Dual current sense amplifiers deliver fast response, precision Product News 1/31/2007 Post a comment Linear's LTC6103 contains two independent, high side current sense amplifiers that feature input bias current of 170-nA max and maximum input offset voltage of 450-µV. This precision performance allows the part to resolve very small currents and still operate over a large dynamic range.
GloNav taps Jazz to produce low-power GPS RFIC Product News 1/31/2007 Post a comment Using Jazz's 0.18-micron SiGe BiCMOS process, GloNav has developed a low-power L1 GPS RFIC that operates from a single 1.8-V supply to consume just 15-mW of power, a key requirement for today's cellular handsets, portable consumer devices and battery-operated GPS devices.
DVD platform boasts Wi-Fi capability Product News 1/31/2007 Post a comment Zoran has teamed with middleware provider Kestrelink to offer a wireless-connected DVD player platform with Wi-Fi capability, based on Zoran's Vaddis DVD multimedia processor and the KestrelMedia networking connectivity suite.
IBM, CeRoma team for Power PC-enabled media chips Product News 1/31/2007 Post a comment IBM and CeRoma Ltd. (Caesarea, Israel) have formed a partnership to develop, manufacture and sell digital media chips based on the PowerPC architecture for applications such as set-top boxes, internet protocol television (IPTV), digital television (DTV) and multiple transmission standards.
Hynix 4Q sales up on strong DRAM demand News & Analysis 1/31/2007 Post a comment Hynix Semiconductor posted a fourth quarter 2006 net profit of 1.04 trillion won (about $1.1 billion) on consolidated revenues of 2.61 trillion won (about $2.8 billion), the company said. Hynix said favorable DRAM market conditions persisted through the quarter.
Actel expands channel in China News & Analysis 1/30/2007 Post a comment To promote wider use of its field-programmable gate array devices by Chinese designers, Actel Corp. announced a significant expansion of its sales channel in Greater China.
Enhanced Xilinx FPGA tool extends serial I/O debug capabilities Product News 1/30/2007 Post a comment Check out Xilinx's latest version of its ChipScope Pro software and Serial I/O toolkit. Version 9.1i extends serial I/O debug capabilities to support 65-nm Virtex-5LXT FPGAs. This release also delivers 60% faster clock speeds and comprehensive low-cost BERT capabilities for RocketIO multi-gigabit transceivers.
RF CMOS design company gets R&D grant, nears VC funding News & Analysis 1/30/2007 Post a comment RF CMOS IC developer Elonics has received a £500,000 grant from the Scottish Executive to support the further development of its proprietary DigitalTune technology. The grant is seen as a precursor to the privately held and financed company seeking venture capital funding.
France targets Euros 23 million digital sensor project News & Analysis 1/30/2007 Post a comment The French government has put Euros 5.6 million towards a project to develop infra-red imaging sensors targeted at uses in the automotive, medical and aerospace industries. Participants in the Euros 23 million R&D project, dubbed Imalogic, include ST Microelectronics, image sensor specialist Sofradir, its subsidiary Ulis, Trixell, and French microelectronics research center CEA-LETI.
Nujira powers ahead with $9.8 milion round B News & Analysis 1/30/2007 Post a comment Power amplifier technology developer Nujira has closed a $9.8 million Series B funding round, bringing the total venture capital invested to nearly $18 million. The company, formed in 2002, also announced it has demonstrated its ultra-high efficiency RF Power Amplifier (PA) operation in collaboration with three simultaneous full-bandwidth WCDMA carriers.
UCSB researchers claim blue laser diode breakthrough News & Analysis 1/29/2007 Post a comment A team of University of California-Santa Barbara (UCSB) researchers led by Shuji Nakamura, a pioneer of laser diode science, have created a new type of blue-violet laser diode that they say could replace the c-plane violet laser diodes used for competing next-generation DVD formats. The researchers say they've achieved lasing operation in nonpolar gallium nitride semiconductors and demonstrated the world's first nonpolar blue-violet laser diodes.
Non-volatile memory IP targets security apps Product News 1/29/2007 Post a comment Virage Logic Corp.'s next generation embedded non-volatile memory called NOVeA provides a multi-programmable embedded memory which is key in applications requiring sophisticated security and digital rights management capabilities such as Flash memory cards, DVD players and and RFID tags.
Motorola expands use of TI Omap for 3G, WiMax Product News 1/29/2007 Post a comment Motorola is broadening its use of Texas Instruments' Omap processors for 3G and WiMax products, and may be retreating further from StarCore and other designs that originated with Motorola spinout Freescale Semiconductor.
iPhone margins smaller than reported, claims analyst News & Analysis 1/29/2007 Post a comment Analysts are beginning to question earlier reported Bill of Materials costs on Apple's iPhone and are suggesting that the gross margins Apple will achieve may be much lower than predicted, and nearer the mid to high 20 percent range than the estimated 50 percent. In particular, there are debates about the cost of the display and related touch screen technology.
Server wars turn full circle News & Analysis 1/29/2007 Post a comment Just six months ago, Sun Microsystems Inc. chief architect Andy Bechtolsheim was lampooning Intel microprocessors as power hogs. Advanced Micro Devices' CEO, Hector Ruiz, was a darling of Wall Street, where rumors were rife that Dell soon would adopt AMD's Opteron chips.
Filtronic cuts back on compound semis capex News & Analysis 1/29/2007 Post a comment Filtronic plc is set to reduce the capital expenditure budget in its Compound Semiconductors division in an attempt to align demand with demand, and the amount spent will be £3 million less than the £10 million previously announced. The company said the division has had a year of growth, reducing losses before non-recurring items, although it now expects demand to be lower than previously anticipated.
Oki shifts more design to Taiwan's Faraday News & Analysis 1/29/2007 Post a comment Continuing its march toward a lean and light model, Japan's Oki Semiconductor said it will outsource more design work to Taiwan's Faraday Technology so that it can focus on front-end design and marketing.
CSR deals enhance audio functionality on BlueCore Product News 1/26/2007 Post a comment Bluetooth chip pioneer CSR has enhanced its DSP-based BlueCore5 multimedia platform with extended audio compression capabilities by porting APT Ltd's enhanced apt-X algorithm on to the platform. In a separate deal, with Acoustic Technologies, the company added noise cancellation and improved speech intelligibility to BlueCore.
RuBee seen as alternative protocol to RFID News & Analysis 1/26/2007 Post a comment You have got used to ZigBee, are pondering the benefits of WiBree, so start getting used to yet another wireless networking protocol - RuBee, also known as IEEE 1902.1. The emerging standard is expected to give retailers and manufacturers an alternative to RFID for many applications.
3G still a long shot in China News & Analysis 1/26/2007 Post a comment After Chinese government officials stoked hopes that 3G would be released in the first half, that possibility is fading fast as insiders note that network testing will continue into the fourth quarter.
What are the engineering and design challenges in creating successful IoT devices? These devices are usually small, resource-constrained electronics designed to sense, collect, send, and/or interpret data. Some of the devices need to be smart enough to act upon data in real time, 24/7. Are the design challenges the same as with embedded systems, but with a little developer- and IT-skills added in? What do engineers need to know? Rick Merritt talks with two experts about the tools and best options for designing IoT devices in 2016. Specifically the guests will discuss sensors, security, and lessons from IoT deployments.