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Content tagged with Semiconductors posted in January 2008
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Nanochip on-track for terabyte chips
News & Analysis  
1/25/2008   Post a comment
Nanochip Inc. claims to be on-track to the development of terabyte memory chips that combine phase-change media to cantilever read/write heads controlled by a microelectro-mechanical system.
ARM9-based MCU supports real-time smart-control panels
Product News  
1/25/2008   Post a comment
Atmel launched the AT91SAM9RL64, an ARM9-based interactive GUI microcontroller that integrates on-chip LCD and touch screen controllers, a USB high-speed device, 64k Byte SRAM configurable as TCM, a 24-channel DMA and 6-layer bus.
Bluetooth/FM radio combo chip saves space, cost
Product News  
1/24/2008   Post a comment
ST's STLC2690 single-chip Bluetooth v2.1+EDR with fully integrated FM RDS radio receiver and short-range FM RDS transmitter enables a new generation of battery-driven portable devices.
Boost controller cuts component count in LED lighting designs
Product News  
1/24/2008   Post a comment
Exar has released the first in a family of boost controllers supporting LED lighting and general DC/DC conversion.
Power amps enable high linearity transmitters
Product News  
1/24/2008   Post a comment
Ku- and Ka-band power amplifiers from Endwave enable high linearity transmitters for VSAT and broadband satellite networks.
Avnet, ADI and Micron team on video surveillance development kit
Product News  
1/24/2008   Post a comment
The second generation of the Digital Video Surveillance Kit provides a simplified prototype development platform for intelligent video surveillance applications -- combining the unique video handling capabilities of the Blackfin' processor from Analog Devices and state-of-the-art CMOS image sensors from Micron Technology.
NEC expands F Series MCUs for in-vehicle automotive systems
Product News  
1/24/2008   Post a comment
Addressing the growing demand for greater automation of in-vehicle comfort and safety systems, NEC introduced 13 32-bit V850ES/Fx3-L microcontrollers (MCUs) that offer increased functionality at a low cost for automotive body and safety applications.
AMD brings advanced graphics to embedded systems
Product News  
1/24/2008   Post a comment
AMD introduced the ATI Radeon E2400, a high-performance graphics processing unit that delivers the latest 2D, 3D and multimedia graphics performance to the embedded market.
WLAN, Bluetooth front-end module features small form factor
Product News  
1/24/2008   Post a comment
EPCOS has developed what its says is the most compact all-in-one front-end module worldwide for Bluetooth and WLAN applications meeting the 802.11 b/g/n standard.
IC startup targets GPS location with cameras
Product News  
1/24/2008   Post a comment
Fabless semiconductor startup Air Semiconductor (Swindon, England) has started discussions with several digital camera makers about integrating its first chip into models to give the cameras continuous GPS based location capabilities. Engineering samples of the Airwave-1 chip are scheduled for the summer.
Mobile phone shipments head for 1.2 bn in '08
Product News  
1/24/2008   Post a comment
Mobile phone shipments for the last quarter of 2007 reached 332 million units, 13 percent up on the number shipped in the corresponding quarter of 2006, and Nokia has reached 40 percent of global market share, according to Strategy Analytics (London).
VoIP processors speed up migration to multiservice access nodes
Product News  
1/23/2008   Post a comment
Mindspeed Technologies has introduced a family of highly-integrated VoIP processors that enable the migration of copper loop voice access networks from traditional Class-5 TDM equipment to next-generation VoIP MSANs.
Acoustic guitar subtleties re-created by DSP
News & Analysis  
1/23/2008   Post a comment
Fishman's digital acoustic imaging captures the subtleties of an acoustic guitar in the studio, then harnesses an Analog Devices digital signal processor to re-create that pristine sound on stage or in your home studio.
SiGe passive mixer delivers optimized linearity, noise and integration
Product News  
1/23/2008   Post a comment
Maxim Integrated Products claims the industry's highest performance, fully integrated, 815-MHz to 1000-MHz SiGe passive mixer for 2.5G/3G wireless infrastructure applications.
50-Gbps SFI-5 interface on Stratix II GX FPGAs
Product News  
1/23/2008   Post a comment
By providing a 50-Gbps SFI-5 interface on Stratix II GX FPGAs, Altera offers a high-speed interface to physical layer devices.
Collinson joins DiBcom to help with IPO
News & Analysis  
1/23/2008   Post a comment
Mobile TV chip specialist DiBcom (Palaiseau, France) has brought on board Glenn Collinson , a co-founder and former Vice president of sales at Bluetooth chip group CSR, as the Chairman of the Strategic Committee within the Board of Directors.
