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posted in October 2010
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Analysis: Why Renesas is creating mobile IC spinoff
News & Analysis  
10/31/2010   5 comments
Renesas Electronics' decision to spin out its mobile semiconductor products into a separate subsidiary is motivated not only by the differences between the markets for microcontrollers and baseband chips, but also to help protect Renesas' power amplifier business.
Microsoft buys 3-D sensor firm
News & Analysis  
10/31/2010   5 comments
Canesta Inc. has signed a definitive agreement to be acquired by Microsoft Corp.
Consortium aims to stake 'vampire power'
News & Analysis  
10/29/2010   12 comments
A consortium backed by the European Union aims to reduce standby power for electronic devices, which is estimated to account for 10 percent of European energy usage.
Graphene bandgap opened by vapor
News & Analysis  
10/29/2010   10 comments
Tuning a semiconductor bandgap in sheets of pure carbon called graphene can be done using water vapor during fabrication, according to researchers from Rensselaer Polytechnic Institute.
Battle brews over GlobalFoundries tech park
News & Analysis  
10/29/2010   4 comments
A battle is brewing over the control of a technology park where GlobalFoundries Inc. is building a 300-mm fab in New York state.
Intel, Toshiba, Samsung to form IC consortium
News & Analysis  
10/29/2010   16 comments
Rumors are running rampant that Intel Corp, Toshiba Corp. and Samsung Electronics Co. Ltd. will join forces to co-develop 10-nm chip technologies.
Asia fuels sales of 1.34B cellphones in 2010
News & Analysis  
10/29/2010   10 comments
Vendors are expected to ship as many as 1.34 billion cellphone handsets this year with sales projected to hit 1.7 billion units a year in 2015, according to ABI Research.
Intel opens Vietnam IC-assembly plant
News & Analysis  
10/29/2010   8 comments
After some delays, Intel Corp. has officially opened its new IC-packaging and test plant in Vietnam, according to reports.
Carbon Design Systems launches IP web portal
Product News  
10/29/2010   1 comment
New IP web portal eliminates the virtual platform assembly bottleneck by offering models for the majority of third-party IP content used in advanced SoC / FPGA designs.
SMIC changes course with Wuhan fab
News & Analysis  
10/29/2010   Post a comment
China's Semiconductor Manufacturing International Corp. (SMIC) has recently exited from one fab alliance, but it plans to change its strategy and invest in another fab venture.
New design software transforms board management
Product News  
10/29/2010   1 comment
New software enables analog and board designers to integrate a circuit board’s power management and digital board management functions into the newly announced Platform Manager device family.
Lattice intends to blow your socks off at Electronica 2010
News & Analysis  
10/29/2010   9 comments
Held every two years, Electronica – one of the largest and most anticipated trade shows in the industry – attracts thousands of companies and tens of thousands of attendees, including over 700 journalists from 34 countries.
Samsung tops forecast, sees DRAM glut
News & Analysis  
10/29/2010   10 comments
South Korea's Samsung Electronics Co. Ltd. beat analysts' estimates for the third quarter, but the company issued a warning about a pending DRAM glut in the marketplace.
Analog chip vendors post profits
News & Analysis  
10/28/2010   5 comments
Analog chip vendors Maxim Integrated Products, Alpha and Omega Semiconductor and MaxLinear reported profits for their most recently concluded quarters
Tessera drops wafer-level optic effort
News & Analysis  
10/28/2010   3 comments
Tessera Technologies Inc. has scrapped further development of its wafer-level optics line for camera modules.
ESI buys firm, posts loss
News & Analysis  
10/28/2010   Post a comment
Electro Scientific Industries Inc. (ESI) has acquired the assets of PyroPhotonics Lasers Inc., a manufacturer of tailored-pulse fiber lasers based in Montreal, Canada.
connectBlue launches OWS451 Wireless LAN Serial Port Adapter with enterprise security
Product News  
10/28/2010   1 comment
connectBlue’s new OWS451 Wireless LAN Serial Port Adapter is designed to facilitate replacement of a serial cable with a wireless LAN connection. The new adaptor is based on the latest IEEE802.11a/b/g/n standards and provides state-of-the-art security options, as well as dual-band support for both 2.4 and 5GHz radio bands.
