Logic goes straight on power chip News & Analysis 12/1/2000 Post a comment US-based Power semiconductor company Ixys has been awarded a patent in the US for a technology that will let it put logic chips directly on to high-power semiconductors.
IP core handles soft errors News & Analysis 12/1/2000 Post a comment Iroc Technologies has developed what it reckons is the first intellectual property (IP) core to handle soft errors caused by alpha radiation.
Temperature pushed to 250° on memory News & Analysis 12/1/2000 Post a comment Researchers at the Fraunhofer Institute for Microelectronics Circuits (Fraunhofer-IMS) in Germany have developed a CMOS chip capable of operating in temperatures up to 250°C. Conventional circuits fail at about 125°C.
What are the engineering and design challenges in creating successful IoT devices? These devices are usually small, resource-constrained electronics designed to sense, collect, send, and/or interpret data. Some of the devices need to be smart enough to act upon data in real time, 24/7. Are the design challenges the same as with embedded systems, but with a little developer- and IT-skills added in? What do engineers need to know? Rick Merritt talks with two experts about the tools and best options for designing IoT devices in 2016. Specifically the guests will discuss sensors, security, and lessons from IoT deployments.