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posted in February 2003
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Palm cuts workforce by 19 percent
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2/28/2003   Post a comment
MANHASSET, N.Y. — Palm Inc. (Milpitas, Calif.) slashed its overall workforce by 19 percent, or about 250 employees, largely in the United States during its fiscal third quarter.
Contest offers free layout or schematic editor
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2/28/2003   Post a comment
SAN MATEO, Calif.— One-man EDA company Stabie-Soft Inc. is running a contest in which the winner gets his or her choice of Stabie-Soft's layout or schematic editor. The winner gets their choice of a license for the Slam layout editor valued at $3,500, or the Scheture schematic editor valued at $1000, and can also choose the platform -- Linux or Solaris.
Cisco creates wireless-LAN adapter extensions
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2/28/2003   Post a comment
Cisco Systems Inc. has announced client-side wireless local-area network adapter extensions that will address the security and network-management concerns that have slowed WLAN deployment to date, the company said. Intended as augmentations to the current IEEE 802.11 standard and its associated Wi-Fi interoperability testing, the enhancements have garnered support from leading WLAN semiconductor suppliers as well as PC and mobile-device OEMs.
Heard on the Beat
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2/28/2003   Post a comment
Transaction-based methodology supports HW/SW co-verification
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2/28/2003   Post a comment
Using an ARM-based SoC as an example, Axis Systems' Jason Andrews offers a detailed walkthrough of the hardware/software co-verification process, and introduces a new transaction-based debugging approach.
ASE, Altera qualify lead-free packages for FPGAs
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2/28/2003   Post a comment
Taiwan's Advanced Semiconductor Engineering Inc. (ASE) announced that Altera Corp. has qualified its lead-free, IC packages for FPGA designs.
Sharp, Atmel launch ARM9 controllers
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2/28/2003   Post a comment
Atmel Corp. and Sharp Microelectronics are rolling out ARM9-based microcontrollers that integrate enough features to make them system-on-chip (SoC) devices.
IBM pushes out 157-nm, NGL in litho roadmap
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2/28/2003   Post a comment
During the SPIE Microlithography show this week, IBM Corp. provided details about its lithography strategy, disclosing it has pushed out 157-nm and next-generation tools on its roadmap.
10-Gbit/s transceivers court reluctant market
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2/28/2003   Post a comment
Chip makers are clamoring to show off technology that can transfer serialized data at speeds of 10 Gbits/second, but are customers ready to bite?
ParthusCeva taps Intersil 802.11 WLAN technology for SoC licensing
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2/28/2003   Post a comment
ParthusCeva Inc. has licensed elements of the Prism 802.11a, .11b and .11g wireless local-area network chip sets from Intersil Corp. and plans to offer them as licensable intellectual property for system-on-chip designs.
90-nm design still a year and some big hurdles away
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2/28/2003   Post a comment
IBM believes it will be first. Intel will start before the end of the year. Texas Instruments will start early next year. Others will follow. Leading chip makers are working to move 90-nanometer process technologies into volume production, and several are already offering samples of 90-nm designs. But the hurdles of 90-nm design and production are still significant, according to a panel of industry executives convened last week.
No end in sight for DDR price meltdown
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2/28/2003   Post a comment
Contract prices for mainstream DDR SDRAM have plunged 25% to 33% in a month amid a glutted global market.
No end in sight for DDR price meltdown
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2/28/2003   Post a comment
Contract prices for mainstream DDR SDRAM have plunged 25% to 33% in a month amid a glutted global market. Although DDR prices have been declining steadily from a peak in November, the latest sharp drop was welcomed by OEM buyers caught in their own competitive product pricing squeeze.<
Rival groups aim for auto 'by-wire' spec
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2/28/2003   Post a comment
TTA Group and the FlexRay Consortium, two key organizations battling for the high ground of the automotive "by-wire" arena, said today that they now hope to agree on a common safety-critical standard.
Lucent inks GSM outsourcing deal with Hughes
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2/28/2003   Post a comment
Lucent Technologies (Murray Hill, N.J.) has signed a multi-year deal with Hughes Software Systems Ltd. to outsource software development and maintenance of Lucent's GSM-related operations.
