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Content tagged with Semiconductors posted in December 2000
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Pixelworks buying Panstera to expand chip offering for XGA LCDs
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12/14/2000   Post a comment
UALATIN, Ore.--Pixelworks Inc. here announced it will acquire privately-held Panstera Inc., a San Jose-based supplier of system-on-chip ICs for advanced displays. The acquisition, to be made with $127.4 million in stock, is aimed at expanding Pixelwork's mixed-signal device technology for high-volume, XGA-resolution liquid crystal displays (LCDs).
Trench-wall transistor DRAM moves to adoption, say IBM, Infineon researchers
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12/14/2000   Post a comment
SAN FRANCISCO -- Vertical transistors -- those that work perpendicular to the surface of a semiconductor chip -- could be used commercially in DRAM memory cells within two years, according to a paper presented at this week's International Electron Devices Meeting (IEDM).
Agere, Caltech researchers say aerosol fab step protects flash bits
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12/14/2000   Post a comment
SAN FRANCISCO---At the International Electron Devices Meeting here this week, researchers from Agere Systems Inc.--formerly known as Lucent Microelectronics--and the California Institute of Technology disclosed development of an aerosol fabrication technique that protects stored data in flash memory as cells are shrunk with next-generation processes.
Motorola plans ARM-based DragonBall processors
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12/14/2000   Post a comment
AUSTIN, Tex. -- A week after announcing a licensing agreement with ARM Ltd., Motorola Inc.'s Semiconductor Products Sector (SPS) revealed it plans to add an ARM-based version of its DragonBall, a processor currently used in the Palm Pilot line of personal digital assistants.
Silicon Image says Q4 revenues will be much lower than expected
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12/13/2000   Post a comment
Silicon Image, Inc., Sunnyvale, Calif., today announced that it expects fourth-quarter revenue to be 8-10% lower than the $14.5 million in revenue for the quarter ended September 30, 2000. The company had previously stated that it expected fourth-quarter revenue to grow sequentially in the ten to low teens percentage.
NEC licenses RISC core from ARM
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12/13/2000   Post a comment
TOKYO -- Japan's NEC Corp. here today announced that it has become the latest chip maker to license ARM Ltd.'s 32-bit RISC microprocessor core. Under the terms, NEC has licensed ARM's ARM946E-S family of products. NEC intends to use ARM's RISC core for use in third-generation wireless handsets and other products.
STMicro revamps cell-phone chip strategy after TI bought partner
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12/13/2000   Post a comment
SEDONA, Ariz. -- STMicroelectronics is quietly revamping its cellular-phone chip set strategy after its key technology partner was acquired last summer by one of the company's main competitors--Texas Instruments Inc.
Lucent files registration statement for Agere IPO
Product News  
12/12/2000   Post a comment
Lucent Technologies has filed a registration statement with the Securities and Exchange Commission for the initial public stock offering of Agere Systems, which comprises Lucent's microelectronics business.
SanDisk prepares to ship its first NAND flash chips
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12/12/2000   Post a comment
SUNNYVALE, Calif.--SanDisk Corp. today said it will significantly broaden its flash product line with the introduction of high-density memory NAND-based chips for cellular phones, Internet music players, handheld computers and fast-growing consumer electronics products.
Actel expects flat sales in quarter after bookings slowdown
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12/12/2000   Post a comment
SUNNYVALE, Calif. -- Actel Corp. became the latest chip maker to reduce its revenue forecast for the fourth quarter. The company cited lower-than-expected "turns" in bookings during the first two weeks of December.
ST Micro execs see chip market driven by "e-society"
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12/12/2000   Post a comment
Sedona, Ariz. -- The dawning of an "e-society" -- one in which mobile consumer electronics, smart cards, and high-speed networking are pervasive -- is creating opportunities for new leaders to emerge in the semiconductor arena, according to executives here at STMicroelectronics Inc.'s SOC - The Big Picture conference.
Electronic components predicted to lead U.S. economy in 2001
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12/12/2000   Post a comment
The electronic components and equipment market is expected to continue leading the U.S. economy in 2001, defying a generally pessimistic outlook for the first half of the year, according to a recent survey by the National Association of Purchasing Management (NAPM).
STMicro expects to hit its Q4 numbers despite slowdown at other companies
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12/12/2000   Post a comment
SEDONA, Ariz. -- Don't expect any financial surprises from STMicroelectronics Inc.--at least for now. While many chip makers are lowering their forecasts for the fourth quarter of 2000, officials with STMicroelectronics said the European semiconductor supplier it is still on track to hit its numbers in the three-month period, ending Dec. 31.
