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Tessera says new package cuts cost, size of DDR-based memory boards
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12/5/2001   Post a comment
TOKYO -- Tessera Technologies Inc. today announced a ball-grid array (BGA) chip-scale package for double data rate (DDR) SDRAMs, which the company said significantly reduces the cost and size of memory boards compared to other packaging options.
ChipPAC develops four- and five-die stacking packages for wireless systems
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12/5/2001   Post a comment
FREMONT, Calif. -- ChipPAC Inc. today announced qualification of 1.2-mm thick same-die-stacked packages, which are expected to be used in next-generation cell phones to include memory for Internet applications and advanced graphics functions.
NEC describes full-metal process for embedded DRAM
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12/5/2001   Post a comment
NEC Electron Devices has unveiled a 0.13-micron full-metal DRAM process technology that can build 450-MHz embedded DRAM circuitry running at 1.2 volts.
QWI post-growth processing is 'way forward' for photonic ICs
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12/5/2001   Post a comment
Post-growth processing using quantum well intermixing is the fabrication method the industry has been looking for to make photonic ICs, according to researchers from Canada's Sherbrooke University.
Intel launches integrated chip series aimed at embedded communications
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12/4/2001   Post a comment
SANTA CLARA, Calif.--Intel Corp. today announced a new series of chips designed specifically for embedded communications with integrated multiple ports, which the company said will eliminate the need for separate networking ICs in systems.
Fairchild plans packaging/test plant in China to balance outsourced assembly
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12/4/2001   Post a comment
SOUTH PORTLAND, Maine--Fairchild Semiconductor International Inc. today announced plans to build a new manufacturing and warehouse facility in China to expand its internal chip-assembly and testing capabilities. Over the next five years, the total investment will be about $200 million, said Fairchild.
U.S. startup Matrix and TSMC announce 3-D semiconductor technology
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12/4/2001   Post a comment
SANTA CLARA, Calif.-- Three-year-old Matrix Semiconductor Inc. here today announced a three-dimensional chip technology, which the company said is a fundamental breakthrough in making it possible to build devices in the vertical dimension for greater integration and lower cost in ICs.
Chip sales up 2.5%, prices rebounding, says SIA
News & Analysis  
12/4/2001   Post a comment
Chip sales rose 2.5% sequentially to $10.4bn in October according to the latest figures from the Semiconductor Industry Association.
TI says floating-point DSP becomes first to handle 1,350 MFLOPS
News & Analysis  
12/3/2001   Post a comment
HOUSTON -- Texas Instruments Inc. today said it has become the first chip maker to offer a programmable digital signal processor capable of executing 1,350 million floating-point operations per second (MFLOPS) at a clock frequency of 225 MHz.
Motorola aims hybrid DSP/controller series at low-cost embedded Internet access
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12/3/2001   Post a comment
PHOENIX -- Motorola Inc. today announced a new series of Internet-access controllers, based on a hybrid 16-bit DSP/microcontroller core that eliminates the need for separate processing blocks to handle digital signal processing algorithms and control functions.
Hynix and Micron admit to talks on memory deals
News & Analysis  
12/3/2001   Post a comment
Hynix Semiconductor and Micron Technology have said they have begun exploratory talks about an alliance or some "other transaction".
Micron, Hynix discuss possible collaboration, merger
News & Analysis  
12/3/2001   Post a comment
ust weeks after Micron Technology Inc. threatened Hynix Semiconductor with dumping charges, the two companies said they are talking about a strategic collaboration that both sides concede could involve Micron investing in its ailing Korean nemesis.
Atmel supports Micron's SyncFlash memories as alternate source
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12/3/2001   Post a comment
SAN JOSE -- Atmel Corp. here today announced it will support Micron Technology Inc.'s SyncFlash interface for nonvolatile flash memories connected to synchronous DRAM buses. Atmel and Micron said they have signed an alternate sourcing pact and partnership to promote SyncFlash memories as part of a new alliance.
Standard Microsystems drops PC chip sets, cuts 55 jobs, but sees growth
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12/3/2001   Post a comment
HAUPPAUGE, N.Y.--Standard Microsystems Corp. today announced it was pulling out of the PC chip set business to increase its focus on other core technologies for a higher return on investments. The company also said it has eliminated 55 jobs, or 11% of its workforce, as part of new cost-cutting efforts.
Micron, Hynix in talks for potential alliance or 'other transaction'
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12/3/2001   Post a comment
SEOUL -- Dynamic RAM rivals Hynix Semiconductor Inc. here and Micron Technology Inc. in Boise, Idaho, today announced they have agreed to hold preliminary discussions to explore a possible strategic alliance or "other transaction" as both memory makers attempt to remain competitive in the current semiconductor downturn.
Floating DSPs port boosted to 0.12µm with copper interconnect
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12/3/2001   Post a comment
Texas Instruments has boosted the top speed of its high-end floating-point DSPs through its 0.12µm process with copper interconnect.
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