post a comment
Researchers at the University of Illinois invented the worlds first on/off transceiver fast enough for commercialization, saving up to $870 million per year in datacenter power bills.
How Will Deep Learning Change SoCs?
News & Analysis  
3/30/2015   4 comments
Deep learning is changing the way computers see, hear and identify objects -- but will it ever migrate into smartphones or vision SoCs for cars? Has anybody come up with SoCs optimized for neural networks?
Toughening Up LPDDR4 and Parallel NOR Flash For Automotive
News & Analysis  
3/27/2015   Post a comment
Ignoring the consumer market for now, Micron has introduced its newest generation of LDDR4 DRAMs and parallel NOR flash memory devices into the automotive market.
Core Independent MCUs Come to Power Management
News & Analysis  
3/26/2015   Post a comment
Using redundant sets of key power management functions, Microchip has used its core independent peripheral architecture in an 8 bit MCU to bring a high degree of flexibility to power supply, automotive, battery management, and LED display apps.
Bosch Rides Apple to MEMS Dominance
News & Analysis  
3/26/2015   5 comments
How did Bosch achieve a future “MEMS titan” status? Why is STMicroelectronics slipping? Get the lowdown of MEMS Industry status and technology breakdown.
MCU Vendors Engaging in Low-Power Leapfrog
News & Analysis  
3/25/2015   8 comments
Competition to be the low-power MCU leader has resulted in a burst of product introductions, but it is the developer who will ultimately win.
Intel's Xeon Phi to House 72 Cores
News & Analysis  
3/25/2015   12 comments
Intel's Xeon Phi mutiprocessor, with up to 72 cores and integrated Micron Hybrid Memory Cubes, will accelerate both enterprise and supercomputer workloads.
Panasonic: ‘747 Is Our Connected Device’
News & Analysis  
3/24/2015   6 comments
Panasonic unveiled its plan to offer royalty-free access to its software and patents to help speed the growth of the Internet of Things. We caught up with Panasonic’s CTO, asked him about the company's IoT patents and software.
TI’s 32-bit 'Successor' to the 16-bit MCU
News & Analysis  
3/24/2015   Post a comment
TI's new ARM Cortex-M4F-based MCU is a higher performance alternative to traditional the 16-bit MSP430 and a lower power and feature-rich alternative to the ARM Cortex-M0.
Multicore MCU Brings Gigabit Ethernet to IoT
News & Analysis  
3/23/2015   Post a comment
Multiple cores bring blazing speed to low-cost MCUs for Ethernet connectivity and audio applications.
Bringing Sub-Threshold Voltage to Any MCU
News & Analysis  
3/23/2015   Post a comment
Based on the same subthreshold voltage technology used in its ARM-based Apollo Cortex-based processors, Ambiq's real-time clock family brings its low power benefits to any MCU-based design.
Apple A9 Orders Pivot to TSMC
News & Analysis  
3/23/2015   1 comment
Apple will ramp up production of A9 for its yet-to-be-announced iPhone 6S. Originally, a majority of A9 orders were said to have gone to Samsung, but sources say TSMC snatched Apple A9 orders from Samsung on yield issues.
PCB-Friendly Motion Module Targets Sensor Hubs
News & Analysis  
3/20/2015   1 comment
To make nine axis sensor hub capabilities available for many embedded IoT apps, Microchip has developed a coin cell sized module that can fit onto any space constrained design.
MediaTek Sees IoT as Its Next Growth Driver
News & Analysis  
3/19/2015   Post a comment
MediaTek, Taiwan’s largest chip designer, says it expects IoT to become its next big growth driver once the smartphone business starts to lose steam.
Patent Filings: Who Made the Cut for Top 50?
News & Analysis  
3/19/2015   5 comments
We often measure the technology prowess – of a nation, a company – by the number of international patents filed and granted. China’s Huawei Technologies was the top applicant for international patents in 2014, according to a WIPO report.
Industrial IoT Drives Microsemi-Vitesse Merger
News & Analysis  
3/18/2015   Post a comment
Microsemi Corp. will acquire Vitesse Semiconductor Corp. for $389 million to focus on “communications semiconductors.” On horizon is the MIPS vs. ARM conflict as the two companies use two diverging processor cores of their product lines.
Marvell Touts MoChi, FLC in Shanghai
News & Analysis  
3/17/2015   6 comments
The president of Marvell painted broad strokes about its Final-Level Cache memories and a new interconnect technology called MoChi during a keynote in Shanghai. She described them as basic building blocks for the company’s newly proposed scalable SoCs.
PC Drop & iPhone Rumors Color Intel Forecast
News & Analysis  
3/13/2015   9 comments
