MIT agrees to tech school at Russia's Skolkovo News & Analysis 7/29/2011 4 comments Earlier this month the Massachusetts Institute of Technology and the Skolkovo Foundation signed a preliminary agreement to create the Skolkovo Institute of Science and Technology (SIST) in Skolkovo, Russia.
FDA defends 510(k) as debate begins News & Analysis 7/29/2011 5 comments Launching a public debate, U.S. regulators were quick to reject the conclusion of a report saying it should scrap its most widely used process for approving medical devices.
iRobot's CEO is bullish on future of robotics News & Analysis 7/29/2011 10 comments iRobot's founding mission is to provide intelligent robots for practical applications, including machines that can conduct dangerous search, reconnaissance and bomb-disposal missions, keeping humans out of harm’s way.
Report: FDA should scrap 510(k) process News & Analysis 7/29/2011 2 comments Industry groups are blasting a report from the Institute of Medicine that calls for scrapping the current regulatory process used by the vast majority of medical devices.
NXP grew again in Q2; may decline in Q3 News & Analysis 7/29/2011 4 comments NXP Semiconductors reported a sequential increase in product revenue for the ninth consecutive quarter, but said the streak could come to an end in the third quarter because of a pause in demand from automotive customers, slower-than-expected deployment of near field communications technology and global macroeconomic weakness.
Trident signs IP license deal amid Q2 loss News & Analysis 7/28/2011 Post a comment Trident Microsystems announced it reached an agreement to license some of its video processing technology and reported a narrower second quarter loss on sales that fell short of consensus analysts' expectations.
Small-sized display shipments down except in tablets News & Analysis 7/28/2011 4 comments Shipments of small- and medium-sized display panels fell for the second straight month in May, another data point from market research firm IHS iSuppli pointing to tablets taking over where once cell phones and other consumer devices prevailed.
Tablets, smartphones hit sales of CE devices News & Analysis 7/28/2011 7 comments As sales of multi-function electronics devices like tablets and smartphones rise, sales of single-task products like MP3 players and digital still cameras are projected to decline or stay flat, according to IHS iSuppli.
TSMC forecasts falling sales in Q3 News & Analysis 7/28/2011 Post a comment Foundry Taiwan Semiconductor Manufacturing Co. Ltd. has announced that its net income fell in the second quarter and has forecast its revenue will decline by about 7 percent in the third quarter.
Infineon profits as car woes no-show News & Analysis 7/28/2011 Post a comment Expected problems in the automotive supply chain failed to materialize for Infineon Technologies AG in the second quarter and helped the German chip maker turn in higher than expected sales and profits.
VIA launches dual core VB8004 Mini-ITX Mainboard Product News 7/27/2011 Post a comment VIA Technologies, Inc has announced a dual core version of the low power VIA VB8004 Mini-ITX board. Coupling the 1.6GHz VIA Nano X2 E-series processor with the VIA VX900 media system processor, the VIA VB8004 provides a high performance and highly scalable solution for advanced digital signage and gaming systems.
Lam sees steep decline in tool spending News & Analysis 7/27/2011 Post a comment Lam Research reported quarterly results that beat analysts' expectations but warned of a significant decline equipment spending that would cause its revenue to contract in the current quarter.
ST-Ericsson to close R&D sites News & Analysis 7/27/2011 12 comments Mobile chip company ST-Ericsson is set to close R&D sites as part of the latest round of restructuring, according to CEO Gilles Delfassy. A site in Basingstoke, England, has already been earmarked for closure with a loss of up to 139 jobs, according to a local report.
TI touts 3-D packaging technology News & Analysis 7/27/2011 9 comments Texas Instruments said it has shipped more than 30 million power management devices featuring its PowerStack 3-D packaging technology, which the company says offers performance, thermal, power consumption and board space advantages compared with conventional packaging technologies.
Israel offers Intel $290 million to expand News & Analysis 7/27/2011 11 comments The Israeli government is offering semiconductor giant Intel up to 1 billion shekels (about $290 million) to expand its manufacturing operations in the country, according to local reports.
DRAM price declines suggest tough second half News & Analysis 7/27/2011 5 comments The contract price of 2-GB DRAM modules has decreased nearly 16 percent in July compared with June, a warning sign that the DRAM market outlook for the second half of 2011 could be bleak, according to DRAMeXchange.
STMicroelectronics collaborates with Soundchip to bring HD-PA to market News & Analysis 7/27/2011 Post a comment STMicroelectronics is to collaborate with Soundchip SA, a Swiss-based electro-acoustics consultancy and originator of the High Definition Personal Audio (HD-PA) Standard, to bring HD-PA to market by applying their respective strengths in audio system and semiconductor technology, product design and industrialization methods, audio software and sales and marketing.
Ultra-low power DAC delivers crystal-clear audio Product News 7/27/2011 Post a comment Wolfson Microelectronics plc has unveiled the company's latest high performance ultra-low power stereo digital-to-analog converter (DAC) which delivers superior audio to portable applications including mobile phones, tablet PCs, wireless headsets, multimedia players and handheld gaming devices.
Audio SoC gives access to DSP cores Product News 7/26/2011 Post a comment Wolfson Microelectronics has announced a single-chip audio processor that could, potentially, replace up to five of its discrete ICs in mobile devices, including mobile phones, tablet PCs and other handheld media devices.
VoIP SLIC promises smaller BoM Product News 7/26/2011 Post a comment Silicon Laboratories is claiming the title of industry's most integrated, cost-effective and power-efficient subscriber line interface circuit (SLIC) solution for voice-over-IP (VoIP) gateways, with its new Si3226x Dual ProSLIC family.
What are the engineering and design challenges in creating successful IoT devices? These devices are usually small, resource-constrained electronics designed to sense, collect, send, and/or interpret data. Some of the devices need to be smart enough to act upon data in real time, 24/7. Are the design challenges the same as with embedded systems, but with a little developer- and IT-skills added in? What do engineers need to know? Rick Merritt talks with two experts about the tools and best options for designing IoT devices in 2016. Specifically the guests will discuss sensors, security, and lessons from IoT deployments.