Xtrinsic sensors trigger satellite airbags News & Analysis 10/19/2010 2 comments Claiming to shrink the size, increase the reliability and lower the cost of satellite airbag sensors, Freescale Semiconductor unveiled smart Xtrinsic airbag accelerometers at the Convergence 2010 automotive tradeshow in Detroit.
Intel confirms new Oregon R&D fab News & Analysis 10/19/2010 17 comments Intel has confirmed speculation that it will build a new R&D wafer fab in Hillsboro, Ore., and upgrade other existing U.S. facilities for 22-nm production at a total investment of between $6 billion and $8 billion.
Diodes’ ZXLD1374 LED driver Product News 10/19/2010 Post a comment Diodes Inc.’s new multi-topology LED driver, the ZXLD1374, is designed to increase the performance of high brightness automotive, industrial and commercial lighting systems.
France's CNRS offers nano-memory IP News & Analysis 10/19/2010 3 comments France's Centre National de la Recherche Scientifique (CNRS) has done preliminary work on several nanoelectronic memory technologies that it now wishes to progress further through licensing agreements.
Report: Altera to get TSMC's 28-nm in Q4 News & Analysis 10/19/2010 3 comments Foundry TSMC is set to put its 28-nm CMOS process into production this year in response to orders for programmable logic chips from Altera, according to a Taiwan Economic News report.
Analyst sees 'PLD inflection point' News & Analysis 10/18/2010 4 comments Programmable logic vendors should be more resilient in the face of cyclical downturns with the semiconductor industry entering a "PLD inflection point" where programmable logic appears to be gaining favor versus traditional custom ASIC solutions, according to a Wall Street analyst.
Teardown: Sony's 'Move' into motion gaming News & Analysis 10/18/2010 5 comments Sony's attempt to play catch up with Nintendo's Wii in motion-based gaming hinges on a $99 bundle for its PlayStation 3 that is powered by devices from STMicroelectronics, Kionx, CSR, AKM Semiconductor and OmniVision Technologies.
IDC sees 24% chip market growth in 2010 News & Analysis 10/18/2010 6 comments International Data Corp. (IDC) has provided an update to its semiconductor forecast for 2010 and 2011 and moved its relatively low growth estimates for each up by one or two percentage points.
Lfoundry to help build Malaysian wafer fab News & Analysis 10/15/2010 16 comments Landshut Silicon Foundry GmbH has signed an agreement with QT Hightech Malaysia Sdn Bhd to help build a 200-mm wafer fab in the Kulim High-tech Park in Malaysia, according to local reports.
Triple-mode graphene transistors go analog News & Analysis 10/15/2010 18 comments Rice University researchers have demonstrated analog graphene transistors that can amplify like p-type and n-type silicon transistors, and also exploit the ambipolar ability of graphene in a novel frequency-multiplication mode.
TI buys former SMIC fab in Chengdu News & Analysis 10/15/2010 17 comments Texas Instruments acquired a 200-mm wafer fab in China which was previously operated by Chinese foundry SMIC. Financial terms of the deal were not disclosed.
Fairchild profits on steady sales in Q3 News & Analysis 10/14/2010 3 comments Analog and power IC vendor Fairchild Semiconductor International Inc. saw profits slide sequentially on sales revenue up 1 percent in the third quarter but its net profit beat analysts' expectations while its quarterly revenue was slightly lower than the consensus.
Evaluation system uses IO-Link for Infineon MCUs Product News 10/14/2010 Post a comment Hitex Development Tools has worked with Infineon Technologies, TMG Technologie Management Gruppe Technologie und Engineering, ZMDI Zentrum Mikroelektronik Dresden and with development tool support from Keil to developed an IO-Link demonstration system
Renesas readies mixed-signal MCUs News & Analysis 10/14/2010 15 comments Renesas Electronics is likely to introduce its first mixed-signal microcontrollers within the next two years, according to top executive Yasushi Akao.
