IBM-Infineon venture selects Dow Chemical's resin for low-k process News & Analysis 11/30/2000 Post a comment
CORBEIL ESSONNES, France--Altis Semiconductor, the joint-venture fab venture between IBM Corp. and Infineon Technologies AG, today announced it will use a low-k dielectric resin from The Dow Chemical Co. for 0.13-micron copper chip production next year. The decision follows IBM's selection of Dow Chemical's SiLK material for its own 0.13-micron copper processes earlier this year (see April 3 story).
Matsushita's three-year plan emphasizes ICs for TV, mobile communications News & Analysis 11/30/2000 Post a comment OSAKA, Japan--Matsushita Electric Industrial Co. here today outlined plans to reshapes its business culture while restructuring its businesses for stronger growth in the decade. The three-year "Value Creation 21" initiative sets Matsushita's top priorities as being in television and mobile communications applications, and it plans to expand these segments with advances in integrated circuits, data storage devices, and displays.
Spin-off wins $2.5m for plastic chips study News & Analysis 11/30/2000 Post a comment Cambridge University, with the help of Herman Hauser's Amadeus Capital Partners venture capital company, has formed a spin-off called Plastic Logic to commercialise research into plastic semiconductors.
Transmeta discovers faulty processors in NEC's notebook PCs News & Analysis 11/29/2000 Post a comment SANTA CLARA, Calif. -- In the latest setback in its relatively short history, Transmeta Corp. here on late Wednesday announced that it discovered a faulty batch of microprocessors in a notebook PCs made by NEC Corp. of Japan. Transmeta, a high-profile startup supplier x86-based processors, said it is working with NEC to correct the problem by replacing the faulty chips in about 300 of notebook PCs.
Russian DSP developer scouts RISC partnership News & Analysis 11/29/2000 Post a comment LONDON ( ChipWire) Research Center Module, a design group and intellectual property licenser based in Moscow, is moving its 64-bit NeuroMatrix digital signal processor to a 0.25-micron process technology and is looking for a partnership with a Western RISC-processor provider to help its DSP technology penetrate key applications.
Microsemi sales grow 21% from year ago in quarter News & Analysis 11/29/2000 Post a comment SANTA ANA, Calif. -- Microsemi Corp. today reported net sales increased 21% to $65.4 million in the company's fiscal fourth quarter, ended Oct. 1, compared to pro forma sales of $54.2 million in the period last year (excluding a business sold in June). The supplier of analog, mixed-signal and discrete devices posted a net income of $4.7 million in the fourth quarter vs. $2.5 million last year.
Altera warns of flat sales in fourth quarter News & Analysis 11/29/2000 Post a comment SAN JOSE -- Altera Corp. here today announced that it is reducing its guidance for sequential revenue growth in the fourth quarter, ending Dec. 31. The programmable logic supplier said it now expects fourth-quarter revenues to be nearly flat with sales in the third quarter.
AMD prepares assault on workstation, server segments News & Analysis 11/29/2000 Post a comment SUNNYVALE, Calif. -- A year after successfully penetrating the consumer PC segment, Advanced Micro Devices Inc. isn't resting on its laurels. The company is now preparing products and technology to enter the workstation and low-end server market in the first half of 2001.
Silicon Wave claims first chip tuners for cable telephony and VoIP News & Analysis 11/29/2000 Post a comment LOS ANGELES--During the Western Cable Show here, Silicon Wave Inc. today claimed it was offering the world's first silicon tuner for cable telephony. The SiW1100 chip allows cable and network operators to compete with local exchange carriers in offering telephone services, according to the San Diego-based company.
Fairchild expects stronger growth in 2001 after current slowdown News & Analysis 11/29/2000 Post a comment SOUTH PORTLAND, Maine -- Fairchild Semiconductor International Inc. today reiterated its forecast of $490 million in sales during the current fourth-quarter period. Fairchild's guidance shows a 3% sequential gain in revenues from $476 million posted in the third-quarter period, which ended Oct. 1.
TI claims 30% market share in data-over-cable modem chips News & Analysis 11/29/2000 Post a comment HOUSTON -- Texas Instruments Inc. is predicting that it will ship nearly 3 million of the world's 10 million chips for data-over-cable services in 2000. Using market projections from Dataquest Inc., TI's digital signal processor division here said it expects to grab 30% of the market for DOCSIS integrated circuits in 2000, less than a year-and-a-half after the company entered the cable-modem chip business.
