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posted in August 2012
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Slideshow: Remembering Neil Armstrong & Apollo
News & Analysis  
8/31/2012   12 comments
We remember Neil Armstrong and all the other engineers, technicians and astronauts who all helped send humans to the moon.
Memscap partners with Chinese MEMS startup
News & Analysis  
8/31/2012   3 comments
MEMS component maker Memscap has formed a partnership with Hanking Group to expand sales of the MUMPS multiproject wafer service in China.
HSA recruits Arteris, Sonics
News & Analysis  
8/31/2012   6 comments
The Heterogeneous Systems Architecture Foundation, a group formed to advance technology standards for multicore processing, has recruited six additional member companies, including two suppliers of network-on-chip intellectual property to its ranks; Arteris and Sonics.
'Nano machine shop' research shapes nanowires
News & Analysis  
8/31/2012   Post a comment
Researchers have come up with a future manufacturing method for tiny structures with potentially revolutionary properties.
CST offers EMC and SI tool for PCBs
Product News  
8/31/2012   Post a comment
Computer Simulation Technology launched CST BOARDCHECK for design engineers dealing with electromagnetic compatibility and signal integrity of PCBs to get a quick overview of potential problems in their layout.
Tokyo court hands Samsung a win over Apple
News & Analysis  
8/31/2012   13 comments
A Tokyo court has found Samsung not guilty of infringing Apple's intellectual property, in contrast to a jury decision and a $1.05 billion damage award in Apple's favor in a California court last week.
Digital Core Design updates on chip debug
Product News  
8/30/2012   2 comments
In a modern system-on-chip, traditional measurement instrumentation does not have access to all of the pins necessary to provide good visibility and debug…
Xilinx to demo broadcast innovation and differentiation at IBC 2012
Product News  
8/30/2012   Post a comment
Broadcast engineers are faced with the challenges of providing cost-effective, high performance video, audio, and network systems.
Avnet Wi-Fi dev kit designed to attach to FPGA dev boards
Product News  
8/30/2012   5 comments
Avnet Electronics Marketing Americas Introduces the CC3000-Pmod Compatible Wi-Fi Adapter Kit.
Formosa Plastics bails out DRAM subsidiaries
News & Analysis  
8/30/2012   2 comments
Formosa Plastics Group, parent of Nanya Technology Corp., has put together a bail-out plan worth about $1 billion to keep the loss-making DRAM maker from delisting from the Taiwan stock exchange, according to local reports.
Intel energizes wireless charging effort
News & Analysis  
8/30/2012   9 comments
Intel has selected mixed-signal fabless chip company Integrated Device Technology to make transmitter and receiver ICs to implement Intel's resonant wireless energy transfer technology.
Slideshow: Novel server CPUs glow at Hot Chips
News & Analysis  
8/30/2012   8 comments
In the next five years, ARM-based SoCs will grab about ten percent of the server market, according to a straw poll at Hot Chips where new Power and Sparc chips also debuted.
Foreman defends Apple vs. Samsung verdict in video
News & Analysis  
8/29/2012   9 comments
In a video interview, Velvin Hogan, the foreman in the closely watched patent infringement cases between Apple and Samsung, defended and provided more context on the jury's decision.
Renesas president won't quit, lays out priorities
News & Analysis  
8/29/2012   33 comments
Hours after a U.S. private equity firm launched a takeover bid, Renasas President Yasushi Akao (shown) told EE Times he's staying.
AlcaLu CTO calls for new basestation chips
News & Analysis  
8/29/2012   2 comments
Wireless networks need chips designed for a new class of small-cell basestations said Marcus Weldon (pictured) in a Hot Chips keynote.
Linear Techology The LT4275A (LTPoE++), LT4275B (PoE+) and LT4275C (PoE) power device interface controllers.
Product News  
8/29/2012   Post a comment
Linear Technology is offering power device interface controllers that support up to 90W and all three power-over-Ethernet standards: LTPoE++, PoE+ and PoE.
Silicon Labs unveils MCU plus temperature sensing
Product News  
8/29/2012   1 comment
The C8051F39x/7x MCU family from Silicon Labs combines a high-performance 8-bit MCU with an integrated temperature sensor featuring best-in-class accuracy over an extended temperature range—without calibration.
Remote nuclear/industrial monitoring averts devastating accidents
Product News  
8/29/2012   Post a comment
MOHR’s EFP Series guided UWB radar liquid level instrumentation family has three new members.
Industrial laser systems get bump in power handling
Product News  
