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posted in March 2009
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Microchip, Chang headline 2009 ACE Award winners
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3/31/2009   Post a comment
Microcontroller and analog chip vendor Microchip Technology was presented the award for "Company of the Year," one of 11 winners of the 2009 EE Times ACE Awards. Morris Chang, founding chairman of TSMC, was honored with a "Lifetime Achievement Award."
STMicro Mobile App Voltage-Agnostic MEMS-Based Motion Sensor
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3/31/2009   Post a comment
STMicroelectronics MEMS sensors with a 3-axis accelerometer with absolute analog output for data-integrity protection in hard-disk drives, vibration monitoring and compensation, remote control, as well as motion user interfaces in mobile and gaming devices or portable media players.
Vitesse cuts 12% of headcount
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3/31/2009   Post a comment
Vitesse Semiconductor Corp. has implemented a reduction of approximately 12 percent of its worldwide workforce.
FSI cuts jobs, posts loss
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3/31/2009   Post a comment
Amid the downturn and ongoing losses, fab tool maker FSI International Inc. plans to take several cost-cutting measures, including layoffs.
Astronaut invokes 'Apollo spirit' for 'hard days ahead'
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3/31/2009   Post a comment
Kenneth Mattingly recalled the Apollo spirit of cooperation in the rescue of the Apollo 13 mission and encouraged engineers at the Embedded Systems Conference to apply the same determination to the current hard times.
No April Fools: Conficker 2.0 worm set to strike
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3/31/2009   Post a comment
Malware known as Conficker 2.0 is poised to strike on Wednesday, April Fools Day, security experts warn.
Ramtron samples power efficient 512-Kbit, 1-Mbit Serial FRAM
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3/31/2009   Post a comment
Ramtron has launched two more devices in a family of new parallel and serial FRAM products that offer higher-speed read/write performance, lower voltage operation, and optional device features.
SiTime enters VCXO market with MEMS-based device
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3/31/2009   Post a comment
SiTime's voltage controlled MEMS oscillator features 0.5% pull range linearity, small size and flexibility through programmability.
GaAs MMIC SP8T switch streamlines mobile phone design
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3/31/2009   Post a comment
NEC's UPG2193T6E SP8T GaAs MMIC antenna switch meets the needs of new 3G UMTS, W-CDMA and Quad Band EDGE mobile phone designs.
New MEMS timing chip emerges
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3/31/2009   Post a comment
A maker of MEMS timing chips is taking aim at a new market: voltage-controlled oscillators.
Freescale rolls 45-nm comms processors
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3/31/2009   Post a comment
Freescale Semiconductor said it is sampling new communications processors based on its 45-nm process technology,
All-in-one audio subsystems target mobile phones and gaming
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3/31/2009   Post a comment
National Semiconductor has made two additions to its Boomer Class D audio subsystem family that are suited to smart phone, portable gaming device and portable GPS device designs.
Longer Music Playback with TI Low Power Class-G Headphone Amplifier
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3/31/2009   Post a comment
Two new 25-mW Class-G stereo headphone amplifiers from Texas Instruments were released using DirectPath technology allowing for the length of music playback to be increased by 20 percent.
Wi-Fi sensor networking module has 5-year battery life
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3/31/2009   Post a comment
RF Monolithics' 2.4 GHz IEEE 802.11 g radio transceiver module enables OEMs to build low-power WLAN and sensor monitoring solutions for the global market.
National Semiconductor extends family of low-power, audio subsystems for handheld devices
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3/31/2009   Post a comment
National Semiconductor Corp., has extended its family of low-power Boomer Class D audio subsystems with two devices that simplify portable product design.
Metrology specialist Semilab acquires AMS, QC Solutions
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3/31/2009   Post a comment
Semilab Co. Ltd. (Budapest, Hungary) has acquired two Massachusetts-based metrology companies, Advanced Metrology Systems and QC Solutions.
IC market: Recovery or head fake?
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3/31/2009   Post a comment
It's way too early to see a real recovery in ICs.
Three-phase, transformerless UPS system aims to score on cost and energy efficiency
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3/31/2009   Post a comment
Uninterruptible Power Supplies Ltd (UPSL) plans to unveil the company's latest three-phase, transformerless UPS system at a power protection seminar being held on 28 April at Chelsea Football Club.
