RF module operates in 868-MHz ISM band Product News 4/30/2007 Post a comment One RF Technology has introduced a low-cost, 868-MHz RF module dubbed TinyOne Lite that is optimized for low-power radio communication at a competitive cost and available with or without an integrated antenna.
PMICs enable smaller design of DC/DC converters, LDOs Product News 4/30/2007 Post a comment Maxim Integrated Products introduced the MAX8667/MAX8668, a 4-channel power-management ICs (PMICs) in a 9 mm2 TQFN package. These PMICs minimize total design size by integrating two step-down DC/DC converters and two low-input, low-dropout regulators (LDOs), as well as all feedback networks.
Micro fuel cells to hit mainstream in 2010 News & Analysis 4/30/2007 Post a comment Despite a flurry of announcements and investments in micro fuel cells for portable devices, the technology is not expected to become a mainstream product until 2010 or so, according to an expert in the arena.
Compact MEMS flow sensors detect clogged filters, protect equipment Product News 4/30/2007 Post a comment Omron Electronic Components developed the D6F-W and D6F-V series of MEMS flow sensors, which have the ability to measure air velocity and volume. The D6F-W01A1 measures a flow range of 0 to 1 m/s and the D6F-W04A1 a range of 0 to 4 m/s. Both exhibit a ±5% full-scale repeatable accuracy, while the D6F-V measures a flow range of 0 to 3 m/s with a ±10% full-scale repeatable accuracy.
MP3 chip market sees new landscape Product News 4/30/2007 Post a comment Despite the growth of MP3 player sales, the market for controller chips for these products is seeing intense price erosion as new competitors enter the fray, according to iSuppli Corp.
ST selects Obducat nano-imprint litho for R&D News & Analysis 4/30/2007 Post a comment STMicroelectronics has placed an order for a nano-imprint lithography (NIL) R&D system from Obducat AB to be used in a post-silicon R&D unit for development purposes. Obducat has also produced stampers that are being used in this assessment project.
Qimonda's Loh banking on DRAM market comeback News & Analysis 4/30/2007 Post a comment One year into his tenure as CEO of the world's third largest DRAM maker, Qimonda's Kin Wah Loh is out to prove that his company can be nimble and aggressive rather than a problematic memory division of its parent company, Infineon Technologies AG.
Under the Hood: Inside Microsoft's Xbox 360 Elite Teardown 4/30/2007 Post a comment In the wake of its Sony Playstation 3 and Nintendo Wii video teardowns, Semiconductor Insights kept the cameras rolling as it took apart the new Xbox 360 Elite to see just how Microsoft plans to stay competitive in the hotly contested, three-way gaming platform market.
Micro fuel cells to hit mainstream in 2010 Product News 4/30/2007 Post a comment Despite a flurry of announcements and investments in micro fuel cells for portable devices, the technology is not expected to become a mainstream product until 2010 or so, according to an expert in the arena.
K&S posts loss, sales drop News & Analysis 4/30/2007 Post a comment Chip-equipment provider Kulicke & Soffa Industries Inc. (K&S) said net revenue from continuing operations for the second quarter was $142.7 million, compared to $152.3 million for the previous quarter and $160.3 million for the comparable year-ago quarter.
Line blurs between phones, PCs News & Analysis 4/30/2007 1 comment
Mainstream notebook PCs and mobile phones are worlds apart when it comes to cost, size and design metrics. But trends revealed in recent teardowns on ultramobile PCs from Sony, Samsung and Tablet- Kiosk show the chasm is closing when UMPCs are compared with a recent ultrahigh-segment smart phone from HTC.
Networks: Ethernet card challenges Infiniband News & Analysis 4/30/2007 Post a comment
NetEffect Inc. (Austin, Texas) claims that its dual-port 10-Gbit/second Ethernet card closes in on the throughput, latency and cost of Infiniband, currently the performance leader in data center networking. The NE020 card implements the iWarp standard, defined more than five years ago to create a high-performance version of Ethernet using the techniques baked into Infiniband.
Samsung uses direct metal links in DRAM stack News & Analysis 4/30/2007 Post a comment
Samsung Electronics scored a win last week in what is shaping up to be an industrywide effort to accelerate the development of direct metal connections between chips. Samsung completed the task in an all-DRAM stacked package--the first of its kind, according to the company.
A path around patent ambushes News & Analysis 4/30/2007 Post a comment The rules for licensing the patents essential for standards are hard to understand, even for experts. Participants in standards bodies, whether or not ANSI-accredited, have claimed that their duty to disclose essential intellectual-property rights (IPR) is unclear and that the obligation to license IP on "fair, reasonable and nondiscriminatory" (FR&ND) terms has no legal content.
Japan rolls Li-ion battery safety plan News & Analysis 4/30/2007 Post a comment Tales of burning notebook PCs that hit the news last summer raised serious concerns among consumers about the safety of lithium-ion batteries. Responding to those fears, Japan's battery and PC industries have jointly hammered out guidelines for the safe use of Li-ion batteries. The industries' task force has also presented its proposal to the International Electrotechnical Commission (IEC).
MEMS exec sees billion-dollar markets News & Analysis 4/30/2007 Post a comment
Microelectromechanical systems (MEMS) are poised to leverage the economies of scale that have driven the semiconductor industry, enabling a bright future of new devices with lower cost, superior performance and increasingly diminutive size. So says MEMS expert Kaigham (Ken) Gabriel, the co-founder of Akustica Inc. (Pittsburgh) and a veteran MEMS developer.
Standards not quite a 'hot topic' in Beltway News & Analysis 4/30/2007 Post a comment
The word "innovation" is on the lips of nearly every politician and half the lobbyists in Washington. But when it comes to the technical standards that form the underpinnings of U.S. innovation, the subject is "a real killer at a cocktail party," said Don Deutsch, vice president for standards strategy and architecture at Oracle Corp.
BenQ refocuses on ODM business to survive News & Analysis 4/30/2007 Post a comment BenQ Corp. pulled a U-turn last week, opting to spin off its branded business instead of its manufacturing division in an effort to find firm footing after a disastrous attempt to become a household name.
DFM: just what doctor ordered News & Analysis 4/30/2007 Post a comment As design-for-manufacturing and design-for-yield take on critical importance at the 65-nanometer node, discussions proceed apace about how best to handle them. At the recent Design Automation and Test in Europe conference here, experts from chip, EDA and foundry companies used a medical metaphor to frame the debate, asking whether it's better to be "surgeons" who deal with DFM and DFY issues at tapeout or "family doctors" who, with an eye toward prevention, minister to the design starting at the
Promise, peril in going green News & Analysis 4/30/2007 Post a comment
Don't worry, this is not another commentary about climate change, although I do know that simulations can be very sensitive to assumptions in their underlying models and to errors in the input data. (As physics Nobel laureate Niels Bohr said, "Prediction is very difficult, especially if it's about the future.") My concern is about the R&D structure that will arise as society attempts to reduce the possibility of global warning through new and improved energy sources, greater efficiency and
Pushing for 'another record year' News & Analysis 4/30/2007 Post a comment
Despite a seasonal slowdown in the overall semiconductor industry, Microchip Technology Inc. last week smashed Wall Street's estimates for its fourth fiscal-2007 quarter and broke the $1 billion plateau in annual sales for the fiscal year.