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Hackable ESC Badge Powers Face-to-Face Networking
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4/18/2016   Post a comment
Attendees at UBM's Embedded Systems Conference in Boston this week received a special treat when 100 of them were given programmable, LED-based show badges powered by eight-bit microcontrollers.
Qorvo Buys Wireless IoT Specialist Greenpeak
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4/18/2016   Post a comment
RF chip company formed by the merger of RF Microdevices and TriQuint agrees to acquire fabless short-range wireless chip company.
Arduino-Compatible LoRa Board Senses It All
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4/18/2016   Post a comment
Dutch startup Sodaq has launched what the company believes will truly boost LoRa's adoption by makers and hobbyists of all horizons.
Everspin Aims MRAM at SSD Storage Tiers
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4/18/2016   1 comment
MRAM pioneer continues efforts to expand the applications for its non-volatile memory by displacing DRAM as a persistent memory in enterprise storage applications
Flexible Sheet Camera Captures Images with Unusual Fields of View
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4/18/2016   Post a comment
A team of researchers at the Computer Science Columbia University (New York, NY) has developed a novel sheet camera that can be wrapped around everyday objects to capture images that cannot be taken with one or more conventional cameras.
Quantum Dots Boost Solar Cells
News & Analysis  
4/18/2016   3 comments
Brookhaven National Laboratory with Stoney Brook University and the University of Nebraska
Open Source: Licensing Pitfalls May Outweigh Benefits
News & Analysis  
4/18/2016   4 comments
Using open-source software can reduce development cost and effort, but pay close attention to the licenses involved.
CMOS Circulator Chip Enables Single Antenna
News & Analysis  
4/18/2016   11 comments
Researchers have doubled the throughput of WiFi communications while allowing both transmission and reception to be performed with a single antenna.
Movidius Weds Thermal Imager & Computer Vision
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4/18/2016   Post a comment
Flir and Movidius have worked together to add Movidius’ advanced computer vision capabilities to FLIR’s newest thermal imaging camera core called Boson. “Nothing like this exists today,” boasted Movidius CEO.
Data Centers Hit the Accelerator
News & Analysis  
4/15/2016   13 comments
Engineers need to re-invent the server to better handle emerging jobs such as machine learning, said an executive with Microsoft’s cloud computing group.
Cadence Acquires Parallel Logic Simulation Speed-up Tech with Rocketick Purchase
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4/15/2016   Post a comment
Cadence Design Systems purchase Israeli company Rocketick Technologies, a specialist in multicore parallel simulation, capable of, Cadence asserts, applying fine-grain multiprocessing technology to accelerate RTL simulation.
RF Power Amplifier Firm ACCO Snags $35M in Funding
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4/15/2016   Post a comment
In what has become an increasingly rare event, chip maker ACCO Semiconductor announces $35 million in venture funding.
Intel Reportedly Readies Mass Layoff
News & Analysis  
4/15/2016   21 comments
Intel is preparing to a re-organization that include thousands of layoffs, according to a report by the Portland Oregonian.
TE Connectivity Moving Up Value Chain to Drive IoT
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4/15/2016   Post a comment
Connectivity and sensor product vendor taking the opportunity to step into the limelight of interest around the Internet of Things.
Spiraling Data Costs Imperil IoT
News & Analysis  
4/14/2016   3 comments
IoT system designers and service providers often don’t realize until much too late in the design cycle that their data costs are “quickly spiraling out of control,” Windspring CEO observed.
Teledyne LeCroy Acquires Quantum Data
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4/14/2016   Post a comment
Acquisition of Quantum Data adds ability to test HDMI and SDI as part of a strategy to expand its offerings to more wired and wireless data communication standards
FD-SOI Expands, But Is It Disruptive?
News & Analysis  
4/14/2016   5 comments
The ecosystem for fully-depleted silicon on insulator (FD-SOI) process technology has tipped from a too-late technology to a viable alternative to finFETs for the Internet of Things and automotive markets. To many, the presence of officials from major companies at an industry event signaled a coalescing around the technology.
Micron Makes More Moves Toward Storage
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4/14/2016   Post a comment
The memory company outlined a lot of its intentions for the future, including a bigger emphasis on software, but it doesn't change the realities of the DRAM and NAND flash business
TSMC Expects Second Half Surge
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4/14/2016   Post a comment
TSMC expects that it will emerge from an industry slowdown sometime during the second half of this year. The company faces overall sales growth in its business segment that slowed to 4.4% in 2015 from 16% in 2014.
