Design Con 2015
Breaking News
News Analysis
posted in February 2011
Page 1 / 9   >   >>
SPIE: EUV sources behind schedule
News & Analysis  
2/28/2011   4 comments
Extreme ultraviolet (EUV) lithography is making progress, but the power source for the technology is behind schedule, warned keynote speakers at the SPIE Advanced Lithography conference here.
TSMC to make FinFETs in 450-mm fab
News & Analysis  
2/28/2011   Post a comment
At the SPIE Advanced Lithography conference here, Taiwan Semiconductor Manufacturing Co. Ltd. (TSMC) outlined more details about its 450-mm fab plans.
Intel completes McAfee buy
News & Analysis  
2/28/2011   8 comments
Intel said it completed the previously announced acquisition of McAfee after receiving regulatory approval.
Cadence extends verification IP catalog
News & Analysis  
2/28/2011   Post a comment
Cadence Design Systems Inc. announced it has opened and extended its portfolio of verification IP and memory models to support silicon to system development.
UC offers engineering leadership classes
News & Analysis  
2/28/2011   5 comments
The University of California has begun the first session of its so-called ''Engineering Leadership Program for Professionals.''
Japan forms EUV metrology consortium
News & Analysis  
2/28/2011   1 comment
Japan has formed a consortium to propel the infrastructure for photomask and inspection gear in extreme ultraviolet (EUV) lithography.
CUDA 4.0 aims to ease parallel programming
News & Analysis  
2/28/2011   Post a comment
Version 4.0 of Nvidia's CUDA toolkit for developing parallel applications using the company's graphics processors includes new features designed to make parallel programming easier and enable more developers to port their applications to graphics processor units.
Synopsys says IP supports PCIe 3.0
News & Analysis  
2/28/2011   Post a comment
EDA and IP vendor Synopsys its DesignWare IP supports the final version of the PCI Express 3.0 base specification recently released by the PCI Special Interest Group.
Fujitsu signs license deal for ARM IP
News & Analysis  
2/28/2011   Post a comment
Fujitsu Semiconductor will incorporate ARM technology into its platform offerings under the terms of a comprehensive license agreement between the companies.
ISS: ST's Bozotti cheers for European chips
News & Analysis  
2/28/2011   10 comments
Carlo Bozotti, president and chief executive officer of STMicroelectronics, provided a keynote address to the Industry Strategy Symposium (ISS Europe) held here by industry body SEMI, which contained a commitment to European chip making – but only just.
Smart meter reference design targets residential market
Product News  
2/28/2011   4 comments
NURNBERG, Germany: - A smart meter reference design developed by Freescale Semiconductor will form part of aSmart Energy Wall display during Embedded World in Nuremberg, Germany.
The case against Thunderbolt
News & Analysis  
2/28/2011   21 comments
Intel's Thunderbolt is leaving some people feeling burned the chip giant is launching a new interface rather than giving its full attention to an existing one—USB.
IEEE-USA, others challenge patent reform
News & Analysis  
2/28/2011   5 comments
Claiming it disadvantages small and startup companies, the IEEE-USA and other groups have fired off letters opposing a draft patent reform bill the U.S. Senate will debate.
NXP renews MCU partner role with ARM
News & Analysis  
2/28/2011   4 comments
NXP Semiconductors NV and ARM Holdings plc have expanded their strategic relationship around the development of ARM cores and ARM-based microcontrollers.
IMEC installs pre-production EUV litho
News & Analysis  
2/28/2011   5 comments
Belgian research institute IMEC has announced it has installed an NXE:3100 pre-production extreme ultra-violet lithography machine from ASML at its Leuven facility.
Industry mulls 6.7-nm wavelength EUV
News & Analysis  
2/28/2011   3 comments
The industry is now in discussions about the development of EUV, based on a 6.7-nm wavelength technology.
Startup rolls complementary litho
News & Analysis  
2/28/2011   6 comments
At the SPIE Advanced Lithography conference here, maskless startup Multibeam Corp. will outline more details about its ongoing efforts to commercialize its so-called Complementary E-Beam Lithography (CEBL) technology in the market.
Nikon: Five reasons to be bullish
News & Analysis  
2/28/2011   5 comments
At the annual LithoVision event here, an executive from lithography vendor Nikon Corp. outlined the business dynamics in the market.
Update: Nikon tips 193-nm tool, illuminator
News & Analysis  
2/28/2011   2 comments
At the annual LithoVision event here, Japan’s Nikon Corp. tipped its lithography roadmap.
congatec new conga-ca6 COM Express module touts low power consumption, superior graphics for extended temps
Product News  
2/28/2011   Post a comment
The conga-CA6 COM Express module from congatec is based on the new Intel Atom E6xx processor series and the Intel Platform Controller Hub EG20 for COM Express Type 2. All components of this embedded design are specified for the industrial temperature range of -40 to +85°C, making the conga-CA6 an ideal solution for extreme applications.
ST boosts bipolar power transistor current by 50 Percent
Product News  
2/27/2011   Post a comment
The 3STR1630 NPN transistor from STMicroelectronics is the first member in a new family of high-performance bipolar power transistors manufactured using a new low-voltage planar technology. This technology incorporates a double-metal process that allows the cell density to be almost doubled without requiring the use of sophisticated photolithography equipment. In addition to increasing the current capability by about 50 percent for the same die size, the double-metal process enables transistors
Embedded Wi-Fi SoC for the Internet of Things market
Product News  
2/27/2011   Post a comment
The AX220xx family, from ASIX Electronics, is a single-chip MCU with TCP/IP and 802.11 WLAN MAC/baseband.
Microsoft opens Kinect to hackers with Windows SDK planned for spring 2011
News & Analysis  
2/27/2011   4 comments
At Microsoft’s TechForum, the company announced plans to release a non-commercial Kinect for Windows Software Development Kit, or SDK, this spring.
Inertial sensor market to grow 20.3% annually to reach $2.56B in 2015
News & Analysis  
2/27/2011   4 comments
The inertial sensor market for consumer electronics is growing very quickly due to the fast adoption of accelerometers, gyroscopes and magnetometers in mobile phones, tablets, game stations and laptops.
Innovative solution creates SAW-less reconfigurable transceiver
News & Analysis  
2/27/2011   2 comments
