IBOC digital radio gets industry nod News & Analysis 11/30/2001 Post a comment The National Radio Systems Committee endorsed a digital FM radio broadcast technology Thursday (Nov. 29) and recommended that it be approved as an upgrade to current U.S. analog FM broadcasts.
TEL enhances prober to handle mix of 200- and 300-mm wafers News & Analysis 11/30/2001 Post a comment TOKYO -- In a move to increase flexibility and throughput in wafer-test operations, Tokyo Electron Ltd. today announced an enhanced version of its P-12XL prober, which adds a new sort loader, semi-automatic probe card changer, and an improved wide area probe polish feature.
Tellabs to acquire Ocular for $355 million News & Analysis 11/30/2001 Post a comment Core-switch vendor Tellabs Inc. said Friday (Nov. 30) that it planned to acquire Ocular Networks Inc., a move that would give Tellabs an infusion of next-generation technology and expand its market into smaller installations.
Japan's SEH shuts down 6-in. wafer lines in U.S., cuts 350 jobs in Vancouver News & Analysis 11/30/2001 Post a comment VANCOUVER, Wash. -- Japanese silicon wafer giant Shin-Etsu Handotai Group (SEH) announced plans to shift its 6-inch production lines from the United States to Malaysia--a move that impacts 25.9% of its workforce, or 350 jobs, in its U.S. subsidiary here.
In an apparent move to cut costs, SEH America Inc.--the U.S. subsidiary of SEH--on Thursday here announced plans to shift its older-generation, 6-inch wafer polishing lines from its U.S. headquarters in Vancouver, to a sister plant in Kuala Lu
MPEG-4 tapped for set-tops, home networks News & Analysis 11/30/2001 Post a comment MPEG-4 compression technology is gathering steam, earning keen interest from set-top-box vendors and semiconductor companies hungry to add features to current designs, and from service providers eyeing it for home networking and for set-tops integrated with personal video recorders.
Customs calls for tighter U.S. borders News & Analysis 11/30/2001 Post a comment implications of tighter trade measures could be felt in the high-tech sector, The U.S. Customs Service is asking traders -- including those within the electronics industry -- to help devise tighter security measures in the wake of the Sept. 11 terrorist attacks on the United States.which will likely have to pass along more information about goods and packages moving through its supply chain.
Alcatel fields PON to deliver triple play of services News & Analysis 11/30/2001 Post a comment As cable operators beef up delivery of voice and data services, their networks are increasingly intertwining with optical ones to give a new look to cable's infrastructure. Capitalizing on that new look, Alcatel has developed a passive optical network (PON) scheme, which it demonstrated at the cable industry's Western Show this past week.
ASML pushes out delivery of SVG's 157-nm tool by a year, sources say News & Analysis 11/30/2001 Post a comment SANTA CLARA, Calif. -- After dropping its 193-nm scanner line earlier this week, the Silicon Valley Group Inc. (SVG) unit of ASM Lithography has reportedly pushed out the delivery of its 157-nm tool to late-2002--or about a year later than previously expected, according to sources.
The delay could be another setback for ASML of the Veldhoven, the Netherlands. Plagued by chronic delays, SVG's Micrascan V 193-nm lithography system is being discontinued by ASML, which on Tuesday said it will conve
ATE, IC-packaging gear, and other tool segments hit hard in Q3, says SEMI News & Analysis 11/30/2001 Post a comment SAN JOSE -- It's safe to say that the chip-equipment market was terrible in the third quarter of 2001, especially for suppliers of back-end gear, according to statistics from the Semiconductor Equipment & Materials International (SEMI) trade group here.
Shipments and bookings for all chip-equipment segments were depressed in the third quarter of 2001, but the back-end segments like testers and IC-packaging tools were especially hit hard. In some cases, shipments of automatic-test equipment (A
Electronics industry may finally have hit bottom News & Analysis 11/30/2001 Post a comment The long-awaited bottom of the industry downturn may finally have been reached, if recent financial statements issued by key companies are any indication.
A host of companies, including Dell, Flextronics, and Intel, have confirmed their earlier forecasts for the current quarter, a refreshing change from previous quarters, when revenue and earnings projections were routinely downgraded as the market continued to deteriorate.
Shift to 450-mm wafers pushed out to 2013, says ITRS roadmap News & Analysis 11/30/2001 Post a comment SANTA CLARA, Calif. -- While IC technology is expected to accelerate over the next several years, the shift to 450-mm wafers in chip processing appears to have been pushed out by about four years, from 2008 to 2013, according to the new 2001 International Technology Roadmap for Semiconductors (ITRS).
