Hitachi, Toshiba separately sample 512-Mbit flash devices News & Analysis 10/10/2000 Post a comment TOKYO ( ChipWire) -- Hitachi Ltd. and Toshiba Corp. have each introduced 512-Mbit flash devices, with twice the density of their respective highest-density flash devices. The 512-Mbit milestone was made possible by moves to smaller process geometries and advanced storage cell techniques. The parts are intended for use in flash storage cards.
Altera, Xilinx reaffirm 15% sequential growth after downgrading of stock News & Analysis 10/10/2000 Post a comment SAN JOSE -- Programmable logic rivals Altera Corp. and Xilinx Inc. today both reiterated their forecasts for 15% sequential growth in revenues in the just-ended third quarter despite downgrading of their stock by analysts, who are worried about demand for their chips. Stock prices for both companies plunged in trading today following the downgrading by analysts.
Via outlines PC processor strategy News & Analysis 10/10/2000 Post a comment SAN JOSE - Via Technologies Inc. here today outlined its microprocessor strategy by announcing a new line of chips for the low-end PC market.
Initially, the company intends to push its current Cyrix III processor lines to new performance levels in order to attack the low-end PC and related markets, said Glenn Henry, founder and president of Centaur Technology, the x86-based chip development subsidiary of Taiwan's Via.
Adaptive Silicon prepares FPGA cores for ASICs News & Analysis 10/10/2000 Post a comment LOS GATOS, Calif. -- Adaptive Silicon Inc. this week announced first silicon on its programmable ASIC cores and is lining up licensees in preparation for an early 2001 launch. Adaptive Silicon here said it does not expect to release products until March, and its initial sales will be to ASIC customers of LSI Logic Corp., its primary investor.
Intel's change in MPU management comes at crucial time, say analysts News & Analysis 10/10/2000 Post a comment SANTA CLARA, Calif. -- Intel Corp.'s shuffling of its microprocessor management team comes at a critical time for the world's largest chip maker, said industry analysts reacting to the company's realignment of leadership in its Technology and Manufacturing Group and the Intel Architecture Group (see Oct. 9 story). According to some Intel observers, the moves are aimed at solving chronic manufacturing problems and slow production ra
Intel shuffles management to ensure smooth ramp of new processors News & Analysis 10/9/2000 Post a comment SANTA CLARA, Calif.-- In a move apparently aimed at solving manufacturing problems in advanced microprocessors, Intel Corp. today shuffled the responsibilities of top managers overseeing its highest performing products. Mike Splinter, 50, was named executive vice president and general manager of Intel's Technology and Manufacturing Group. Splinter was previously senior vice president in the group, but he is also being given additional responsibilities by Intel to guarantee the successful ramp of
National's chip-scale 8-bit MCUs shrink size by 'whopping 66%' News & Analysis 10/9/2000 Post a comment SANTA CLARA, Calif. -- National Semiconductor Corp. here today unveiled a new leadless chip-scale package for highly integrated, full-function 8-bit microcontrollers that fit in the tight spaces of tiny information appliances and Internet-connected systems. The chip-scale package shrinks the space needed for National's COP8 microcontrollers to 7-by-7 mm, or one-third the area of MCUs housed in standard 44-pin thin-quad flat packs (TQFPs).
Atmel licenses 32-bit Arm cores, partners with Gemplus in chip sets News & Analysis 10/9/2000 Post a comment SAN JOSE -- In a move to beef up its system-on-chip designs, Atmel Corp. here today announced it has licensed a pair of 32-bit RISC core from U.K.-based Arm Ltd. Atmel said the Arm920T and Arm946E-S cores will used in highly integrated 32-bit microcontrollers and ASICs for wireless, wireline, multimedia and secure-chip applications. In a separate deal, Atmel said it has agreed to support the GemCore chip set from Gemplus S.C.A., which is using the product to pursue new smart-card applications in
Intel reportedly validating its own DDR chip set News & Analysis 10/9/2000 Post a comment SANTA CLARA, Calif. -- In a move almost certain to raise a few eyebrows at Rambus Inc., Intel Corp. is validating its desktop-PC double-data-rate (DDR) chip set, the Almador, scheduled to be unveiled next year, according to memory companies currently supplying Intel.
