Toshiba expands 16-, 32-bit MCU lines Product News 10/4/2006 Post a comment Toshiba America Electronic Components, Inc. (TAEC) has beefed-up its embedded flash microcontroller line with the launching of two new 16-bit MCUs and a new 32-bit MCU based on SuperFlash technology.
Fanless SBC operates in rugged environments Product News 10/4/2006 Post a comment WinSystems has launched its EBC-855-G, an EBX-compatible, Intel 1GHz ultra low-power, Celeron (Dothan core) single board computer.The fanless SBC operates over an industrial temperature range of -40° to +70°Celsius.
Xilinx opens Indian development center News & Analysis 10/4/2006 Post a comment Market leading programmable logic supplier Xilinx has opened a development center at Hyderabad, in southern India. The center has an initial staff of 75 engineers, with plans to raise this number to 300 in the next few years.
PoE systems jack up their flexibility and firepower Product News 10/4/2006 Post a comment Product recap - Significantly expanding their overall flexibility, the latest slew of chips and modules for serving a maturing power-over-Ethernet (PoE) technology demonstrate yet higher levels of integration, more power per port, and system costs across the board that are dropping to half that of the previous generation.
Chairs of Qualcomm, Broadcom face off to settle litigation News & Analysis 10/4/2006 Post a comment A federal magistrate judge has ordered the heads of Broadcom Inc. and Qualcomm Inc. to appear in court Wednesday (Oct. 4) in an attempt to find some common ground in the long running and increasingly acrimonious legal disputes between the communications chip makers.
Commentary: Another wireless standard on the horizon News & Analysis 10/3/2006 Post a comment Nokia is celebrating the 20th anniversary of its corporate research center this week – which of course calls for a bit of a splash. So the Finnish group has taken the wraps off Wibree a wireless networking technology that is similar to Bluetooth but operates at up to one tenth the power consumption.
ITC set to rule on Broadcom, Qualcomm disputes News & Analysis 10/3/2006 Post a comment The long running litigation between Qualcomm Inc. and Broadcom Corporation over patents related to technology related to 3G technology may finally be decided by the International Trade Commission after a Judge threw out Qualcomm's request to stop Broadcom developing and selling 3G chips.
Marvell expects 10% revenue drop, restatement from options News & Analysis 10/2/2006 Post a comment Marvell Technology Group said it now expects revenue for the current quarter to be down 10 percent from the $574 million it posted last quarter. The company also said it would likely restate some of its historical financials as the result of an ongoing investigation into historical stock options granting practices.
LSI Logic to boost Indian investment News & Analysis 10/2/2006 Post a comment LSI Logic will invest hundreds of millions of dollars over the next decade in design centers in Bangalore, India, in the eastern Indian city of Kolkata and a likely third center.
Korean tech exports soar News & Analysis 10/2/2006 Post a comment Korean IT exports exceeded $10 billion for the first time in September as a result of brisk sales of semiconductors, mobile phones and display panels, the Ministry of Information and Communication said.
'Tech overshoot' under fire News & Analysis 10/2/2006 Post a comment The private-equity buyout movement is just one sign of a tectonic shift in the semiconductor industry as businesses that have chased Moore's Law now grapple with "technology overshoot," two Harvard professors warned.
Single-stage Class D amp delivers 300 watts Product News 10/2/2006 Post a comment Product Review - Texas Instruments says its TAS5261, which delivers 300 watts into a 4-ohm load, is the industry's highest power single-chip Class D amplifier stage, more than double the output of any competing device.
Europe again lags in global chip sales News & Analysis 10/2/2006 Post a comment Sales of semiconductors in Europe for August were $3.21 billion, up 4.4 percent from the $3.08 billion in the corresponding period last year, according to the U.S. Semiconductor Industry Association (SIA). European sales again showed the lowest percentage increase both for month-on-month and year-to-year sales.
Cypress adds mode to USB transceiver Product News 10/2/2006 Post a comment Cypress has taken its high-speed MoBL-USB TX2 transceiver for mobile handsets and added a mode that allows all input/output (I/O) pins on its UTMI interface to be tri-stated. This MoBL-USB TX2 transceiver, which is optimized for Intel's Monahans processor, allows handsets makers to share baseband or application processor general purpose I/O pins between high-speed USB and other features such as a camera module, GPS or DVB-H.
VIA launches HDTV-ready chipset for embedded market Product News 10/2/2006 Post a comment VIA Technologies' latest IGP chip set for the VIA C7 and Eden processor platforms integrates graphics, audio, memory, storage and HDTV support all in a single chip design. The VIA CX700M chip set measures just 35-mm X 35-mm, helping designers build smaller products.
Battle-hardened veterans of the electronics industry have heard of the “connected car” so often that they assume it’s a done deal. But do we really know what it takes to get a car connected and what its future entails? Join EE Times editor Junko Yoshida as she moderates a panel of movers and shakers in the connected car business. Executives from Cisco, Siemens and NXP will share ideas, plans and hopes for connected cars and their future. After the first 30 minutes of the radio show, our listeners will have the opportunity to ask questions via live online chat.