8/29/2012   Post a comment
The FD-80 high power keyed connector by Fiberguide Industries delivers power handling up to 750 watts.
Maxim 40GBASE-LR4 QSFP+ chipset comprises the MAX3948 DC-coupled laser driver and the DS4830 optical microcontroller
Product News  
8/29/2012   Post a comment
Maxim Integrated Products' 4-channel QSFP+ transmitter supplies 4x the bandwidth, at less power, and in only 1.5x the area of a single-channel solution.
Silicon Laboratories C8051F39x/7x 8-bit MCUs
Product News  
8/29/2012   Post a comment
Silicon Labs has rolled out an 8-bit MCU line that integrates a temperature sensor, as well as several other analog peripherals, helping to reduce BOM costs in communication and industrial systems.
ams AS3661 smart LED driver
Product News  
8/29/2012   Post a comment
Smartlight driver from ams integrates control of three separate banks of ‘smart’ indicator LEDs.
Near-field counters aid in device frequency ID
Product News  
8/29/2012   Post a comment
Two units key in on wireless transmissions as near-field frequency counters - one as a handheld device and the other in a self-contained case to address multiple wireless devices.
Agilent releases fully integrated PCI Express 3.0 software for receiver test
Product News  
8/29/2012   Post a comment
Agilent Technologies Inc. reports that it has released the industry’s first fully integrated PCI Express (PCIe) 3.0 receiver test calibration and transmitter test software.
New low power TWELP vocoder delivers crystal clear voice performance
Product News  
8/29/2012   Post a comment
CML Microcircuits has expanded the company’s DuraTALK digital voice processor range with the release of a new professional radio low bit-rate 2.4 kbps vocoder.
Microchip MCP47A1 D/A converter
Product News  
8/29/2012   Post a comment
This low-power, low-cost 6-bit volatile D/A converter with command code features a 1.8-5.5V wide operating voltage range and I2C/SMBus compatibility.
Qualcomm, Broadcom settle with Dutch IP house
News & Analysis  
8/29/2012   2 comments
Dutch IP licensor Semiconductor Ideas to Market BV has reached a settlement with several chip companies, including Qualcomm and Broadcom, in a deal reportedly worth several million dollars.
Verizon pre-certifies Altair LTE chip
News & Analysis  
8/29/2012   2 comments
Verizon Wireless pre-certified Altair Semiconductor’s FourGee 3100/6200 LTE chipset, representing the first time that Verizon certified an LTE chip vs. a device.
Handheld ADSL2+ tester compliant with DSLAMs
Product News  
8/29/2012   1 comment
GAO Instruments is offering its pocket sized handheld ADSL2+ tester that is designed for ADSL, ADSL2, ADSL2+ and Re-ADSL testing. It is well suited for ADSL/ADSL2+ network installation, maintenance, and fault elimination.
AMD appoints ecosystem expert to its board
News & Analysis  
8/29/2012   3 comments
Jack Harding (shown), CEO of design and manufacturing services provider eSilicon, has been appointed to the board of directors of AMD.
Report: TSMC rebuffs Apple, Qualcomm
News & Analysis  
8/29/2012   31 comments
Apple and Qualcomm have each offered more than a $1 billion to foundry Taiwan Semiconductor Manufacturing Co. to obtain a dedicated supply of processor chips, and both their offers have been rejected, according to a Bloomberg report.
Top 10 chip vendors hurt by weak Q2
News & Analysis  
8/29/2012   5 comments
Six of the world's top 10 semiconductor suppliers booked chip sales in the second quarter that were lower than the second quarter of 2011, with overall chip sales declining 3 percent year-over-year, according to market research firm IHS iSuppli.
AMD reports progress in cores, SoCs, APIs
News & Analysis  
8/29/2012   2 comments
The Heterogeneous Systems Architecture group could finish “within months” the first draft of a new API, said Mark Papermaster (pictured), AMD's CTO in an interview at Hot Chips.
Smartphones projected to be majority of handsets shipped in 2013
News & Analysis  
8/29/2012   4 comments
Smartphones are now expected to account for the majority of cellular handset shipments for the first time in 2013, two years earlier than previously predicted, according to market research firm IHS iSuppli.
Western Digital back on top of hard disk drive heap
News & Analysis  
8/28/2012   3 comments
Western Digital regained the top spot among hard disk drive suppliers in the second quarter, six months after falling behind rival Seagate Technology in the wake of flooding in Thailand that forced several facility closures, according to market research firm IHS iSuppli.
AMD lands high-performance computing guru
News & Analysis  
8/28/2012   2 comments
AMD named John Gustafson, formerly of rival Intel's eXtreme Technologies Lab, to the role of senior Fellow and chief product architect for AMD's graphics chip business unit.