Infineon CEO backs tech transfers to China
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2/28/2003   Post a comment
Infineon Technologies' top boss said last week that the most advanced semiconductor production technologies should get a green light for export to China. "Effectively, China needs to be up to speed just like every other region," said chief executive officer Ulrich Schumacher.
SafeNet acquires assets of Raqia Networks
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2/28/2003   Post a comment
PARIS — SafeNet, a provider of private and public network security technologies based in Baltimore, MD., announced today (Feb. 28th) that it has purchased the technology assets of Raqia Networks, a Newton, Mass.-based fabless chip company which specializes in the development of system-on-a-chip and co-processors for content inspection.
Consolidation a hot potato in EDA
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2/28/2003   Post a comment
Debate over the need for vendor consolidation in the design automation industry tested the tempers of EDA chief executives at the Design and Verification Conference here last week, or at least those who dared attend.
Thomson to participate in French TV-over-ADSL trials
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2/28/2003   Post a comment
Seeking to deliver TV programming over ADSL, Thomson said it is participating in two key video-over-ADSL projects recently launched by TF1 group and Monaco Telecom.
Jabil awarded contract by NEC
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2/28/2003   Post a comment
EDA divided on SystemVerilog
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Enthusiastic support for SystemVerilog alternated with undercurrents of concern at last week's DVCon Design and Verification Conference in San Jose, Calif.
Package twist stacks dice against SoCs
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Stacked-die packaging — in which IC dice are literally stacked one on top of the other, electrically connected and encapsulated — has taken root in the cell-phone handset market as a way to increase memory capacity while reducing footprint. But now the technology is growing in complexity and appears on the way to becoming a serious alternative to system-level IC design.
Sun, IBM take processors multithreaded, multicore
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2/28/2003   Post a comment
Sun Microsystems Inc. and IBM Corp. last week disclosed plans to take high-end microprocessor design to the next level, separately describing new generations of multicore, multithreaded CPUs.
Lithography roadmap remains unsettled
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2/28/2003   Post a comment
Papers at the Future of Lithographic Systems track at SPIE here Thursday (Feb. 27) revealed a far from settled roadmap for production lithography, with serious alternative paths branching off from the main road as early as the 90 nm process node.
Small fields save bucks, vendors argue
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2/28/2003   Post a comment
A paper presented Friday (Feb. 28) at the SPIE conference disclosed recent work in support of the movement for small-field lithography. Co-authored by researchers from Numerical Technologies Inc. (San Jose, Calif.) and Photronics, Inc. (Dallas), the paper presents quantitative arguments in favor of using only part of the available reticle on advanced steppers.
Micron gets Congressional support in Hynix dispute
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2/28/2003   Post a comment
Two U.S. Senators with Micron Technology fabs in their states Thursday introduced a Congressional resolution deploring what they charged was the continued Korean government bailout of Hynix Semiconductor Inc.
Swedish design firm offers 'regression analyzer'
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2/28/2003   Post a comment
Aiming to automate the process of managing simulation runs over multiple CPUs, the ISS Group, a design services company in Stockholm, Sweden, has introduced a product called Rose. It works with Verisity's Specman offering and supports a random-based testing methodology.
Hynix plans to open 300-mm pilot line this year
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2/28/2003   Post a comment
Hynix Semiconductor Inc. plans to open a 300mm-wafer pilot line in the fourth quarter of this year with initial production starting one quarter later.
Equipment makers dip toe in immersion litho
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2/28/2003   Post a comment
Lithography vendors at the SPIE Microlithography conference here last week said they are getting their feet wet with a technology that could possibly be the industry's next breakthrough — immersion lithography.
Mobile gaming drives plans for 3-D graphics
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2/28/2003   Post a comment
Lured by the siren call of mammoth shipments for cellular handsets, graphics companies will come to the Game Developers Conference (GDC) in San Jose, Calif., this week to ponder technology game plans for the phone-based game market.
PDA-Markt soll wieder wachsen
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2/28/2003   Post a comment
Niedrigere Preise, verbesserter Leistungsumfang und die Kompatibiltät mit Wireless- und Multimedia-Technologien werden den PDA-Markt in diesem Jahr wieder auf Wachstumskurs bringen. Das hat das Marktforschungsinstitut InStat/MDR ermittelt.