Intel’s forecast warning raise the issue of its ability to diversify its business. A recent report that Intel’s LTE modems “getting into iPhones in 2016” stirred some noise, but it’s still a rumor at this point.
ST's Vigna Wins IEEE Award
News & Analysis  
3/12/2015   Post a comment
Benedetto Vigna, executive vice president for the analog, MEMS, and sensors group at STMicroelectronics NV has been given a top IEEE award for his role in the development and commercialization of micro-electro-mechanical systems (MEMS).
Marvell CEO: The Tinkerer at The Top
News & Analysis  
3/12/2015   10 comments
Marvell CEO has been obsessed with a computer architecture that’s unchanged for decades. Why must its progress depend on more memory and faster CPU? “We are going to fix it for once and all.”
Xilinx Targets Embedded Software Developers with SDSoC
News & Analysis  
3/11/2015   1 comment
Embedded software developers outnumber their hardware counterparts by a factor of 10:1, so a tool that lets them take full advantage of programmable SoCs is extremely significant.
Sigfox, Sequans: Tale of Two French IoT Firms
News & Analysis  
3/11/2015   4 comments
There is an underlying thread in both 5G and IoT: Diversification. Diversified networks, network topologies and network infrastructures are necessary to enable both. Carriers realize that there will be no one-size-fits-all network for either 5G or IoT.
Taking on Industrial IoT with Real-Time DDS
News & Analysis  
3/11/2015   1 comment
Building on its experience in high reliability Data Distribution Services for the military/aerospace market, Prismtech launchs a "DDS for things" platform for networked devices requiring real-time, deterministic delivery.
Intel's 1st Xeon SoC Twists ARM
News & Analysis  
3/9/2015   23 comments
Intel hopes it first Xeon SoC -- the D-1500 -- will be an ARM killer in the micro server market.
Synopsys Opens Up ARC Processor Architecture Online
News & Analysis  
3/9/2015   2 comments
To reach developers in a range of new embedded Internet of Things designs, Synopsys has sponsored the embARC.org web with open source tools for use with its ARC processor.
NXP to Focus on All CMOS Radar Future
News & Analysis  
3/9/2015   9 comments
NXP CEO sees making “big and clunky radars” small is critical for ADAS. NXP has an RF CMOS-based 80GHz radar front-end transmitter chip — a working prototype – in the hands of its lead customers for several months.
Low-Power Wireless MCUs Proliferate
News & Analysis  
3/4/2015   Post a comment
Wireless device developers now have a new range of RF options that are low-power and easy to design with.
2D Material Beats Graphene
News & Analysis  
3/4/2015   2 comments
Black phosphorus is a 2D material with advantages over graphene, including a variable bandgap and other photonics characteristics.
Parrot Takes Instant 3D Mapping to the Sky
News & Analysis  
3/4/2015   Post a comment
On Nvidia's booth at embedded world, a robot arm was swinging a stereo camera assembly, in a drone-like fashion, demonstrating Parrot’s software capabilities to turn cheap stereovision into real-time 3D mapping using nVidia’s Jetson TK1 development kit.
NXP CEO: ‘Security, IoT, Cars’ Drove Freescale Deal
News & Analysis  
3/3/2015   2 comments
NXP CEO spoke with on the overlapping businesses with Freescale, once the merger goes through. Products that don’t belong to NXP’s focus on “security and connectivity with a smarter world” are Freescale’s network processors and NXP’s standard products.
IoT Security a Prime Focus for Freescale
News & Analysis  
3/3/2015   Post a comment
Security is a major concern in the Internet of Things, and Freescale intends to provide developers with the answers.
Chip Market Contracts in Europe, January
News & Analysis  
3/3/2015   Post a comment
The three-month average European chip market contracted in January 2015 when compared with same period in 2014, in contrast to the global market increased by 8.7 percent, according to the Semiconductor Industry Association (SIA), reporting data compiled by the World Semiconductor Trade Statistics (WSTS) organization.
Embedded Job Market Expands, But Boomers Feel the Squeeze
News & Analysis  
3/2/2015   12 comments
By almost any measure, the job market appears to be looking very good right now for embedded engineers. But not for everyone.
Asian Share of Global Fab Capacity May Top 69% by 2019
News & Analysis  
3/2/2015   Post a comment
Asia is expected to account for a new record, nearly 70% of the world's fab capacity, by 2019, according to a new report from IC Insights.
Imagination Dons Wearable GPU
News & Analysis  
3/2/2015   1 comment
Imagination Technologies announced a suite of video IP cores for the next generation of graphic displays at Mobile World Congress. Alongside a set of video encoder cores, the UK company also announced a new PowerVR GPU for mobile and wearables.
