Allied with Intel, CEA-Leti Shoots for Moon News & Analysis 9/27/2016 1 comment CEA-Leti's CEA calls the new five-year research contract with Intel a "moonshot." Included in the research framework is for the French institute to provide technologies that enable the next-generation communicationo for Internet of Things.
Baidu Releases AI Benchmark News & Analysis 9/26/2016 1 comment Calling for 100x faster processors, Baidu released DeepBench, a benchmark for how fast processors train neural networks.
Imagination 2.0 Update Ships News & Analysis 9/26/2016 Post a comment Imagination Technologies predicts profits this year with streamlined operations under a new CEO and thoughts of new core IP licensing models.
TSMC Expands its 3D Menu News & Analysis 9/22/2016 10 comments TSMC showed an expanding array of foundry process technologies, packaging options and applications-specific platforms at an event.
Persistent Memory Needs Apps News & Analysis 9/20/2016 6 comments A researcher from Hewlett Packard Enterprise called for apps that use persistent memory on servers although the chips are still more than a year away.
Emerging Memories: Ship First, Perfect Later News & Analysis 9/20/2016 1 comment MRAM maker Everspin sees perfection as a barrier to getting traction; Everspin sees putting its technology into production as a way to improve processes and lower costs--the keys to adoption.
5G Cellular 'Still in Early Stages' News & Analysis 9/16/2016 1 comment Despite talks of early trials and even commercial systems, the work on a 5G standard at the 3GPP is still in an early phase, said a Qorvo engineer attending the meetings.
Intersil Deal: Renesas' Survival Bid News & Analysis 9/13/2016 Post a comment In an exclusive telephone interview with EE Times, Renesas CEO said the Intersil deal won't be the last big M&A for Renesas. Intersil CEO will stay with the new company in a senior management position.
Chip Process War Heats Up News & Analysis 9/12/2016 Post a comment Fully-depleted silicon-on-insulator is on the rise but FinFETs are strong and planar will be the big winner, says veteran chip watcher Handel Jones.
Web Giants Drive Optical Nets News & Analysis 9/12/2016 Post a comment Microsoft and Facebook are driving separate efforts for a new generation of simplified 400G coherent optical transceivers and optical transport systems.
FCC: Get an App for that Video News & Analysis 9/9/2016 2 comments Pay-TV services would be required to provide free apps to access and search their video content under an FCC proposal aimed to open competition in digital media.
Globalfoundries Preps 12nm FDSOI Process News & Analysis 9/8/2016 7 comments Globalfoundries has announced a next-generation FDSOI process, called12FDX, to follow on from the 22FDX process that is nearing production. The new process nominally at 12nm minimum geometry is intended for mobile computing, 5G, artificial intelligence and autonomous vehicles.
LTE IoT: Sequans Claims 'Big Lead' over Rivals News & Analysis 9/6/2016 3 comments With the recent ratification of the Cat M1 and Cat NB1 standards, Cellular IoT is getting hot. Sequans claims it’s the first to sample CAT M1/NB1 chips, 9 months ahead of its rivals including Qualcomm, Intel and Altair.
Intel Buys Movidius: Automotive Vision in Play? News & Analysis 9/6/2016 Post a comment The Movidius deal is a big win for Intel. Where analysts’ opinions diverge is whether Intel has a long-term ambition to extend Movidius’ technology to autonomous cars, and if Movidius is equally hungry for the automotive market.
Z-Wave Specs Released Online News & Analysis 8/31/2016 1 comment Seeking to attract more users and developers, Sigma Designs released key aspects of its Z-Wave home network for the Internet of Things.
Intel Debuts 14nm+ Processors News & Analysis 8/30/2016 3 comments Intel announced its Kaby Lake PC chips using an enhanced 14nm process and media engine to deliver a 12% overall boost and improved 4K video.
Power9 Opens IBM to Partners News & Analysis 8/24/2016 3 comments IBM’s Power9 processor reaches out to new OEMs and partners with multiple interconnects and variants of the chip, according to a talk at Hot Chips.
AMD Reveals Zen of X86 News & Analysis 8/24/2016 Post a comment AMD detailed Zen at Hot Chips, its next-generation x86 core aimed at head-to head competition with Intel in everything from notebooks to servers.
ARM Reaches for Supercomputers News & Analysis 8/22/2016 1 comment New vector extensions for 64-bit ARM cores aim to take the company into the highest reaches of supercomputer performance with partners including Fujitsu.
Laser Slicing to Slash SiC Wafer Costs, Boost Yield News & Analysis 8/22/2016 1 comment Japanese ingot processing equipment manufacturer DISCO Corporation has unveiled a new laser-based technique to slice wafers out of a SiC ingot, producing 50% more wafers through reduced material losses while slashing production times by a factor of six.
DRAMs to drag ICs to -2% in 2016 News & Analysis 8/11/2016 Post a comment The latest version of The McClean Report projects a 19% decline in DRAMs due to falling PC and tablet sales, dragging total IC revenues to a 2% contraction in 2016.
Samsung Debuts 3D XPoint Killer News & Analysis 8/11/2016 5 comments Samsung announced Z-NAND, a 3D flash variant it says will have similar performance and lower cost in solid-state drives than Micron Quantx SSDs.
Micron demos 3D XPoint in drives News & Analysis 8/9/2016 2 comments Micron showed prototype solid-state drives using its 3D XPoint memories with data for their performance as Toshiba talked about NAND flash advances.
GaN Power Amplifier Addresses 5G News & Analysis 8/5/2016 2 comments Researchers in Germany have developed one of the building blocks required to roll out 5G networks: An integrated circuit for power amplifier transistor implemented in gallium nitride technology.
Field Data Proves GaN FET Reliability, Says EPC News & Analysis 8/2/2016 Post a comment Gallium nitride power FET maker Efficient Power Conversion (EPC) has published its reliability report documenting GaN technology reliability after millions of device hours of stress testing, and based on analysis of all field returns.
Wearables Try On Package Options News & Analysis 7/28/2016 1 comment The fragmented market for wearable computers is pushing innovations in device packaging and interconnects said Qualcomm, Mediatek and others.
What are the engineering and design challenges in creating successful IoT devices? These devices are usually small, resource-constrained electronics designed to sense, collect, send, and/or interpret data. Some of the devices need to be smart enough to act upon data in real time, 24/7. Specifically the guests will discuss sensors, security, and lessons from IoT deployments.