TSMC ships 0.13-micron wafers with new Cyrix MPUs to Via
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12/12/2000   Post a comment
HSINCHU, Taiwan -- Taiwan Semiconductor Manufacturing Co. here today announced delivery of processed wafers with functioning 0.13-micron microprocessors to foundry customer Via Technologies Inc. According to TSMC, these microprocessor wafers are the foundry industry's first 0.13-micron products to be shipped to a customer.
MoSys works with Lucent to apply 1T-SRAM to communication ICs
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12/11/2000   Post a comment
SUNNYVALE, Calif.--MoSys Inc. today announced that its single-transistor SRAM cell technology is being validated for CMOS logic processes by Lucent Technologies Inc.'s Microelectronics Group--which is being renamed Agere Systems as part of a spin-off plan (see Dec. 5 story).
DSP tries to bridge the gap
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12/11/2000   Post a comment
Analog Devices and Intel have decided to use pipelining and design techniques from embedded microprocessors for a digital signal processor (DSP) that attempts to do the job of both types of architecture. The initial dual-multiplier design is expected to scale as new versions are developed.
Intel's tiny transistors
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12/11/2000   Post a comment
Intel has developed what it claims are the world's smallest and fastest working transistors.
Anadigics chops Q4 results estimate, but sees rebound in 2001
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12/11/2000   Post a comment
WARREN, N.J.--Anadigics Inc. today warned investors of lower-than-expected financial results in the fourth quarter due to inventory adjustments by communications systems makers and a slow production ramp of the company's new heterojunction bipolar transistor (HBT) power amplifier products. After a slowdown in sales, Anadigics said it expects a resumption of strong growth in the second half of 2001.
Intel develops 0.07-micron transistor for 10-GHz processors by 2005
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12/11/2000   Post a comment
SAN FRANCISCO -- Providing a sneak preview of its future technology roadmap, Intel Corp. here today will announce development of the world's fastest transistor--a building block device that will enable the company to build 10-GHz microprocessors by 2005.
Microtune expands all-silicon RF arsenal with upstream cable amplifier chip
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12/11/2000   Post a comment
PLANO, Tex. -- Dallas area startup Microtune Inc. is adding a upstream amplifier IC to its single-chip TV tuner to deliver what the company says is the first all-silicon, two-way RF "gateway" for interactive applications over cable networks. The MicroStream MY1530 chip provides programmable amplification of return signals that are transmitted from cable network devices--such as set-top boxes and modems--in interactive applications. The BiCMOS chip is the first upstream amplifier IC to support bo
Threat of recession grows more real for semiconductor industry
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12/8/2000   Post a comment
The latest spate of earnings warnings, led notably this week by semiconductor bellwethers Intel Corp. and Motorola Inc., has erased any lingering hope that the chip sector's inventory overload is affecting only isolated industry pockets.
Peregrine believes SOS-based CMOS is now ready for mainstream
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12/8/2000   Post a comment
SAN DIEGO -- Having been labeled a developer of exotic technology for niche markets, wireless-chip specialist Peregrine Semiconductor Corp. is looking to break out in 2001. The San Diego supplier of chips based on a silicon-on-sapphire (SOS) CMOS process is beginning to leverage its technology into more mainstream markets, such as wireless broadband equipment, base stations, and, of course, handsets.
Nikon, Canon, Toshiba back direct write e-beam for 0.1-micron SoC production
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12/8/2000   Post a comment
TOKYO -- Direct write electron-beam lithography was endorsed at this week's Semicon Japan trade show here as potentially "the only affordable solution" for production of next-generation 0.1-micron system-on-a-chip (SoC) designs. Japanese lithography leaders Nikon Corp. and Canon along with Toshiba Corp. separately proposed direct write e-beam systems under development to pattern very complex SoC integrated circuits. Panelists at a lithography technical session on Thursday here said the slower th
IBM shows Bluetooth-enabled jewelry, gadgets
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12/8/2000   Post a comment
SAN JOSE -- As chip and system vendors huddled over first-generation commercial products at this week's Bluetooth Developers Conference, researchers from IBM Corp. unveiled their long-term vision of how Bluetooth and other wireless technologies may transform users' involvement with computers.
IXYS sues IR in Germany for infringement of power patents
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12/8/2000   Post a comment
SANTA CLARA, Calif.--Power semiconductor supplier IXYS Corp. here said its German subsidiary has filed a patent infringement suit against International Rectifier Corp. in the country court of Mannheim, Germany. The suit alleges that IR is infringing on at least two of IXYS's German patents for integrating power module technology.
Rambus patent suit against Infineon delayed in Germany
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12/7/2000   Post a comment
MOUNTAIN VIEW, Calif.--Rambus Inc. today announced a five-month delay in the start of its patent lawsuit in Germany against Infineon Technologies AG, which is accused of infringing on technology in synchronous DRAMs, double data rate (DDR) memories and controllers interfacing those chips.
