Wireless audio chips claim 'wired quality' sound Product News 10/22/2007 Post a comment The AudioMagic and VoiceMagic wireless audio transmitter/receiver ICs from Avnera Corporation deliver uncompressed CD-quality sound and claim to solve the interference problems that have been typical of previous wireless audio solutions.
WPAN chip set promised News & Analysis 10/22/2007 Post a comment IBM teams with MediaTek to jointly develop a 60-GHz-band millimeter-wavelength radio and baseband chip set for wireless personal area networks providing gigabyte performance.
Startup tries proprietary path to wireless hi-fi Product News 10/22/2007 Post a comment Touting a successful pairing of wireless and hi-fi audio, fabless chip vendor Avnera Corp. (Beaverton, Ore.) today will announce chip sets for wireless audio connections in the 2.4-GHz band that outperform data-oriented wireless connections in range, freedom from interference, automatic network configuration and full CD-quality sound.
Is fab lite on analog's diet? Product News 10/22/2007 Post a comment As digital integrated-device manufacturers increasingly turn to foundries for their production needs, with some announcing they will no longer build fabs, an inevitable question arises: Will the big analog IDMs follow the same path and move toward fab-lite or even fabless strategies?
DDR3 memory module pair exceeds JEDEC specifications Product News 10/22/2007 Post a comment Virtium is offering DDR3 Very Low Profile (VLP) and DDR3 Ultra Low Profile (ULP) blade memory modules for embedded computing applications that are designed with key enhancements to the JEDEC standard, including reduced module height and densities up to 2-Gbytes with future expansion to 4-Gbytes.
Renesas expands SuperH MPU family Product News 10/20/2007 Post a comment These 32-bit microprocessors from Renesas have A/D and D/A converters, use a QFP package, and achieve a maximum 1.8-times boost in performance compared with the company's SH7709S devices.
Cypress samples 4-Mbit nvSRAM Product News 10/20/2007 Post a comment The 4-Mbit nvSRAMs are the first manufactured on Cypress's S8 0.13-micron SONOS (Silicon Oxide Nitride Oxide Silicon) embedded nonvolatile memory technology, yielding greater densities and improved access times.
Hot-plug controllers save board space, cost Product News 10/18/2007 Post a comment Maxim has introduced the triple-channel MAX5957/MAX5958 and quad-channel MAX5959/MAX5960 controllers, which the company claims are the industry's first fully integrated, 3-/4-channel hot-plug controllers for insertion and removal of PCI Express cards.
AMD posts Q3 loss, revenue soar News & Analysis 10/18/2007 Post a comment Advanced Micro Devices Inc., posted a net loss as expected for the third quarter although revenue increased strongly on higher sales of microprocessors and graphics processors while margins puhed up 8 percentage points.
Fairchild Q3 profits fall on charges News & Analysis 10/18/2007 Post a comment Fairchild Semiconductor said net income in the third quarter declined from the year-ago period on litigation and other charges even as sales increased on higher sales into two key markets.
DS2 readies 400 Mbit/s powerline chip News & Analysis 10/18/2007 Post a comment DS2, the Spanish powerline chip specialist, will start demonstrating next month a device said to double the peak data rate of broadband over powerline equipment and networks to 400 Mbits/second.
High-voltage gate driver saves PCB space Product News 10/17/2007 Post a comment Fairchild Semiconductor's high voltage gate driver IC (HVIC) with 4A current driving capability is designed to ensure system reliability and reduce board space in consumer and industrial applications.
600-V high-voltage ICs integrate protection features Product News 10/17/2007 Post a comment International Rectifier has introduced a set of next-generation 600-V high-voltage integrated circuits (HVIC) dubbed the IRS212x family that is suitable for motor control applications at low-, mid- and high-voltage levels and in a variety of circuit topologies, including three-phase inverter, H-bridge, and other topologies using MOS-gated power devices.
Battle-hardened veterans of the electronics industry have heard of the “connected car” so often that they assume it’s a done deal. But do we really know what it takes to get a car connected and what its future entails? Join EE Times editor Junko Yoshida as she moderates a panel of movers and shakers in the connected car business. Executives from Cisco, Siemens and NXP will share ideas, plans and hopes for connected cars and their future. After the first 30 minutes of the radio show, our listeners will have the opportunity to ask questions via live online chat.