Agilent adds synthesizable ARM cores for communications, imaging ASICs News & Analysis 11/28/2000 Post a comment PALO ALTO, Calif. -- Agilent Technologies Inc. today announced it has licensed two synthesizable RISC cores from ARM Ltd. for integration into communications and imaging ASIC products. The ARM7TDMI-S and ARM946E-S are being delivered in software form--as "soft" vs. "hard" cores--which offers additional flexibility for ASIC designers, according to Agilent.
Broadcom to buy Israeli MPEG-2 encoder supplier for $777 million in stock News & Analysis 11/28/2000 Post a comment IRVINE, Calif.-- Still hot on the acquisition trail, Broadcom Corp. here today announced it will buy VisionTech Ltd., an Israeli supplier of digital video/audio compression and depression chips, for $777 million in stock. VisionTech's encoder chips are used in MPEG-2 applications for personal video recording, interactive videoconferencing, and Internet Protocol systems.
NEC-Hitachi DRAM venture plans $1.4 billion 300-mm fab in Japan News & Analysis 11/28/2000 Post a comment TOKYO -- Elpida Memory Inc.--the DRAM joint venture between NEC Corp. and Hitachi Ltd.--today announced plans to build a 300-mm wafer fab for volume production of 256-megabit memories using a 0.13-micron process. Construction on the fab in Hiroshima, Japan, will begin in January and the initial production is slated to start in the first half of 2002.
Intel, Analog Devices to detail DSP on Dec. 5 News & Analysis 11/27/2000 Post a comment SANTA CLARA, Calif. -- Analog Devices Inc. and Intel Corp. said today they will provide the first details of their joint DSP development effort on December 5.
Intel and ADI first announced their intent to co-develop a new DSP architecture in February 1999, and have since provide virtually no details of the project, code-named Frio.
Taiwan's Mosel Vitelic lowers profit and sales forecast for 2000 News & Analysis 11/27/2000 Post a comment HSINCHU, Taiwan -- Amid an apparent softening in the DRAM market, Taiwan's Mosel Vitelic Inc. late last week lowered its profits and sales forecasts by as much as 55% for 2000.
Mosel Vitelic, a provider of DRAMs, flash memories, LCD driver ICs, and foundry services, originally hoped to report a profit of $351.1 million on sales of $1.08 billion for 2000.
Now, the Taiwanese chip company has changed its forecast, saying it will report a profit of $157.9 million on sales of $847.1 million for the
Altera names Daane as new president and CEO News & Analysis 11/27/2000 Post a comment SAN JOSE -- Altera Corp. here today named John Daane, the former communications chip chief at LSI Logic Corp., as its new president and chief executive.
Daane replaces Rodney Smith, who announced his intention to retire late last year. Smith, who will remain chairman of Altera, said the San Jose-based supplier of programmable logic devices will not change its focus as a result of the management changes.
Altera uses redundancy to boost yields in high-density PLDs News & Analysis 11/27/2000 Post a comment SAN JOSE -- Altera Corp. here today announced a patented redundancy technique that has increased production yields on its high-density programmable logic devices by up to four times. Altera said its silicon foundry supplier--Taiwan Semiconductor Manufacturing Co. Ltd. (TSMC)--has used the technology to reduce defects in the company's APEX 20KE family.
Motorola to use new GaAs process for single-supply RF circuits News & Analysis 11/27/2000 Post a comment PHOENIX -- Motorola Inc.'s chip group here today reported qualification of what the company said was a true enhancement-mode (E-mode) heterostructure field-effect transistor process for gallium-arsenide circuits. Motorola said the GaAs process results in single-power supply devices with exceptional and cost effective performance in both linear transmitter and receiver circuits for low-power wireless applications.
Kawasaki, Sonicblue (formerly S3) back ComSilica for wireless LAN technology News & Analysis 11/27/2000 Post a comment MAKUHARI, Japan -- Kawasaki Steel Corp. and Sonicblue Inc.--formerly known as S3 Inc.--announced a joint investment in ComSilica Inc., a Berkeley, Calif.-based startup focused on broadband wireless technology for the IEEE 802.11a standard. Both Kawasaki Steel and Sonicblue said they hoped to use technology from ComSilica to offer new products for next-generation wireless local area networks.
Hyundai to speed up spinoff of electronics unit News & Analysis 11/27/2000 Post a comment Hyundai Electronics Industries Co. (HEI) disclosed in Korea over the holiday weekend that the unit will speed up its planned spinoff from the parent chaebol and will seek to raise $3 billion in new loans and securities and asset sales in 2001.
PMC-Sierra enters 3G infrastructure arena with DSP for power amplifiers News & Analysis 11/27/2000 Post a comment BURNABY, British Columbia -- PMC-Sierra Inc today announced its entry into the wireless-infrastructure chip market with the launch of a new series of digital signal processor ICs aimed at power amplifier architectures for third-generation wireless networks. The company said the PM7800 Palandin-10 chip allows traffic over all major digital 3G standards to be transmitted through new digitally-controlled power amplifier architectures.