Flomerics set to combine EMC and thermal analysis
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2/28/2003   Post a comment
LONDON -- Flomerics Ltd., a provider of thermal and electromagnetic compatibility (EMC) simulation software for electronics systems, is planning to show visitors to the DATE exhibition an EDA tool that combines both types of simulation in a single piece of software.
Lieferverträge für Flachbildschirme weiterhin an der kurzen Leine
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2/28/2003   Post a comment
Die Preisbindungen im Markt für Flachbildschirme sind ungewöhnlich kurz: Kaum ein OEM will Preisvereinbarungen mit den LCD-Herstellern treffen, die länger als 30 Tage gültig sind.
Application processors to drive handset IC growth
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2/28/2003   Post a comment
Applications processors represent the biggest opportunity for semiconductor manufacturers targeting the mobile handset business, according to a just published report from market research group Allied Business Intelligence (ABI).
Des chercheurs présentent le prototype radio PAN sans fil
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2/28/2003   Post a comment
Des chercheurs du Korean Advanced Institute of Science and Technology ont mis au point un prototype de radio, conforme à la norme IEEE 802.15.4 pour réseaux individuels sans fil (WPAN).
Ericsson backs microwave link for faster 3G roll-out
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2/28/2003   Post a comment
Ericsson has developed a scalable microwave aggregation node for mobile networks which, according to the company's head of research, has the potential to increase significantly the pace at which operators can roll out 3G networks. The traffic node is already undergoing trials with several operators, and is due to be commercially available during the third quarter of this year.
More funding for Scottish start-ups as Essient opens HQ
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2/28/2003   Post a comment
More than a dozen Scottish research and development institutes will receive a £5.7m funding from the Scottish Executive Proof of Concept (PoC) fund, which aims to promote small technology start-ups in Scotland.
NEC présente MRAM pour mobiles à l'ISSCC
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2/28/2003   Post a comment
NEC a profité de l'International Solid-State Circuit Conference (ISSCC), à San Francisco, pour présenter une nouvelle solution de mémoire qui remplacerait les mémoires DRAM et flash dans les téléphones mobiles.
ARM trotzt der Krise
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2/28/2003   Post a comment
Gut gehalten hat sich der Prozessortechnologie-Lieferant ARM Holding im Abschwungjahr 2002: Während viele Unternehmen in diesem Segment ihren Umsatz einbrechen sahen, konnte ARM immerhin um 3 Prozent wachsen. Und die Zukunft sieht man bei ARM auch nicht gar so grau in grau: Die gut gefüllte Produktpipeline der ARM-Lizenznehmer lasse eine stetige Zunahme der Lizenzeinnahmen erwarten.
Aptix emulation supports ARM926, ARM11
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2/28/2003   Post a comment
Aptix Corp., a supplier of FPGA-based emulation systems, plans to demonstrate the ability to emulate the ARM926EJ-S microprocessor core and PrimeXsys peripherals on an Aptix Software Integration Station at the DATE exhibition and conference. Aptix has also hosted RTL code for the ARM11 core on an Aptix emulator, the company said.
Infineon und ProMos begraben das Kriegsbeil
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2/28/2003   Post a comment
Just zu dem Zeitpunkt, an dem die Infineon Technologies AG und ProMos Technologies bereit schienen, ihre unschöne Scheidungsschlacht zu Ende zu führen, haben die beiden entfremdeten Partner einen Kurswechsel vollzogen und bei einem Treffen einen erneuten Versöhnungsversuch unternommen.
Le courant de fuite fait obstacle à la complexité des puces
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2/28/2003   Post a comment
Au cours des dix prochaines années, l'industrie des semi-conducteurs devra réduire le courant de fuite de deux ordres de grandeur dans les conceptions de puce ou bien faire face à une interruption dans la complexité anticipée des puces, déclare le professeur Takayasu Sakurai de l'Université de Tokyo dans son allocution principale lors de l'International Solid-State Circuits Conference (ISSCC) sur les circuits à semi-conducteurs, le lundi 10 février.
Quad-band PA module
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2/28/2003   Post a comment
The RF3133 power amplifier operates in the 850, 900, 1800, and 1900 MHz GSM bands. It operates from a +3V supply and delivers 55% typical efficiency in the 850 and 900MHz bands.
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