At the International Solid-State Circuit Conference (ISSCC2011), imec and Renesas Electronics Corporation presented a highly-linear reconfigurable transceiver, eliminating the need of surface acoustic wave (SAW) filters.
Biomedical signal processor targets wearable biomedical sensor systems
News & Analysis  
2/27/2011   2 comments
imec, Holst Centre and NXP presented a versatile ultra-low power biomedical signal processor, CoolBio, meeting the requirements of future wearable biomedical sensor systems.
NXP expands industrial control series to support energy-efficient controls and appliances
Product News  
2/27/2011   Post a comment
NXP Semiconductors N.V. has unveiled its LPC1200 Industrial Control Series featuring the ARM Cortex-M0 processor, which extends NXP’s 32-bit ARM microcontroller continuum and targets a wide range of industrial applications in the areas of factory and home automation.
Front-end module support for WiLink platform
Product News  
2/27/2011   Post a comment
Manufacturers designing around the WiLink 6.0 and WiLink 7.0 platforms from Texas Instruments can integrate RFMD's RF3482 to gain reliable, flexible WiFi connectivity.
Double-width AdvancedMC processor module
Product News  
2/27/2011   Post a comment
Kontron has announced the double-width AdvancedMC processor module AM5020 equipped with an Intel Core i7 Mobile processor and Intel Hyper-Threading technology.
Closing the gap between MCU and x86
Product News  
2/27/2011   1 comment
At the Embedded World conference and exhibition, MSC will be promoting an ARM-based module concept that targets cost-sensitive embedded applications.
SYSGO's SSV RTOS PikeOS offers Android Personality
Product News  
2/26/2011   Post a comment
SYSGO has announced that its Safe and Secure Virtualization (SSV) product PikeOS now supports the Android operating system as a guest OS, or 'Personality'. PikeOS technology enables Android apps to run concurrently with other executive environments having more real-time, safety and/or security constraints on the same hardware device, and allows strict partitioning between critical and non-critical applications.
Nvidia, Atmel, STMicro found in Motorola Xoom
News & Analysis  
2/26/2011   19 comments
In addition to a dual-core Tegra 2 applications processor from Nvidia, Motorola Mobility's Xoom media tablet includes a four-chip touch screen controller solution from Atmel and MEMS sensors from AKM Semiconductor, Kionx, STMicroelectronics and Bosch Sensortec, according to IHS iSuppli.
Change shuffles PCB EDA vendor rankings
News & Analysis  
2/25/2011   8 comments
Zuken vaulted to the No. 2 position in sales among providers of printed circuit board EDA tools as the result of a clarification of the firm's revenues, according to Gary Smith EDA.
Photo gallery: Eye on innovations at ISSCC
News & Analysis  
2/25/2011   14 comments
We snapped a dozen images of innovators and their innovations at this week's ISSCC, spanning display, processors, analog circuits and communications chips.
Security penetrates the clouds
News & Analysis  
2/25/2011   9 comments
Information technology security provider SafeNet recently adapted its encryption, authentication and virtualization security suites to run on cloud computers.
OmniVision: What analysts are saying
News & Analysis  
2/25/2011   Post a comment
CMOS image sensor vendor OmniVision Technologies Inc. had a strong quarter.
Applied results: What analysts are saying
News & Analysis  
2/25/2011   5 comments
As reported, Applied Materials Inc. posted strong results. Here’s what analysts are saying about the results:
IR to buy CHiL for $75 million
News & Analysis  
2/25/2011   Post a comment
International Rectifier Corp. has agreed to acquire CHiL Semiconductor Corp. (CHiL) for $75 million in cash, subject to working capital adjustments.
Carbon TLM-2.0 for AMBA protocol solution
Product News  
2/25/2011   Post a comment
Carbon Design Systems Inc. has released a solution for AMBA TLM-2.0 modeling that enables virtual mode reuse in any SystemC environment.
Inside Thunderbolt: Videos, photos, details
News & Analysis  
2/25/2011   14 comments
We got a demo of the new Thunderbolt interface, pictures of its controllers and connector and more in-depth details on the technology and business behind it.
Maxim enters digital power market
News & Analysis  
2/24/2011   10 comments
In a major move, Maxim Integrated Products Inc. is entering into the emerging digital power market.
On Semi to expand Oregon fab
News & Analysis  
2/24/2011   8 comments
On Semiconductor Corp. plans to invest more than $30 million to expand capacity and capabilities at its 8-inch wafer manufacturing facility in Gresham, Oregon.
Mentor beats estimates, eyes $1 billion mark
News & Analysis  
2/24/2011   5 comments
EDA vendors Mentor Graphics and Magma Design Automation reported quarterly results that beat consensus analysts' expectations, with Mentor posting record annual revenue and saying it expects to become a $1 billion company in the current fiscal year.
Applied beats Street
News & Analysis  
2/24/2011   Post a comment
Applied Materials Inc. reported sales of $2.69 billion for the first quarter, compared to $2.89 billion in the previous quarter and $1.85 billion a year ago.
CEA-Leti, spinoff form maskless lab
News & Analysis  
2/24/2011   Post a comment
CEA-Leti and a spinoff, Aselta Nanographics, are creating a joint lab to develop e-beam proximity effects correction solutions for both mask writing and maskless lithography applications.
Ten things to know about Intel's Thunderbolt
News & Analysis  
2/24/2011   49 comments
We answer a few of the big questions about Intel's new Thunderbolt interface, but plenty of issues remain in the dark about the technology built into Apple's new MacBooks.
Firm: Kick out Zoran's board
News & Analysis  
2/24/2011   4 comments
Hedge fund Ramius LLC has recommended that shareholders of Zoran Corp. consent on Ramius' proxy move to remove three incumbent directors and elect Ramius nominees to the Zoran board.
Update: Renesas chairman to retire
News & Analysis  
2/24/2011   Post a comment
Junshi Yamaguchi, chairman and representative director of Renesas Electronics Corp., is retiring amid an ongoing reorganization at the Japanese chip maker.
Entegris, IBM form partnership
News & Analysis  
2/24/2011   Post a comment
Entegris Inc. has announced a joint development agreement with IBM to develop and test new filtration techniques for use in advanced semiconductor manufacturing.
JEDEC announces standard for flash storage
News & Analysis  
2/24/2011   3 comments
JEDEC Solid State Technology Association, formerly known as the Joint Electron Devices Engineering Council, has published a standard on the use of flash memory for solid-state storage in mobile devices such as smart phones and tablet computers.
Page 1 / 9   >   >>