Graphene Polymer Speeds Electron Transport
News & Analysis  
2/27/2015   Post a comment
Depositing conducting polymers on graphene gives then highly desirable electrical properties, flexibility and strength for future flexible electronics, organic solar cells, protective coatings and other practical applications.
Hi-Speed Transistors from Liquid Processing
News & Analysis  
2/26/2015   10 comments
A University of Chicago lab has invented a new kind of solder that can electronically join disparate semiconductors that were impossible to solder before plus print crystalline-like high-speed transistors as well as revolutionize 3-D printing.
Radar Can't Spot Mystery Drones over Paris
News & Analysis  
2/26/2015   5 comments
Unidentified drones were spotted in the skies above Paris two nights in a row this week. The French authorities don’t know who is controlling them, the number of drones involved, or even if they were all coordinated.
IoT Starter Kit Connects Developer to Cloud in Moments
News & Analysis  
2/26/2015   1 comment
Seeking to simplify the prospect of creating an IoT prototype that is web connected, ARM has partnered with IBM to provide an end-to-end, out of the box dev kit.
Flex Logix Introduces FPGA IP Cores for SoC Designs
News & Analysis  
2/25/2015   1 comment
The EFLX FPGA fabric allows things like I/O protocols, encryption algorithms, radio filters, and other "fixed" functions to be upgraded on-the-fly.
Xilinx Unveils 16nm Ultrascale+ FPGAs, MPSoCs & 3D ICs
News & Analysis  
2/24/2015   1 comment
Applications for Xilinx's new UltraScale+ FPGAs, MPSoCs, and 3D ICs include LTE Advanced and early 5G wireless, terabit wired communications, automotive ADAS, and industrial IoT.
Silicon Labs' First Salvo in IoT SoCs: Blue Gecko
News & Analysis  
2/24/2015   2 comments
Silicon Labs unveiled its first Bluetooth Low Energy wireless SoC, Blue Gecko. Integrating Silicon Labs’ EFM32 Gecko MCU with 2.4GHz radio, it’s the first in a series of IoT SoCs Silicon Labs has promised to deliver in coming months.
Parrot Spins Positive on FAA Drone Draft
News & Analysis  
2/23/2015   2 comments
We talked with Yannick Levy, vice president of Parrot (Paris), to find out how the FAA’s draft drone rules are viewed in Europe, and where the focus of the drone debate will move next.
8-bit MCUs Stake New Claim in IoT
News & Analysis  
2/23/2015   Post a comment
Far from being down and out in the IoT era, 8-bit MCUs are staking a claim with these new products from Silicon Labs.
3D E-Beam Enables 3D NAND Flash
News & Analysis  
2/23/2015   2 comments
Applied Materials claims to have solved the last remaining problems around enabling mass production of 3D NAND flash memory cubes. The company says it has leveled the playing field so any semiconductor maker can make 3-D FinFETs as well as Intel already does.
Quantum Transistor Harnesses New Effect
News & Analysis  
2/19/2015   2 comments
Scientists at the Massachusetts Institute of Technology (MIT) have discovered a new phenomenon--the quantum spin Hall effect--and have used it to create the world's first spintronic topological field effect transistor (TFET), in simulation at the Texas Advanced Computer Center (TACC) at Texas A&M University.
FAA on Drones: Fly But Not That High
News & Analysis  
2/18/2015   12 comments
Under the FAA’s proposed rules, gone are such antiquated rules as [drone] operators must be “licensed pilots.” Intact are “see and avoid” principles; must fly within line of sight of the operator.
Page 1 / 2   >   >>


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Max Maxfield

My Mom the Radio Star
Max Maxfield
Post a comment
I've said it before and I'll say it again -- it's a funny old world when you come to think about it. Last Friday lunchtime, for example, I received an email from Tim Levell, the editor for ...

Bernard Cole

A Book For All Reasons
Bernard Cole
1 Comment
Robert Oshana's recent book "Software Engineering for Embedded Systems (Newnes/Elsevier)," written and edited with Mark Kraeling, is a 'book for all reasons.' At almost 1,200 pages, it ...

Martin Rowe

Leonard Nimoy, We'll Miss you
Martin Rowe
5 comments
Like many of you, I was saddened to hear the news of Leonard Nimoy's death. His Star Trek character Mr. Spock was an inspiration to many of us who entered technical fields.

Rich Quinnell

Making the Grade in Industrial Design
Rich Quinnell
16 comments
As every developer knows, there are the paper specifications for a product design, and then there are the real requirements. The paper specs are dry, bland, and rigidly numeric, making ...

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