CSR touts enhanced GPS system for mobile phones
News & Analysis  
1/23/2008   Post a comment
Wireless chip specialist CSR plc (Cambridge, England) will demonstrate at next month's Mobile World Congress the first concrete fruits of its push into mobile location, an enhanced-GPS technology that integrates software-based GPS with cellular measurements.
Industry's highest density FPGA features 340K logic elements
Product News  
1/22/2008   Post a comment
Altera's Stratix III FPGAs (combined with Quartus II software) are claimed to enable the industry's fastest compile times per LE for faster overall timing closure.
SiGe's 802.11a/b/g/n front end modules speed Wi-Fi system design
Product News  
1/22/2008   Post a comment
The SE2547A and SE2548A each includes power amplifiers, filtering, power detector, diversity switch, and but require one-third of the size of previous front-end modules.
Step-down converter delivers power savings to industrial equipment
Product News  
1/22/2008   Post a comment
AnalogicTech has unveiled the AAT1160, a power-efficient 3-A step-down DC/DC converter for 12-V industrial applications including backplane-based equipment and portable systems.
Single-chip mobile TV receiver supports global TV standards
Product News  
1/22/2008   Post a comment
Telegent Systems has introduced what it claims is the industry's first single-chip CMOS mobile TV receiver that supports worldwide TV broadcast standards.
Broadcom's McGregor eyes 'portable multimedia device' market
News & Analysis  
1/22/2008   Post a comment
Broadcom Corp. is accelarating the move to 65-nm process technology as it sharpens its focus on the cellphone market and beyond.
NXP baseband powers sub $30 eBOM HSPA phone
Product News  
1/22/2008   1 comment
NXP Semiconductors has started sampling a dual-mode Nexperia multimedia baseband chip for HSPA and EDGE phones that feature H.264 decoding on QVGA at 30 frames per second (fps).
Storage chip specialist raises $14 million
News & Analysis  
1/22/2008   Post a comment
MEMS-based storage company Nanochip Inc that counts Intel and Microsoft amongst its backers, has completed a $14 million C2 financing round.
Video: startup explores analog EDA problems
News & Analysis  
1/22/2008   Post a comment
Startup Berkeley Design Automation is working on new capabilities to analyze in software analog effects in communications between die in a multi-chip package that can impact device yields, said company founder and chief executive Ravi Subramanian in a video interview with EE Times.
Israeli wireless consortium seeks links to European R&D
News & Analysis  
1/22/2008   Post a comment
Israel has formed a consortium for short range communication, dubbed ISRC, whose participants are looking into worldwide co-operation, especially within the European Seventh Framework Programme (FP7).
IC-based scope function redefines system integrity analysis
Product News  
1/21/2008   Post a comment
Vitesse Semiconductor claims its advanced high-speed IC-based oscilloscope function will significantly change the economics of signal integrity analysis and network reliability.
LatticeECP2/M FPGAs selected for next-gen camera system
Product News  
1/21/2008   Post a comment
Quest Innovations selects the LatticeECP2/M FPGA family for its next-generation "Raptor" camera system.
Motor controller targets enterprise hard disk drives
Product News  
1/21/2008   Post a comment
ST's L7220 motor controller for enterprise HDDs integrates all of the circuits required to drive both the spindle motor and the voice-coil motor, plus the motor drive power FETs and multiple high-efficiency voltage regulators.
Xilinx announce three new Virtex-5 FPGAs
Product News  
1/21/2008   Post a comment
Three new devices have been added to Xilinx's 65 nm Virtex-5 FPGA family to provide customers with more cost and density options.
Silicon Line brings ultra-low power optical PHY chipset
News & Analysis  
1/21/2008   Post a comment
Enabling the usage of polymer optical fiber in mobile or portable electronic designs, fabless semiconductor startup Silicon Line GmbH (Munich, Germany) has developed a PHY chipset with very low power dissipation.
Power management device combines power manager, controller, battery charger
Product News  
1/21/2008   Post a comment
Linear Technology has introduced the highly integrated LTC4098, an autonomous high-efficiency power manager, ideal diode controller and battery charger for portable USB-powered devices.
PCIe switches meet data and control plane interconnect requirements
Product News  
1/21/2008   Post a comment
IDT has announced sampling of its PCIe family of switching solutions specifically tailored to meet the high-performance data and control plane interconnect requirements for communications applications.