Samplify moves SAM1600 ADC family to production
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3/31/2009   Post a comment
Samplify Systems Inc. (Santa Clara, Calif.), a vendor of data converters, has announced what it claims is the lowest-power, highest channel-count 12-bit ADC.
PowerWise audio subsystems simplify portable product design
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3/31/2009   Post a comment
National Semiconductor has expanded its line of low-power Boomer Class D audio subsystems with two devices—the LM49352 mixed-signal audio subsystem and LM49151 analog subsystem—aimed at simplifying portable product design.
Multiprocessor debug startup raises seed funding
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3/31/2009   Post a comment
Ultrasoc Technologies Ltd. has raised £400,000 (about $575,000) of equity investment from the South East Seed Fund, managed by Finance South East, and the Iceni Seedcorn Fund.
TSMC qualifies 0.18-micron embedded flash process family
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3/31/2009   Post a comment
Taiwan Semiconductor Manufacturing Co. Ltd. has said it has qualified a 0.18-micron embedded flash memory (embFlash) process technology family intended for applications in automotive, analog and power-sensitive applications.
Three-axis MEMS motion sensor has absolute analog output
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3/31/2009   Post a comment
Designed with space and cost-constrained battery-operated devices in mind, STMicroelectronics' LIS352AX 3-axis accelerometer operates at any supply voltage within the 2.16V to 3.6V range and is said to be extremely stable over temperature and time.
Premo : High storage chokes are 99 percent efficient
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3/31/2009   Post a comment
Premo has developed a series of high energy storage chokes for use in power conversion applications such as dc/ac and ac/dc converters.
Globalfoundries promises stability for Dresden location
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3/31/2009   Post a comment
Globalfoundries has promised to continue its commitment for its Dresden manufacturing location as well as for the existing R&D network in that region. In a presentation for the press, Globalfoundries CEO Doug Grose rolled out a roadmap for the company's planned activities.
High output differential amplifier suits audio and instrumentation applications
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3/31/2009   Post a comment
Claiming a 10MHz, 10V/us, rail-to-rail I/O performance, austriamicrosystems has designed its AS1713 device with audio applications such as headphone drivers and audio line receivers and buffers in mind.
NXP bond-swap reduces debt by $465 million
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3/31/2009   Post a comment
Dutch chip vendor NXP BV has completed a debt swap under which it will retire secured and unsecured debt for higher yielding, shorter-term, higher priority bonds. As a result NXP has reduced its debt by about $465 million and its annual interest burden by $30 million, the company said.
SiliconBlue rolls evaluation kit, peripheral daughter modules
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3/31/2009   Post a comment
Startup SRAM FPGA vendor SiliconBlue Technologies announced the immediate availability of iCEman65, an evaluation and development kit for low-power designs based on the company's iCE65 FPGA, as well as two peripheral daughter modules.
Sentilla Joins The U.S. Green Building Council
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3/31/2009   Post a comment
Sentilla's energy management solutions to support U.S. Green Building Council's vision for sustainable building in America.
Video: Cisco shows server at Xeon launch
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3/31/2009   Post a comment
Big data centers are preparing for a shift to 10 Gbit/s Ethernet and some are interested in GPU processing once standards emerge, said a panel of data center managers who are testing Intel's just announced Xeon 5500 processors.
Energy Star pioneer nominated to DoE post
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3/30/2009   Post a comment
One of the pioneers of the U.S. Energy Star program has been nominated by President Barack Obama to be assistant secretary for energy efficiency and renewable energy.
Albany NanoTech Complex expanded
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3/30/2009   Post a comment
A $150 million expansion at the College of Nanoscale Science and Engineering's Albany NanoTech Complex will create $1 billion in new investments and 600 high-tech jobs by 2013, according to a statement released by New York Assembly Speaker Sheldon Silver.
Intel-ST memory venture: A flash in the pan?
News & Analysis  
3/30/2009   1 comment
A year after its official inception, Numonyx Inc. continues to move full speed ahead with its charter despite the current memory downturn and chaos in the supply chain.
Guest blog: Mike Santarini
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3/30/2009   3 comments
Mike Santarini, a former editor at EE Times and EDN (now publisher of Xilinx user magazine Xcell Journal) makes his first guest blog entry for Programmable Logic DesignLine, warning EDA vendors to get serious about the FPGA business.