KKR said to target Renesas with $1.27 billion bid
News & Analysis  
8/28/2012   6 comments
Renesas has a market capitalization of about 95 billion yen. KKR’s plan is to lead the chipmaker's turnaround efforts by taking over a majority stake by year's end.
Intel gives peek inside Xeon Phi at Hot Chips
News & Analysis  
8/28/2012   4 comments
Xeon Phi aka Knights Corner packs more than 50 quad-threaded Pentium-class cores with 512-bit vector units and 25 Mbytes cache around a 512-bit, three-ring interconnect.
OpenCL for FPGAs previewed via Altera's early access program
Product News  
8/28/2012   Post a comment
Customers receive a first look at how OpenCL can simplify FPGA development and increase productivity.
Xilinx acquires embedded Linux provider PetaLogix
Product News  
8/28/2012   Post a comment
The acquisition of the original developer of embedded Linux solutions for Xilinx FPGAs further strengthens Xilinx's All Programmable solutions for SoC designs.
Promo pricing for new Lattice iCEblink40 eval kits
Product News  
8/28/2012   1 comment
New iCEblink40 evaluation kits from Lattice Semiconductor accelerate application development for the low-cost, low-power iCE40 mobileFPGA family.
Week in automotive electronics (Aug. 27, 2012)
News & Analysis  
8/28/2012   Post a comment
Big shakeup at Navistar; vehicle-to-vehicle technology gets tested; STMicroelectronics in China venture; touch-sensing how-to
Making every TV 'smart'
News & Analysis  
8/28/2012   8 comments
Hillcrest Labs announced a downsized version of its motion processing algorithms that can run on an 8-bit microcontroller inside a television remote control, offering the potential to make any TV a "smart" TV.
FLIR speeds thermal imaging FPGA development
Product News  
8/28/2012   Post a comment
Automatic HDL generation from MATLAB reduces concept to field-testable prototype development time by 60%.
Xilinx buys embedded Linux tool vendor PetaLogix
News & Analysis  
8/28/2012   Post a comment
Programmable logic provider Xilinx announced it acquired embedded Linux solutions provider PetaLogix. Terms of the deal were not disclosed.
AMD's Jaguar packs four cores in one for mobile
News & Analysis  
8/28/2012   9 comments
AMD’s Jaguar puts four x86 cores into one unit with a large shared L2 cache to compete with Intel’s Core and Atom chips in notebooks, tablets and embedded systems.
TSMC joins multibeam mask-writing club
News & Analysis  
8/28/2012   2 comments
Leading foundry chip maker TSMC has joined a multibeam mask writer development consortium hosted by Austria's IMS Nanofabrication. TSMC joins founder members Dai Nippon Printing, Intel, and Photronics.
Jury foreman in Apple vs. Samsung had 'light bulb moment'
News & Analysis  
8/28/2012   136 comments
Velvin Hogan (shown), the jury foreman in the Apple-Samsung patent infringement case, used his experience as a patent holder and engineer to sort out the many claims made by the companies.
STATS ChipPAC qualifies TSV process
News & Analysis  
8/28/2012   Post a comment
Singaporean chip packaging and test company STATS ChipPAC Ltd. has announced it has "qualified" 300-mm mid- and back-end manufacturing using a through-silicon-via (TSV) process allowing it to increase its 2.5- and 3-D packaging integration.
ST forms joint venture with Chinese car maker
News & Analysis  
8/28/2012   6 comments
STMicroelectronics and Chinese automobile maker FAW Group Corp. have formed a joint laboratory to develop automotive electronic components.
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Rishabh N. Mahajani, High School Senior and Future Engineer

Future Engineers: Don’t 'Trip Up' on Your College Road Trip
Rishabh N. Mahajani, High School Senior and Future Engineer
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A future engineer shares his impressions of a recent tour of top schools and offers advice on making the most of the time-honored tradition of the college road trip.

Max Maxfield

Juggling a Cornucopia of Projects
Max Maxfield
16 comments
I feel like I'm juggling a lot of hobby projects at the moment. The problem is that I can't juggle. Actually, that's not strictly true -- I can juggle ten fine china dinner plates, but ...

Larry Desjardin

Engineers Should Study Finance: 5 Reasons Why
Larry Desjardin
37 comments
I'm a big proponent of engineers learning financial basics. Why? Because engineers are making decisions all the time, in multiple ways. Having a good financial understanding guides these ...

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July Cartoon Caption Contest: Let's Talk Some Trash
Karen Field
140 comments
Steve Jobs allegedly got his start by dumpster diving with the Computer Club at Homestead High in the early 1970s.

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