Flash Poll
Top Comments of the Week
Like Us on Facebook
EE Times on Twitter
EE Times Twitter Feed

Datasheets.com Parts Search

185 million searchable parts
(please enter a part number or hit search to begin)
EE Life
Frankenstein's Fix, Teardowns, Sideshows, Design Contests, Reader Content & More
Max Maxfield

Want to Present a Paper at ESC Boston 2015?
Max Maxfield
8 comments
I tell you, I need more hours in each day. If I was having any more fun, there would have to be two of me to handle it all. For example, I just heard that I'm going to be both a speaker ...

Martin Rowe

No 2014 Punkin Chunkin, What Will You Do?
Martin Rowe
Post a comment
American Thanksgiving is next week, and while some people watch (American) football all day, the real competition on TV has become Punkin Chunkin. But there will be no Punkin Chunkin on TV ...

Rich Quinnell

Making the Grade in Industrial Design
Rich Quinnell
12 comments
As every developer knows, there are the paper specifications for a product design, and then there are the real requirements. The paper specs are dry, bland, and rigidly numeric, making ...

Martin Rowe

Book Review: Controlling Radiated Emissions by Design
Martin Rowe
1 Comment
Controlling Radiated Emissions by Design, Third Edition, by Michel Mardiguian. Contributions by Donald L. Sweeney and Roger Swanberg. List price: $89.99 (e-book), $119 (hardcover).