In 1999, an executive from International Sematech predicated that chip makers would move from 300- to 450-mm wafers in IC production sometime in the 2008 time frame. Now, it appears that the shif
Exec sees home nets as future cornerstone of cable services News & Analysis 11/30/2001 Post a comment In stronger terms than most leaders in the cable industry usually dare, AOL Time Warner co-chief operating officer Robert Pittman used the Western Show Thursday (Nov. 29) to herald home networking as the key platform to extend the reach of cable beyond the set-top box, beyond cable modems, and beyond the transmission of TV shows to couch potatoes.
Dc/dc line handles heat Product News 11/30/2001 Post a comment C&D Technologies' WPN20R series of dc/dc converters operates over -40 degrees to +105 degrees C with no output power derating, making it ideal for use in environments that require flexibility and robust performance.
Ethernet card hot-swaps Product News 11/30/2001 Post a comment SBS Technologies' CP3-Quad100TX is a hot-swap-capable, 64-bit, 66-MHz Ethernet card for 3U CompactPCI computing applications in telecommunications, medical imaging and industrial automation.
Dainippon Screen teams with IMEC to develop ultra-clean processes for fabs News & Analysis 11/30/2001 Post a comment LEUVEN, Belgium -- Dainippon Screen Mfg. Co. Ltd. of Japan and the IMEC research group here announced plans to collaborate in the development of ultra-clean processes for wafer fabrication. The goal is to create new single-wafer cleaning steps that will be four-to-five years ahead of process requirements in the chip industry.
Host bus adapters attack storage-net bottlenecks Product News 11/30/2001 Post a comment A family of dual-port, PCI-X host bus adapters (HBAs) from Agilent Technologies Inc. is said to eliminate the performance bottlenecks and interoperability issues typically associated with such devices in 2-Gbit/second Fibre Channel storage-area networks (SANs).
EBX-compliant board totes fast CPU for high reliability Product News 11/30/2001 Post a comment VersaLogic Corp. has equipped its VSBC-8 EBX-compliant single-board computer with a fast CPU, suiting it for applications in medical, military and semiconductor-manufacturing equipment, or other embedded applications requiring high reliability and low downtime.
Magnetic modules reduce board space Product News 11/30/2001 Post a comment ulse has launched a line of dual Gigabit Ethernet magnetic modules for networking applications. Designed for Category 5 cable, the modules are said to provide electrical isolation and low common-mode emissions in Ethernet switches.
Sematech warns of bottleneck for 157-nm lithography News & Analysis 11/30/2001 Post a comment While semiconductor industry officials in California upped the ante for advanced IC production technology with the rollout of the 2001 International Technology Roadmap for Semiconductors on Thursday (Nov. 29), a gathering of mostly U.S.-based researchers warned a group of Taiwanese chip manufacturers that numerous obstacles jeopardize a smooth transition to implementing 157-nanometer lithography.
Micrel's EL lamp drivers aim at cell phones, PDAs Product News 11/30/2001 Post a comment Micrel has entered the electroluminescent lamp driver IC market with two chips that convert a 1.8- to 5.5-volt input voltage to a high-voltage ac signal capable of driving an EL lamp in a cell phone, PDA, remote controller or other device.
Low-power 16-bit A/D includes gain amp Product News 11/30/2001 Post a comment Asahi Kasei Microsystems (AKM) Semiconductor Inc. is offering a low-power, 16-bit audio analog-to-digital (A/D) converter with a built-in 15-dB gain amplifier for portable video and audio equipment and digital video recorders.
Pcb pin headers look to cut cost Product News 11/30/2001 Post a comment Weidmuller Inc. has added a 5.08-mm-pitch version, available in two- to 24-pole versions, to its line of liquid-crystal polymer SL-SMT printed-circuit-board pin headers.
What are the engineering and design challenges in creating successful IoT devices? These devices are usually small, resource-constrained electronics designed to sense, collect, send, and/or interpret data. Some of the devices need to be smart enough to act upon data in real time, 24/7. Are the design challenges the same as with embedded systems, but with a little developer- and IT-skills added in? What do engineers need to know? Rick Merritt talks with two experts about the tools and best options for designing IoT devices in 2016. Specifically the guests will discuss sensors, security, and lessons from IoT deployments.