Spansion boosts Q3 sales target News & Analysis 10/13/2010 Post a comment Spansion said it is expecting to report higher third quarter sales than it did previously and also announced that it is seeking approval from lenders to buy back $85 million of its shares.
Nokia N8's BOM costs similar to iPhone 4 News & Analysis 10/13/2010 21 comments A teardown analysis of Nokia's N8 smartphone found components supplied by Broadcom, TI, Renesas and others, and found that the device's bill of materials cost is nearly identical to the 16-Gbyte version of the iPhone 4.
ASML's sales, backlog up in Q3 News & Analysis 10/13/2010 2 comments Lithography tool vendor ASML said third quarter sales more than doubled compared with the third quarter of last year and affirmed its projection for record sales in 2010.
Analysts lukewarm on Intel after Q3 report News & Analysis 10/13/2010 20 comments Wall Street analysts gave generally mixed reviews to Intel's third quarter earnings report, saying the company's sales target for the fourth quarter was better than feared, but suggesting that the company still faces some headwinds.
VC, M&A activity dipped in Q3, says GSA News & Analysis 10/13/2010 Post a comment The value venture capital deals and number of mergers and acquisitions involving semiconductor companies all dipped in the third quarter of 2010, according to the Global Semiconductor Alliance.
Altera launches major embedded initiative News & Analysis 10/12/2010 7 comments As part of its embedded initiative, Altera will expand its current embedded partner programs by embracing the broad ecosystems from ARM, Intel, and MIPS Technologies, as well as the FPGA world.
Silicon Labs buys Irish sensor startup News & Analysis 10/12/2010 20 comments Silicon Laboratories Inc. has acquired ChipSensors Ltd., a developer of a dielectric-as-sensor technology designed to detect temperature, humidity and gases. The amount paid was not disclosed.
Tower, Crocus embed MRAM in 130-nm CMOS News & Analysis 10/12/2010 13 comments Tower Semiconductor Ltd., a foundry which trades as TowerJazz, has announced that it has integrated a thermally assisted switching (TAS) magnetic random access memory (MRAM) into its 130-nm CMOS manufacturing process.
ISuppli: Chip market could face oversupply News & Analysis 10/11/2010 10 comments Semiconductor inventory levels may have crossed into oversupply territory amid softness in some end markets in the third quarter, a dramatic turnaround from the lean inventories and part shortage seen for most of 2010, according to iSuppli.
ST's Carmelo Papa appointed chairman of EPoSS News & Analysis 10/11/2010 Post a comment Carmelo Papa, executive vice president and general manager of the industrial and multisegment business within STMicroelectronics, has been appointed chairman of a European think-tank for smart system integration.
ARM, SMIC extend partnership to 40-nm node News & Analysis 10/11/2010 2 comments Processor intellectual property licensor ARM Holdings plc and Chinese foundry Semiconductor Manufacturing International Corp. (SMIC) have announced an agreement to collaborate on the development of a physical IP library platform for SMIC 65-nm LL and 40-nm LL technology process nodes.
Fujitsu enables Fast-Boot Linux solutions for automotive applications Product News 10/9/2010 Post a comment Fujitsu Semiconductor Europe has implemented a new Linux Fast-boot technology in its Jade family of SoC's, the MB86R0x-SoC devices. The technology was developed to meet the requirement for faster boot times in Linux-based automotive applications. Based on a standard Linux kernel, the technology enables developers to take advantage of the quick innovation cycles of the Linux operating system.
What are the engineering and design challenges in creating successful IoT devices? These devices are usually small, resource-constrained electronics designed to sense, collect, send, and/or interpret data. Some of the devices need to be smart enough to act upon data in real time, 24/7. Are the design challenges the same as with embedded systems, but with a little developer- and IT-skills added in? What do engineers need to know? Rick Merritt talks with two experts about the tools and best options for designing IoT devices in 2016. Specifically the guests will discuss sensors, security, and lessons from IoT deployments.