Power9 Opens IBM to Partners News & Analysis 8/24/2016 2 comments IBM’s Power9 processor reaches out to new OEMs and partners with multiple interconnects and variants of the chip, according to a talk at Hot Chips.
AMD Reveals Zen of X86 News & Analysis 8/24/2016 Post a comment AMD detailed Zen at Hot Chips, its next-generation x86 core aimed at head-to head competition with Intel in everything from notebooks to servers.
ARM Reaches for Supercomputers News & Analysis 8/22/2016 1 comment New vector extensions for 64-bit ARM cores aim to take the company into the highest reaches of supercomputer performance with partners including Fujitsu.
Laser Slicing to Slash SiC Wafer Costs, Boost Yield News & Analysis 8/22/2016 1 comment Japanese ingot processing equipment manufacturer DISCO Corporation has unveiled a new laser-based technique to slice wafers out of a SiC ingot, producing 50% more wafers through reduced material losses while slashing production times by a factor of six.
DRAMs to drag ICs to -2% in 2016 News & Analysis 8/11/2016 Post a comment The latest version of The McClean Report projects a 19% decline in DRAMs due to falling PC and tablet sales, dragging total IC revenues to a 2% contraction in 2016.
Samsung Debuts 3D XPoint Killer News & Analysis 8/11/2016 5 comments Samsung announced Z-NAND, a 3D flash variant it says will have similar performance and lower cost in solid-state drives than Micron Quantx SSDs.
Micron demos 3D XPoint in drives News & Analysis 8/9/2016 2 comments Micron showed prototype solid-state drives using its 3D XPoint memories with data for their performance as Toshiba talked about NAND flash advances.
GaN Power Amplifier Addresses 5G News & Analysis 8/5/2016 2 comments Researchers in Germany have developed one of the building blocks required to roll out 5G networks: An integrated circuit for power amplifier transistor implemented in gallium nitride technology.
Field Data Proves GaN FET Reliability, Says EPC News & Analysis 8/2/2016 Post a comment Gallium nitride power FET maker Efficient Power Conversion (EPC) has published its reliability report documenting GaN technology reliability after millions of device hours of stress testing, and based on analysis of all field returns.
ASML Reports Progress on EUV News & Analysis 7/22/2016 3 comments ASML took orders for four pre-production EUV systems in its latest quarter, fueling hopes the new lithography scanners will be ready for 5nm chips in 2020.
Intel a Bear on PCs, a Bull on Flash News & Analysis 7/20/2016 1 comment Amid second-quarter results, Intel said it expects a double-digit PC decline this year but sees flash picking up as it continues a 14nm rollout and starts a 10nm ramp.
IEDM Explores Silicon Horizon News & Analysis 7/20/2016 Post a comment The annual International Electron Devices Meeting released a preliminary program covering topics from quantum and neuromorphic computing to the 5nm node and the IoT.
5G Research Gets U.S. Call News & Analysis 7/16/2016 Post a comment The U.S. took a step ahead in 5G cellular research with a $400 government effort drawing praise from experts who called for global harmony on spectrum.
FCC Paves Way for 5G News & Analysis 7/15/2016 Post a comment The U.S Federal Communications Commission voted unanimously to approve a set of rules for wireless broadband communications operating above 24 GHz.
Wearables Don Secret Materials News & Analysis 7/14/2016 2 comments Contract manufacturer Flex and fabric maker MAS Holdings partnered to bring printed inks and conductive yarns to wearables later this year.
TSMC to Adopt Extreme Ultraviolet at 5nm News & Analysis 7/14/2016 5 comments Taiwan Semiconductor Manufacturing Co. (TSMC), the world’s largest foundry, said it will fully implement extreme ultraviolet (EUV) lithography to make 5nm chips by the end of this decade.
ST Grows STM32 MCU Family News & Analysis 7/11/2016 Post a comment STMicroelectronics has introduced a development ecosystem for its latest low-power, high-performance STM32L4 microcontrollers and expanded the series with five product lines comprising a range of package and memory-density options.
Startup Debuts Open Source SoCs News & Analysis 7/11/2016 2 comments Startup SiFive aims to use the open source RISC-V core as the heart of two SoC platforms, enabling a broader set of engineers to build custom processors.
Video Compression Feels a Pinch News & Analysis 6/30/2016 6 comments Clouds surround digital video with compression gains currently falling far short, but Microsoft and Google shared promising work on augmented reality and royalty-free codecs.
PCIe 4.0 Heads to Fab, 5.0 to Lab News & Analysis 6/28/2016 2 comments Chips using PCI Express 4.0 are preparing to tape out although the spec isn’t done; work a 5.0 version will start next year targeting 16 or 32 Gbits/second.
What are the engineering and design challenges in creating successful IoT devices? These devices are usually small, resource-constrained electronics designed to sense, collect, send, and/or interpret data. Some of the devices need to be smart enough to act upon data in real time, 24/7. Specifically the guests will discuss sensors, security, and lessons from IoT deployments.