KLA-Tencor to cut workforce again by 10%
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3/30/2009   Post a comment
Fab gear vendor KLA-Tencor will reduce its global workforce by about 10 percent as part of a series of cost-saving measures, the company said.
Intel rolls 45-nm server CPUs
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3/30/2009   Post a comment
Intel Corp. formally rolls out server versions of its 45-nm Nehalem processors, the Xeon 5500 chips that integrate memory controllers and a high-speed interconnect, taking a page from archrival Advanced Micro Devices which pioneered the approach in x86 chips.
Altera, National Semi working on digital video for automotive apps
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3/30/2009   Post a comment
Altera will collaborate with National Semiconductor to develop graphics interconnect solutions to address the growing use of digital video in automotive infotainment and driver-assistance applications, the companies said.
QuickLogic platforms to incorporate MDDI interface
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3/30/2009   Post a comment
QuickLogic said it is developing new platforms tailored for Qualcomm's latest Mobile Station Modem MSM7xxx-series and MSM8xxx-series mobile processors, including Qualcomm's Snapdragon family of mobile computing processors.
QuickLogic platforms to incorporate Qualcomm's MDDI interface
Product News  
3/30/2009   Post a comment
QuickLogic said it is developing new platforms tailored for Qualcomm's latest Mobile Station Modem MSM7xxx-series and MSM8xxx-series mobile processors, including Qualcomm's Snapdragon family of mobile computing processors.
Microchip : 16-bit DSCs target power conversion applications
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3/30/2009   Post a comment
Microchip announces seven next-generation 16-bit dsPIC digital signal controllers (DSCs) for common, multi-drop switch mode power supplies (SMPSs) and other power conversion applications.
Integrated step-down LED drivers support high power, high brightness LEDs
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3/30/2009   Post a comment
Exar Corporation has released two LED drivers capable of driving high power, high brightness LEDs up to 0.5 Amp and 1 Amp respectively.
Chip market free-fall stablized in February, says analyst
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3/30/2009   Post a comment
The three-month moving average of global chip sales is expected to come in at $14.2 billion, down from the $15.1 billion achieved in January, according to Carnegie Group. This would down by 30 percent year-on-year and similar to the 30 percent fall shown in January.
Maxon : Inductive encoder is based on eddy currents
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3/30/2009   Post a comment
Small, robust and accurate, Maxon Motor’s MILE inductive micro encoder is secure against the effects of EMC, dust or oil.
Applied, Disco to devise TSV processes
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3/30/2009   Post a comment
Expanding its efforts in 3-D chips, Applied Materials Inc. has formed a joint effort with Disco Corp. to develop wafer thinning processes for fabricating through-silicon vias (TSVs).
Asia-Pacific chip market to fall 23%
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3/30/2009   Post a comment
Market research firm Gartner Inc. has lowered its forecast for the Asia-Pacific chip market.
Microchip DSCs take digital power control mainstream
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3/30/2009   Post a comment
Emphasizing low cost, small size, low power and flexibility, Microchip's GS Series digital signal controllers is its effort to increase its share of a digital power market that it believes is going mainstream and will grow at a compound annual rate of 40 percent.
QLogic converges nets in ASIC
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3/30/2009   Post a comment
The move to merged data center networks takes a step forward as QLogic Corp. formally announces new chips and cards designed for the Fibre Channel over Ethernet standard with rivals Emulex and Intel Corp. expected to announce competing products soon.
ST-Ericsson samples music DAC for mobiles
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3/30/2009   Post a comment
Mobile phone chip joint venture ST-Ericsson NV has announced that it is sampling an audio quality digital-to-analog converter (DAC) for use in the mobile music market.
ST-Ericsson releases next-generation mobile audio chip
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3/30/2009   Post a comment
ST-Ericsson has launched a high-quality audio digital-to-analog converter (DAC) for the mobile music market that improves handset battery life performance.
Merck agrees to fund Israeli nanoparticle display research
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3/30/2009   Post a comment
Hewbrew University of Jerusalem has agreed an R&D collaboration between Merck and QLight Nanotech Ltd., for the joint development of semiconductor nanoparticle technology for displays.
Page 1 / 17   >   >>


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