Are we in a fab tool downturn?
News & Analysis  
10/28/2010   9 comments
Are we in a fab tool lull, slowdown or downturn?
Interconnect pushed China super to #1
News & Analysis  
10/28/2010   26 comments
A homegrown, ultrafast interconnect chip set was part of the secret sauce behind the Tianhe-1a, the first China-built system to be named the world's fastest supercomputer.
Hynix, Magnachip post Q3 gains
News & Analysis  
10/28/2010   1 comment
South Korean chip makers Hynix Semiconductor and MagnaChip Semiconductor reported third quarter sales increases despite some signs of a softening semiconductor market.
Microchip adds license for MIPS32 M14K cores, expands 32-bit MCU options
News & Analysis  
10/28/2010   6 comments
Microchip Technology Inc. is licensing the MIPS32 M14K family of cores from MIPS Technologies Inc. to expand on its 32-bit PIC32 microcontroller family, which is currently based on the MIPS32 M4K.
Hynix uses SpringSoft's Verdi, Laker for flash memory apps
News & Analysis  
10/28/2010   Post a comment
Hynix Semiconductor Inc. said it has deployed SpringSoft's Verdi software as the debug platform for digital designs and the company's Laker software as the custom chip design platform for flash memory applications.
ATMI invests in LED materials firm
News & Analysis  
10/28/2010   Post a comment
ATMI Inc. has purchased a minority interest in Lake LED Materials of Daejeon, South Korea, a materials technology startup focused on providing metal organic precursors to the LED market. Under the agreement, ATMI will help accelerate commercial LED materials introductions, with select marketing and technology rights.
TSMC posts record quarter, sees lull
News & Analysis  
10/28/2010   8 comments
Silicon foundry giant Taiwan Semiconductor Manufacturing Co. Ltd. (TSMC) announced consolidated revenue of a record NT$112.25 billion ($3.65 billion) in the quarter, up 6.9 percent from the previous quarter and up 24.8 percent a year ago.
Atrenta, CEA-Leti team on 3D design, advance power reduction
News & Analysis  
10/28/2010   Post a comment
Soon after it established presence in Grenoble, France, Atrenta Inc. announced the signing of a multiyear collaboration agreement with CEA-Leti on advanced power reduction and 3D design.
Group forms to devise SSD standards
News & Analysis  
10/28/2010   3 comments
A collection of companies have announced the so-called Solid State Drive (SSD) Form Factor Working Group to advance Peripheral Component Interconnect Express (PCIe) storage drives through standardization.
Will Broadcom buy change the femto market?
News & Analysis  
10/28/2010   13 comments
Broadcom’s $86 million acquisition of Percello validates the fledgling femtocell market; it presents a scenario for femtocell to get integrated in another box; and it shows the future of femtocells priced on par with WiFi.
Google, Avatar chiefs talk tech, climate change
News & Analysis  
10/28/2010   13 comments
The chief executive of Google and the director of "Avatar" shared thoughts on technology, cinema and climate change in an on-stage interview.
PandaBoard touts low-cost OMAP 4 mobile software dev
Product News  
10/28/2010   3 comments
PandaBoard is an open source development tool for mobile devices that provides access to the OMAP 4 applications processor platform from Texas Instruments Incorporated (TI). The OMAP 4 platform is power- and performance-optimized for Smartphones and other mobile devices. A growing online community of Linux experts supports PandaBoard developers designing on mobile open source software distributions such as Android, Angstrom, Chrome, MeeGo and Ubuntu.
Oracle invests in Mellanox
News & Analysis  
10/27/2010   7 comments
In a major move, Oracle Inc. has made a strategic investment in Mellanox Technologies Ltd., a supplier of InfiniBand-based chip technology.
Intel to spend $1.5 billion on litho
News & Analysis  
10/27/2010   11 comments
Intel Corp. is expected to spend some $1.5 billion for lithography gear alone in 2011.
Submitted for your approval: EE Times Confidential
News & Analysis  
10/27/2010   17 comments
Our newest publication, EE Times Confidential, is a subscription-based intelligence report delivered to subscribers in PDF format.
