New Security Worry: DNA-borne Malware
News & Analysis 8/16/2017 4 comments
UW researchers coded malware into a DNA strand that spread to the sequencing software and opened a backdoor to a computer, exposing a little-considered cyber vulnerability.
Room-temp Laser-on-CMOS Achieved
News & Analysis 8/7/2017 7 comments
Researchers from Arizona State and Tsinghua Universities achieved a room-temperature CMOS laser using a molybdenum ditelluride monolayer over a silicon cavity.
Engineer's Guide to Imaging Valley
News & Analysis 8/4/2017 Post a comment
French researchers have accumulated key imaging technologies, ranging from X-ray and far infrared to visible image sensors, 3D imaging, and software – all concentrated in Grenoble area. Here are key movers and shakers in Imaging Valley.
ST Sprints While Q’comm Deal Hobbles NXP
News & Analysis 8/1/2017 Post a comment
STMicroelectronics is sprinting toward the winner’s circle in MCUs, NFC and sensors, while NXP is hobbled by its pending acquisition by Qualcomm. ST, claiming No. 3 share in volume MCU market, disclosed a plan for 64-bit MCU, and FD-SOI.
Ions Power Machine-Human Interface Demo
News & Analysis 7/27/2017 Post a comment
The University of Maryland’s NanoCenter demonstrated an “inverted” battery that converts electrical signals into the ion power used by the human brain’s synapses to yield what it says is a perfect machine-to-human interface.
Startup Campus Beckons Int'l Inventors
News & Analysis 7/27/2017 1 comment
From Shenzhen to New York and Silicon Valley, incubators are popping up, providing affordable space for entrepreneurs to build and nurture startups. Among them, what makes Station F — recently opened in Paris as the world’s largest startup campus — different?
4DS ReRAM Hits DRAM Speeds
News & Analysis 6/22/2017 3 comments
Interface Switching ReRAM has overcome the hurdle of high bit rate errors without error correction techniques that have historically slowed read access time
Siemens Lays Out Vision for Mentor
News & Analysis 6/21/2017 1 comment
The executive chairman of Siemens PLM Software used his keynote address at the Design Automation Conference to lay out the company's plan for the newly acquired Mentor Graphics.
Cray Moves to Lasso 'Big Data Deluge'
News & Analysis 6/20/2017 1 comment
Cray’s Urika Big Data Analytics Suite, for its biggest XC supercomputers, brings all the analytic tools necessary to handle the deluge of data today including deep learning and artificial intelligence in a free open-source downloadable package.
DRAM Price Surge Continues
News & Analysis 5/26/2017 2 comments
Global DRAM sales reached record heights in the first quarter, thanks to a 30 percent increase in the average contract price of PC DRAM modules, according to DRAMeXchange.
Samsung Targets 4nm in 2020
News & Analysis 5/24/2017 5 comments
Samsung's foundry unit updates tech roadmap, including the addition of 4nm process with "post FinFET structure" to begin production in 2020.
Renesas Getting Healthy with Healthcare
News & Analysis 5/18/2017 1 comment
Renesas is pushing the company’s healthcare solutions. Its bio-sensing reference module, measuring 11x18 mm, coupled with software analytics, can continuously monitor blood pressure. Other home-grown technologies in the offing include Silicon-on-Thin-Box (SOTB) and wireless charging technology.
Nvidia Takes Deep Learning to School
News & Analysis 5/9/2017 7 comments
The message that Nvidia hopes to hammer home, at its conference, is that deep learning is “transforming computing.” Nvidia has styled itself as a firebrand, catalyst and Deep Learning enabler, and — in the long run — a deep profiteer.
Star Trek Tricorder Arrives
News & Analysis 4/14/2017 8 comments
The $2.6 million purse for the Qualcomm Tricorder X-Prize contest went to the Final Frontier Team (led by Pennsylvanian brothers Dr. Basil Harris, an emergency medicine physician, and George Harris, a network engineer) with $1 million second-place going to Taiwan based Dynamic Biomarkers Team backed by HTC.
Intel Shows Life Beyond CMOS
News & Analysis 4/3/2017 2 comments
At the International Symposium on Physical Design Intel presented more than dozen different ways to get beyond the limitations of conventional complementary metal oxide semiconductors while using the same fabs.