5G Work Starts in Earnest
News & Analysis  
4/13/2016   1 comment
This week engineers started hearing proposals on everything from radio access technologies to network architectures for 5G cellular standards expected before 2020.
Facebook Roadmap Eyes AR/VR, Connectivity
News & Analysis  
4/13/2016   2 comments
Facebook's CEO said the company will target three major areas in the next 10 years: connecting everyone to the Internet, artificial intelligence, and virtual and augmented reality.
VC Veteran Joins EDA Group
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4/13/2016   Post a comment
Veteran venture capitalist Lucio Lanza joined the recently renamed Electronics Systems Design Alliance as another step in the rejuvenation of the EDA trade group.
Foundry Sales Growth Slows
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4/13/2016   Post a comment
Foundry sales grew by a meager 4.4% in 2015 amid a slowdown in the overall semiconductor market, according to market research firm Gartner.
Autonomous Cars Navigate in the Dark: Lights off
News & Analysis  
4/13/2016   2 comments
Ford Motor company has tested how autonomous vehicles get their bearings during the night without any lights. The vehicles coped with the challenge pretty well – they used LIDAR sensors instead of headlights and cameras.
Superconductor Nearing Room Temp
News & Analysis  
4/12/2016   1 comment
Superconductors are getting closer and closer to room-temperature operation now that University of Houston has found errors in its theory and Universidad del País Vasco has uncovered its quantum-wave nature.
US Government Seeks Guidance On Its Role in IOT
News & Analysis  
4/12/2016   3 comments
In a Request for Comments, the US Department of Commerce is asking for help defining the government's potential role in fostering development of the Internet of Things.
Broadcom Drives Enterprise Wi-Fi to 2 Lanes
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4/12/2016   Post a comment
To handle an ever-increasing number of devices connecting in public, Broadcom announced a new dual-channel 5 GHz Wi-Fi access point platform for enterprise. Broadcom’s 5G-HD platform is based on a quad-core 64-bit Cortex A-53 CPU and a flexible architecture for routing different kinds of mobile traffic.
Sayonara, Japan Semiconductor Inc.
News & Analysis  
4/12/2016   20 comments
The Japanese semiconductor industry’s downfall is undeniable. EE Times went back to Japan and explored what remains of Japanese chip vendors, how Japan Inc. has crumbled and if we grade recent restructuring programs, who comes out on top.
Winbond Stacks NOR, NAND Flash
News & Analysis  
4/11/2016   1 comment
SpiStack W25M Series stacks homogeneous or heterogeneous flash to provide memories of varying densities for code and data storage for smaller M2M and IoT devices.
Severance Clash in Microchip/Atmel Merger
News & Analysis  
4/11/2016   15 comments
Microchip’s CEO blames Atmel’s board for failing to communicate about a severance package that left at least one employee charging Microchip is reneging on a promise.
Plessey Sees Greener Pastures in Horticultural Lighting
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4/11/2016   Post a comment
Plessey will add new arm to its semiconductor fab operations with a global exclusive license agreement to manufacture and sell the PhytoLux horticultural lighting product.
Plessey Sees Greener Pastures in Horticultural Lighting
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4/11/2016   Post a comment
Plessey will add new arm to its semiconductor fab operations with a global exclusive license agreement to manufacture and sell the PhytoLux horticultural lighting product.
NXP Unit Reportedly Attracts Chinese Suitors
News & Analysis  
4/11/2016   1 comment
Chinese suitors including Beijing-based JAC Capital Management are interested in NXP's standard products business, according to a Bloomberg report.
ASIC Pioneer, Tech Historian Rob Walker Dies
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4/11/2016   Post a comment
Rob Walker, co-founder of LSI Logic, passed away last week from pancreatic cancer. In many ways, Walker was Silicon Valley, long before Silicon Valley became all about Google and Facebook.
Renesas to Hire Kure, 3rd CEO in a Year
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4/8/2016   Post a comment
Renesas Electronics Corp. will appoint Bunsei Kure, a former CEO of Calsonic Kansai, a large Japanese automotive component supplier, as its new president and CEO, Nikkei, Japan’s economic newspaper, reported Saturday
Semiconductor Forecast Slumps
News & Analysis  
4/8/2016   4 comments
A veteran market watcher lowered his semiconductor market forecast expecting a decline of 2.13% in 2016 amid a sluggish start to the year.