ASML sells U.S. optics unit
News & Analysis  
10/27/2010   1 comment
Zygo Corp., a provider of high precision optical components and optical metrology instruments, has entered into an agreement with ASML Holding NV to purchase substantially all the assets of ASML's Richmond, Calif.-based optics facility.
Update: Renesas tips early retirement program
News & Analysis  
10/27/2010   9 comments
Loss-ridden Renesas Electronics Corp. has lowered its forecast and announced an early retirement program for its employees in Japan.
Intel backs cloud computing alliance
News & Analysis  
10/27/2010   6 comments
Intel through its clout behind cloud computing, pledging to help drive the creation of standards, including participation in an alliance of global businesses.
Renesas to spinoff mobile chip unit
News & Analysis  
10/27/2010   2 comments
Japan's Renesas Electronics Corp. has decided to spinoff its mobile chip unit into a new and consolidated subsidiary, Renesas Mobile Corp., effective Dec. 1, 2010.
Report: A new buyer for Hynix?
News & Analysis  
10/27/2010   Post a comment
State-run Korea Finance Corp. is ''mulling a plan' to buy a large stake in Hynix Semiconductor Inc., according to the JoongAng Daily.
Francisco Partners buys optical firm
News & Analysis  
10/27/2010   Post a comment
Source Photonics Inc., a provider of optical communication products used in telecommunication systems and data communication networks, announced today that it has been acquired by Francisco Partners, a private equity fund.
Dongbu expands auto IC foundry efforts
News & Analysis  
10/27/2010   3 comments
South Korean foundry vendor Dongbu HiTek has qualified its 180-nm mixed-signal process and EEPROM intellectual property (IP) to meet the quality and reliability criteria set forth in the automotive AEC-Q100 ‘Grade 0’ standard.
Group will certify demand response systems
News & Analysis  
10/27/2010   2 comments
A handful of smart grid users and vendors have formed a nonprofit group to create a test and certification program for energy demand-response systems.
Five good, five bad signs for IC market
News & Analysis  
10/27/2010   6 comments
Here are some good and bad signs for the electronics industry.
Don't blame Obama for fabless America
News & Analysis  
10/27/2010   34 comments
Lately it’s become popular for the media to deride the Obama administration for creating a business climate of uncertainty that is causing American manufacturers to hold up on investing more productive capability in the United States.
Test
Product News  
10/27/2010   Post a comment
Test
Projection display firm raises VC
News & Analysis  
10/27/2010   2 comments
Light Blue Optics Ltd., a startup company developing a color projector suitable for inclusion in mobile phones and other portable equipment, has announced it has raised $13 million in funding.
BI Technologies Model 144 series resistor networks
Product News  
10/27/2010   2 comments
Aimed at military and aerospace applications, TT electronics BI Technologies is offering high-reliability custom resistor networks in hermetically sealed metal or HTCC packaging, enabling harsh environment operation to +175°C.
IBM, European researchers seek CMOS successor
News & Analysis  
10/27/2010   6 comments
IBM Research Zurich, Infineon Technologies and Globalfoundries have joined forces with a half dozen European universities and research centers on a mission to cut the power consumption of electronic devices by10-fold and reduce standby power to zero.
Samplify offers hardware kit for ultrasound
News & Analysis  
10/27/2010   6 comments
Samplify Systems has introduced the SMK9130 Ultrasound Beamforming Development Kit as a complete hardware solution for the ultrasound front end, from probe connector to PCIe connector.
Audio hub codec enables HD audio in portable apps
Product News  
10/27/2010   Post a comment
The WM8958 audio hub solution from Wolfson Microelectronics is designed to help bring high-definition (HD) audio to the next generation of portable multimedia devices.
Fairchild uses Magwel's Power Transistor Modeling tool to verify high current power devices
News & Analysis  
10/27/2010   Post a comment
Fairchild Semiconductor has selected Magwel's Power Transistor Modeling (PTM) tool for use in its design and verification of high current power devices.
UMC posts big Q3, sales hit $1B
News & Analysis  
10/27/2010   3 comments
Taiwan's United Microelectronics Corp. (UMC) posted strong results in the third quarter, but the foundry vendor sees a slowdown in the fourth period.
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