Groups collaborate on EUV lithography advances
News & Analysis  
1/21/2008   Post a comment
Belgian research group IMEC (Leuven) and another leading center for next-generation nanoelectronics research and development, the College of Nanoscale Science and Engineering (CNSE) of the University at Albany in Albany, New York, will collaborate on extreme ultraviolet lithography experiments as a means to accelerate the introduction of EUVL into manufacturing.
Tower to participate in electric car project, says report
News & Analysis  
1/21/2008   Post a comment
Pure play foundry Tower Semiconductor (Migdal Hemek, Israel) is set to participate in the Israeli electric car venture Project Better Place, according to a report in the Israeli newspaper Globes .
Analysts offer mixed signals for analog
News & Analysis  
1/21/2008   1 comment
After a flat 2007, the analog semiconductor market is positioned for a rebound this year. But not all analog vendors are expected to reap the benefits.
TI mounts data converter offensive
Product News  
1/21/2008   Post a comment
Seeking to gain share on rival Analog Devices Inc., Texas Instruments Inc. has rolled out a new family of high-speed, low-power analog-to-digital converters (ADCs).
250-mA audio buffer offers low distortion, noise
Product News  
1/21/2008   Post a comment
The LME49600 high-fidelity 250-mA audio buffer from National Semiconductor delivers low noise and distortion for professional and high-performance audio applications.
Sanyo finally offloads cellphone unit to Kyocera
News & Analysis  
1/21/2008   Post a comment
Japanese components maker Kyocera Corp. is to acquire, for between $375 million to $460 million, Sanyo Electric Company’s mobile phone business. A deal has been under discussion since last October and the companies said they hope to conclude the transfer of the loss-making handsets operation by April 1 this year.
dPMR processor features GMSK functionality
Product News  
1/20/2008   Post a comment
CML Microcircuits' CMX7143 addresses global market requirements for multi-mode wireless data connectivity with the ability to implement different wireless data schemes.
Power MOSFET features low on-resistance of 1.5-milliohms
Product News  
1/20/2008   Post a comment
NEC's latest addition to its NP Series is the NP180N04TUG low-voltage power MOSFET, which features an advanced architecture and package designed to manage heat dissipation and reduce power loss with a low RDS(on) level of 1.5 milliohms (maximum).
DC-termination ICs tailored for ADSL/VDSL applications
Product News  
1/20/2008   Post a comment
Clare has developed the CPC1466 for use in ADSL/VDSL Customer Premise Equipment (CPE) to terminate the DC current of DSL twisted-pair copper lines without telephone voice services.
Solid-state GaAs amplifier offers high linearity
Product News  
1/20/2008   Post a comment
Stealth Microwave's 925-960-MHz solid-stae GaAs amplifier for the cellular/GSM telephony market delivers a P1dB of +47 dBm, linear gain of 58 dB, and gain change over temperature of ±0.5 dB.
Ultra-high-linearity amplifiers housed in lower cost package
Product News  
1/18/2008   Post a comment
Spectrum Microwave has introduced a line of lower cost amplifiers that provide ultra-high linearity and a low noise figure.
Toshiba expands power multi-chip module family
Product News  
1/18/2008   Post a comment
Toshiba has expanded its family of power multi-chip modules (MCM) with a single package, 35A, 30V synchronous step-down converter switching module for high current, low voltage applications such as servers.
Highly integrated step-down regulator fits into tiny package
Product News  
1/18/2008   Post a comment
Maxim's MAX8655, a highly integrated, 25-A step-down regulator is housed in a tiny 8 x 8-mm TQFN package, without sacrificing power or control features.
24-bit DAC delivers high audio quality for mobile music apps
Product News  
1/18/2008   Post a comment
Aimed at mobile music applications, STMicroelectronics has introduced a high-performance 24-bit audio DAC with integrated power management that offers a 103-dB dynamic range across the entire audio path.
For now, AMD looks like industry's new darling
News & Analysis  
1/18/2008   1 comment
Advanced Micro Devices Inc. is the chip industry's new golden boy.
Mobile RAM features widest bit width
Product News  
1/18/2008   Post a comment
Elpida's x64-bit wide I/O 256-Mbit Mobile RAM offers double the bandwidth of existing 32-bit products and a low operating voltage of 1.2V.
picoChip readies TD-SCDMA femtocell ref design
Product News  
1/18/2008   Post a comment
Wireless chip design specialist picoChip (Bath, England) is using this week's UK-China Business Summit and Prime Minster Brown's visit to China to tout availability of the first design the company has developed wholly at its Beijing design centre - a TD-SCDMA femtocell reference design.
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