Galileo to support DDR SDRAM, not Rambus in next-generation communications ICs
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12/6/2000   Post a comment
SAN JOSE -- Galileo Technology Ltd., the leading supplier of system controllers for networking equipment, has no plans to develop products that supports Rambus Inc.'s high-speed memory-interface technology. Instead, Galileo will focus its efforts on developing system controllers that will support SDRAMs, and later, double-data-rate (DDR) SDRAMs, according to officials from the San Jose-based supplier of communications chips.
NEC to ramp U.S. 300-mm fab in 2003, says executive
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12/6/2000   Post a comment
TOKYO -- NEC Corp. plans to build its first wholly-owned 300-mm wafer fab in Roseville, Calif., with initial production slated to start in late 2003, said Keiichi Shimakura, deputy president and head of NEC Electron Devices.
ISSI bucks trend by increasing quarterly revenue forecast
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12/5/2000   Post a comment
Bucking a recent trend among semiconductor companies, Integrated Silicon Solution, Inc. said today that it is increasing its revenue guidance for the quarter ending December 31, 2000.
Motorola to expand R&D activities in Germany
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12/5/2000   Post a comment
Motorola Semiconductor Products Sector and Fraunhofer-Gesellschaft for the Advance of Applied Research e.V. have signed an agreement to establish a framework for joint research and development projects over several years.
Lucent chip spinoff to be called Agere Systems
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12/5/2000   Post a comment
Lucent Technologies has named its Microelectronics Group Agere Systems, which will be spun off next year.
International Rectifier acquires analog-chip maker Unisem for $50 million
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12/5/2000   Post a comment
EL SEGUNDO, Calif. -- In a move to expand its analog-chip business, International Rectifier Corp. here today announced that it has acquired Unisem Inc. for about $50 million in cash. Based in Irvine, Calif., Unisem is a supplier of analog ICs for power-management applications in portable equipment, networking systems, and other products.
Atmel enters three-year deal to make space ICs for European satellites
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12/5/2000   Post a comment
NANTES, France--Atmel Corp. today announced a three-year pact to develop next-generation ICs for space applications with the European Space Agency (ESA) and the French Centre National d'Etudes Spatiales (CNES). The agreement is aimed at ensuring that radiation hardened ICs will be available in Europe for future satellite systems.
Infineon plans 300-mm wafer-level packaging of DRAMs with FormFactor's MicroSpring
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12/5/2000   Post a comment
LIVERMORE, Calif.--FormFactor Inc. today announced its has licensed its MicroSpring contact technology for chip testing and wafer-level packaging to Infineon Technologies AG, which has also agreed to invest $5 million in the Livermore-based startup. Munich-based Infineon said it plans to use the MicroSpring technology to simplify backend testing and assembly of DRAMs from 300-mm diameter wafers.
Altera disputes Xilinx's ITC case aimed at barring products in U.S.
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12/5/2000   Post a comment
SAN JOSE -- In an ongoing battle over patent rights, Altera Corp. here today disputed a new complaint filed by rival Xilinx Inc. before the U.S. International Trade Commission (ITC). Xilinx on Monday announced it was attempting to bar the import of Altera's Flex, Apex and Acex products in a new case filed before the commission (see Dec. 4 story).
SST to acquire Agate for multi-bit flash cell capability
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12/5/2000   Post a comment
SUNNYVALE, Calif.--Silicon Storage Technology Inc. here today announced plans to acquire full ownership of Agate Semiconductor Inc., a Santa Clara, Calif.-based memory design house specializing in multi-bit flash storage technology. Agate was launched in 1996 with a capital infusion primarily from SST, which currently owns more than 50% equity interest in the four-year-old startup.
Ramtron seeks embedded role for ferroelectric memory
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12/4/2000   Post a comment
LONDON ( ChipWire) -- U.S.-based Ramtron International Corp., a ferroelectric-memory specialist, is conceding the non-volatile standard memory ground to flash. In the face of the advancing flash densities that rival DRAMs', and despite its efforts to develop a cell structure that its claims will support megabit densities, Ramtron has decided its own best chance for success lies in combining its non-volatile ferroelectric-memory cell with
Motorola readies ColdFire MPU for low-cost applications
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12/4/2000   Post a comment
AUSTIN, Tex. ( ChipWire) -- Motorola Inc.'s Semiconductor Products Sector has created a ColdFire-based standard device aimed at markets needing Ethernet or Universal Serial Bus connectivity at low cost.