Machine Learning Routes Chips
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4/8/2016   Post a comment
The last day of the International Symposium of Physical Design 2016 (ISPD, 2016, April 3-6, Santa Rosa, Calif.) with the annual design contest and best paper awards.
China Facing Long-Term Memory Gap
News & Analysis  
4/8/2016   1 comment
China, Inc.’s rush to build its own memory business is real. But just how — and how soon — remains a complete mystery. But XMC claims its first 3D NAND flash memory test chip “passed the electrical verification” a year ago.
Programmable Crystal Oscillators Cover the 0.67 to 170MHz Range
News & Analysis  
4/8/2016   Post a comment
Seiko Epson is extending its line of programmable crystal oscillators with the SG-8101 series and SG-9101 series, both operating in an extended temperature range of -40 to +85ºC (a top-end limit of 105°C).
High-Speed CAN Transceivers Eliminate Chokes, Withstand EMC
News & Analysis  
4/8/2016   Post a comment
Texas Instruments has added two families of controller area network (CAN) transceivers that meet all industry requirements for electromagnetic compatibility (EMC) from U.S. and European automotive manufacturers; and that offer high bus-fault protection, fast CAN flexible data rate (FD) speeds and shortest loop delay.
Cognitive Computing Platform Unites Xilinx and IBM
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4/7/2016   Post a comment
Xilinx and IBM announced that they will enable FPGA-based acceleration within the SuperVessel OpenPOWER development cloud services offered on ptopenlab.com.
10nm DDR4 DRAM Could Defy Moore
News & Analysis  
4/7/2016   5 comments
Samsung said it has overcome scaling challenges to address scaling challenges that were previously thought to mean the end of Moore's Law.
Chip Market Decline Deepens
News & Analysis  
4/7/2016   3 comments
A chip market decline that began mid-2015 looks set to continue through the first quarter of 2016 at least, with falling markets on an annual basis in all geographies except China.
MEMS Energy Exchange Shows PV Promise
News & Analysis  
4/7/2016   2 comments
An academic team reported building a nanoscale MEMS device that transfers heat radiatively at 100 times the theoretical level and that could impact electricity generation.
IBM Neurocomputer Detailed
News & Analysis  
4/7/2016   5 comments
IBM unveils details about its TrueNorth neuromorphic computer chip modeled on the human brain.
Organic and Printed Electronics Industry is Hiring
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4/7/2016   Post a comment
According to the latest business climate survey conducted by the Organic and Printed Electronics Association, 80% of survey participants expect the industry to continue its positive development in the coming year with a projected growth in sales revenue of 11% for 2016.
Freescale Takeover Makes NXP Largest Automotive Chip Vendor
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4/7/2016   Post a comment
Latest analysis by market watcher Semicast Research claims NXP was the leading vendor of semiconductors to the OE automotive sector in 2015.
Intel Grabs OTA Platform Vendor Arynga
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4/6/2016   Post a comment
Intel acquired Arynga, a vendor of over-the-air software for cars. In the future, Arynga's products and technologies will be sold by Intel subsidiary Wind River.
Fab-in-a-Box: Flexible Electronics Scale Up
News & Analysis  
4/6/2016   Post a comment
The first FlexLogIC system to be commissioned from Deutch contract manufacturing partner VDL Enabling Technologies Group (VDL ETG) and expected in 2017, will transfer PragmatIC's flexIC production process into a self-contained, fully automated, modular design, with capacity for billions of flexICs at a capital cost between 100 and 1000 times lower than a silicon fab.
Android Auto Rolls Into 18 New Countries
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4/6/2016   Post a comment
Google's Android Auto tool that gives drivers access to features including maps, music, and search, is now available in a larger selection of countries around the world.
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What are the engineering and design challenges in creating successful IoT devices? These devices are usually small, resource-constrained electronics designed to sense, collect, send, and/or interpret data. Some of the devices need to be smart enough to act upon data in real time, 24/7. Are the design challenges the same as with embedded systems, but with a little developer- and IT-skills added in? What do engineers need to know? Rick Merritt talks with two experts about the tools and best options for designing IoT devices in 2016. Specifically the guests will discuss sensors, security, and lessons from IoT deployments.
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