Weak PC demand could hurt DRAM sales, warn analysts News & Analysis 10/9/2000 Post a comment NEW YORK -- The latest forecasts for the DRAM and PC manufacturers isn't good despite last week's news of strong quarterly profits at Micron Technology Inc. In fact, the outlooks are "murky," "troubled," and "cautionary," according to industry analysts.
Rambus plans U.S. suit against Hyundai, asks for change of venue News & Analysis 10/9/2000 Post a comment MOUNTAIN VIEW, Calif.--Rambus Inc. has filed a motion to change the venue of a U.S. patent suit filed by Hyundai Electronics Industries Co. Ltd. from San Jose to a federal court in Virginia. Rambus here also said it plans to file its own U.S. patent suit against Hyundai in response to the South Korean company's case, which attempts to invalidate the company's claims on technology rights to high-speed synchronous DRAM interfaces.
SiByte enters network-processor arena with programmable chip News & Analysis 10/8/2000 Post a comment SAN JOSE - SiByte Inc. here today will take the Microprocessor Forum to enter the network-processor market by announcing a programmable chip said to run at speeds up to 4,400 million of instructions per second (MIPS). Built around a 64-bit RISC microprocessor architecture from Mips Technologies Inc., the new Mercurian line of network-processor products from SiByte are highly-integrated chips designed for use in 2.5-Gbits (OC-48) bandwidth applications.
Philips aims telecom ASICs, co-processors at 3G phones News & Analysis 10/6/2000 Post a comment NOORDWIJK, the Netherlands -- Philips Semiconductors is stepping up its assault on wireless communications markets. During a series of press briefings here this week, Philips launched a dedicated telecom ASICs unit focused on customizing baseband chips and it the introduced an application co-processor series for multimedia functions in third-generation (3G) handsets.
Philips rolls out first reusable architecture chip for video News & Analysis 10/5/2000 Post a comment NOORDWIJK, the Netherlands -- After reusable design cores for ICs, what's the next big thing? Philips Semiconductors says it's reusable architectures for large system-on-chip platforms, and today the Dutch company launched its first such product aimed at next-generation, interactive set-top boxes. After the introduction of the first Nexperia digital video platform (DVP), Philips is planning to roll out three other reusable chip architectures for wireless communications, digital audio, and car in
Oki rolls out low-cost linear Codec for handsets News & Analysis 10/3/2000 Post a comment SUNNYVALE, Calif. -- Oki Semiconductor here has announced a new linear Codec device designed to lower the costs of digital-cellular handsets.
Based on the company's digital signal processor (DSP) architecture, the ML7041 supports several cellular standards, such as code-division multiple access (CDMA), Global System for Mobile Communications (GSM), and time-division multiple access (TDMA).
Mosaid rolls out tester for fast prototype memories News & Analysis 10/2/2000 Post a comment SANTA CLARA, Calif. -- The Systems Division of Mosaid Technologies Inc. today announced a new low-cost engineering test system for prototype high-speed memory devices. The MS4205 system is designed for testing fast DRAMs, SRAMs, flash memories, embedded ICs, and related devices, said John Bateson, vice president of marketing and business development for Mosaid's Systems Division here.
Toshiba sees annealed wafers replacing epi silicon in logic fabs News & Analysis 10/2/2000 Post a comment TOKYO -- Toshiba Ceramics Co. Ltd. here believes it has made significant progress in moving hydrogen-annealed wafers from mainly being used in memory fabs to chip plants making high-performance logic. The Tokyo-based company said its hydrogen-annealed Hi-Wafer substrates have been certified for use with 0.18-micron CMOS processes by an unidentified "major" supplier of digital signal processors (DSPs).
What are the engineering and design challenges in creating successful IoT devices? These devices are usually small, resource-constrained electronics designed to sense, collect, send, and/or interpret data. Some of the devices need to be smart enough to act upon data in real time, 24/7. Are the design challenges the same as with embedded systems, but with a little developer- and IT-skills added in? What do engineers need to know? Rick Merritt talks with two experts about the tools and best options for designing IoT devices in 2016. Specifically the guests will discuss sensors, security, and lessons from IoT deployments.