Motorola licenses 32-bit RISC processor line from ARM
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12/4/2000   Post a comment
AUSTIN, Tex. -- In a move to expand its product portfolio, Motorola Inc. here today became the latest company to license ARM Ltd.'s family of RISC microprocessors for embedded applications. Under terms of the agreement, Motorola plans to introduce a family of chips based on ARM's 32-bit RISC architecture. These solutions are expect to be introduced over the next 12 months and will include chipsets, software, development tools, and reference platforms.
Chartered teams with Lucent to decide if 300-mm makes sense
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12/4/2000   Post a comment
DALLAS -- While major DRAM makers and other silicon foundry suppliers gear up for production on 300-mm wafers, Singapore's Chartered Semiconductor Manufacturing Pte. Ltd. is still weighing the economics of those large-diameter substrates for communications ICs and system-on-chip applications, said company managers during a visit here.
Simple beefs up patent suit
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12/3/2000   Post a comment
Having been awarded an additional patent on chip stack packaging technology, Simple Technology is taking aim at other companies which have moved into the 3D packaging market.
Hyundai has 300-mm option for Wales fab if it finds no buyer
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12/2/2000   Post a comment
SEOUL -- Hyundai Electronics Industries Co. Ltd. is trying to sell its wafer fab building in Wales, but if it can't, the company will retain the site as a "backup" site for its second 300-mm wafer fab in 2004, said Hyundai's top semiconductor manager in an interview here on Saturday.
Hyundai has 300-mm option for Wales fab if it finds no buyer
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12/2/2000   Post a comment
Hyundai Electronics Industries Co. has been trying to sell its fab shell in Wales, but if it can't, the Korean chip maker will retain the site "as a backup to complete in 2004 as our second 300-mm wafer fab," according to top Hyundai manager.
Catalyst expands line of serial EEPROMs for SPI bus
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12/1/2000   Post a comment
SUNNYVALE, Calif. -- Catalyst Semiconductor Inc. today unveiled three additions to the company's recently announced Motorola SPI bus-compatible serial EEPROM family. The new products, which provide 16K density, have 10-MHz operating speed and operating voltages as low as 1.8 volts, the Sunnyvale, Calif., company said. Catalyst's SPI bus serial EEPROMs target high speed, low voltage, energy and space sensitive applications including cellular and Internet capable (WAP) telephones, PDAs and pager
ADI-Intel DSP core appears ready for prime time
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12/1/2000   Post a comment
SANTA CLARA, Calif. -- The formal debut next week of a jointly developed architecture from Analog Devices Inc. and Intel Corp. appears destined to change the digital signal processor (DSP) landscape. To what extent, however, will depend on how quickly the companies can begin shipping silicon, according to industry observers. Some 22 months after announcing their intention to develop the architecture, code-named Frio, Analog Devices and Intel are expected to provide limited details of the core
ADI-Intel DSP core appears ready for prime time
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12/1/2000   Post a comment
Some 22 months after announcing their intention to develop the architecture, code-named Frio, Analog Devices and Intel are expected to provide limited details of the core at a press conference scheduled for Tuesday in New York. It is known that Frio will be a key component in Intel's effort to establish itself as a player in the market for handheld information appliances, specifically for 3G cellular handsets. But how the project's principals will work and compete with each other is still open t
Broadcom strengthens position in home networking with VisionTech buy
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12/1/2000   Post a comment
Already a top player in WAN and LAN devices via its $5 billion-plus acquisition spree, Broadcom Corp. is fortifying its position in home-networking chips by purchasing MPEG-2 leader VisionTech Ltd. for $777 million in stock. VisionTech offers MPEG-2 video- and audio-encoder chips for personal video recording, which enables instant replay or rewinding of live TV programs.
Catalyst expands line of serial EEPROMs for SPI bus
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12/1/2000   Post a comment
Catalyst Semiconductor Inc. today unveiled three additions to the company's recently announced Motorola SPI bus-compatible serial EEPROM family. The new products, which provide 16K density, have 10-MHz operating speed and operating voltages as low as 1.8 volts, the Sunnyvale, Calif., company said.
ISS offers shrink-wrapped cores for speech coding applications
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12/1/2000   Post a comment
SAN JOSE-- Intellectual property (IP) core developer Integrated Silicon Systems Ltd. today announced availability of a series of off-the-shelf design blocks for adaptive differential pulse code modulation (ADPCM) speech coding.
Taiwan's Nanya still bullish on DRAM demand, plans 300-mm fab
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12/1/2000   Post a comment
SAN JOSE -- Taiwan DRAM maker Nanya Technology Corp. plans to begin construction of its 300-mm wafer fab building in April, around the same time its second 200-mm plant has ramped volume production to 25,000 wafers per month, said Ken Hurley, president of the company's North American operations. These aggressive plans come at a tricky time, when DRAM pricing and the marketplace are getting clobbered by inventory dumping and slower-than-expected memory growth, but Hurley believes conditions will
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