TDK teams up for transformer-less modem News & Analysis 11/26/2000 Post a comment To reduce the amount of space taken up in settop boxes, TDK Semiconductor has designed a low-speed single-chip modem that connects directly to a transformer-less data access arrangement (DAA) interface.
Infineon inks $1 billion global distribution pact with Avnet, sets sales targets News & Analysis 11/22/2000 Post a comment MUNICH -- In a major move to reorganize its sales activities, Infineon Technologies AG here announced its first worldwide semiconductor distribution agreement with Avent Inc. The deal is expected to be worth at least $1 billion over the next three years, and it will play a key role in Infineon's goal of reducing direct sales accounts from 2,000 to about 300.
Fujitsu creates 30-GHz BiCMOS for integrated RF circuits News & Analysis 11/21/2000 Post a comment MUNICH -- Fujitsu Ltd.'s Microelectronics Europe GmbH subsidiary today announced the development of a 30-GHz BiCMOS process for mobile communications and wireless applications. The new process, called UESBIC4, will be used to produce Fujitsu's MB15H series of radio-frequency large-scale integrated devices with double the performance of previously available BiCMOS ICs, said the company.
German chip market will grow 19.9% in 2001, says trade group News & Analysis 11/21/2000 Post a comment MUNICH -- The German market for semiconductors will grow 41.8% to 11.71 billion euros ($9.95 billion) in 2000 compared to 8.26 billion euros ($7.02 billion) last year, according to a new market forecast released today by the ZVEI electronics trade group. ZVEI also predicted that chip revenues in Germany would grow 19.9% in 2001, reaching 14.04 billion euros ($11.93 billion).
Xilinx dives into DSP waters with new FPGA initiative News & Analysis 11/20/2000 Post a comment MUNICH ( ChipWire) -- Xilinx Inc. will give a new twist to the market for digital signal processors when it rolls out its FPGA-based XtremeDSP initiative at the biennial Electronica exhibition here this week. Chief executive officer Wim Roelandts said the company's plan to pack up to 192 multiplier units as hard cores in its Virtex-II chips could create a device with a theoretical performance of more than 100 times that of leading DSP cor
Micron samples 256-Mbit DDR SDRAM News & Analysis 11/20/2000 Post a comment Micron Technology Inc. today said it is sampling a 256-megabit, 266-MHz double-data-rate SDRAM, which will enter production early next year when PC makers ramp up their use of DDR.
Xicor names chip veterans from Cypress, Linear to run company News & Analysis 11/17/2000 Post a comment MILPITAS, Calif. -- Xicor Inc. late today named Louis DiNardo, a long-time chip veteran from Linear Technology Inc., as president and chief executive. A former vice president of marketing at Linear, DiNardo replaces Bruce Gray, the acting president of Xicor, who stepped down earlier this year.
In a related move, Daniel McCranie has been elected chairman of Xicor, succeeding Raphael Klein. McCranie is currently vice president of business development at Cypress Semiconductor Inc.
Rambus may drag Intel's ramp of Pentium 4 News & Analysis 11/17/2000 Post a comment SANTA CLARA, Calif. ( ChipWire) -- Intel Corp. will officially roll out its Pentium 4 processor on Monday, promising the device will have the steepest sales ramp of any microprocessor in its history. But at least for its first six months, the chip will be tied solely to the controversial Rambus memory architecture, a fact that several analysts and at least one DRAM maker said looms as a question mark over the lofty ambitions of the world'
Micron shifts gears on DDR chip set News & Analysis 11/17/2000 Post a comment BOISE, Idaho -- Micron Technology Inc. is ready to drop production plans for its Samurai chip set for double data rate (DDR) memories. The chip set function has been morphed into at least two new embedded DRAM integrated graphics versions.
Cisco insists Radiata purchase won't stop use of Intersil chips News & Analysis 11/17/2000 Post a comment SAN JOSE -- Cisco Systems Inc.'s recent move to acquire wireless-chip maker Radiata Inc. could put Cisco's chip relationship with Intersil Corp. in limbo, according to industry observers and analysts. But officials at Cisco here this week insisted it would still maintain its chip ties to Intersil in the wireless local-area networking (WLAN) market--at least for its current generation of products.
What are the engineering and design challenges in creating successful IoT devices? These devices are usually small, resource-constrained electronics designed to sense, collect, send, and/or interpret data. Some of the devices need to be smart enough to act upon data in real time, 24/7. Specifically the guests will discuss sensors, security, and lessons from IoT deployments.