Xilinx ships industry's largest 65-nm FPGA Product News 12/29/2006 Post a comment Xilinx started to ship the LX330, a 65-nm FPGA that is said to deliver 65% more logic than the largest 90-nm device. Xilinx fab partners UMC and Toshiba have quickly ramped 65-nm production, producing excellent yields that have enabled the chip vendor to deliver the complete 65-nm Virtex-5 LX platform on time and over one year ahead of its competition.
Dual-slot, hot swap controller simplifies PCI Express connection Product News 12/29/2006 Post a comment Linear Technology's LTC4242, a narrow, dual-slot PCI Express hot swap controller for mid-range networking or storage servers and embedded applications, eliminates complex software interfaces, yet provides a rugged and compact solution for independently controlling the main supplies and the auxiliary supply on two slots.
Hedge fund urges Cypress to reorg, go private News & Analysis 12/28/2006 Post a comment Los Angeles-based hedge fund Chapman Capital has written a letter to the board of directors of Cypress Semiconductor urging the company to reorganize itself and become a private company through leveraged buyout.
Intel ordered to produce evidence News & Analysis 12/28/2006 Post a comment A U.S. District Court in Delaware has ordered Intel to produce documents and other evidence related to its business conduct outside of the U.S., according to a statement issued by Advanced Micro Devices.
Analyst: Back-end memory testing could tighten in '07 News & Analysis 12/28/2006 Post a comment The back-end memory testing industry may become tighter in the second half of 2007, as memory packaging and testing companies struggle to keep pace with a changing and rapidly growing market, according to a report by market researcher DRAMeXchange.
Report: Powerchip denies selling fab to Vanguard News & Analysis 12/28/2006 Post a comment Taiwan's Powerchip Semiconductor said in a filing to the Taiwan Stock Exchange that reports that it is planning to sell its eight-inch-wafer plant to Vanguard International Semiconductor are pure speculation, according to a Forbes.com report.
Samsung unveils 1-Gbit mobile DRAM Product News 12/27/2006 Post a comment Samsung Electronics said it has developed the industry's first one gigabit mobile DRAM for mobile products, using 80-nm process technology. It will be available in second quarter 2007.
TSMC, UMC undamaged by quakes, according to report News & Analysis 12/26/2006 Post a comment The world's two largest semiconductor foundries -- Taiwan Semiconductor Manufacturing Co. (TSMC) and United Microelectronics Corp. (UMC) -- reported no damage from a pair of major earthquakes that struck southern Taiwan, according to a report.
Renesas to collaborate with PSC for China market News & Analysis 12/26/2006 Post a comment TOKYO — Renesas Technology Corp. will participate in a Powerchip Semiconductor Corp. (PSC) subsidiary to reinforce software development and support for Chinese consumer electronics market.
Renesas and PSC have agreed that Renesas will jointly manage Retronix Technologies Inc. (RTX), currently a wholly owned subsidiary of PSC which is specialized in system solutions.
Hurt by Intel, AMD cuts MPU prices News & Analysis 12/22/2006 Post a comment SAN JOSE, Calif. — Hurt by competitive pressures from Intel Corp. and other factors, Advanced Micro Devices Inc. (AMD) has cut its product prices in the channels and offered favorable terms to others, according to an analyst.
''We believe AMD is experiencing a challenging Q4'06 from both a demand and a product mix stand point,'' said analyst Doug Freedman of American Technology Research Inc., in a report.
''Intel's new products are having an impact as they ramp Core 2 supply, enabling t
5-amp LDO powers ultralow-voltage DSPs, ASICs Product News 12/22/2006 Post a comment Micrel's MIC69502 is a 5-amp low-voltage, low-dropout (LDO) regulator suited for FPGAs, microcontrollers and logic ICs in next generation optical networks, communication switches, storage networks, wireless base stations, and home entertainment systems.
Analyst: Femtocells to challenge Wi-Fi cellphones News & Analysis 12/22/2006 Post a comment Market research group Strategy Analytics has given chip design group picoChip an early Christmas present, suggesting low cost femtocells using its designs could emerge as a strong contender for Voice over IP services over Wi-Fi.
NXP guides to a weaker Q4 as semi cycle softens News & Analysis 12/22/2006 Post a comment LONDON — The board of directors of NXP BV, formerly Philips Semiconductor, said the company's fourth quarter results would be weaker than normal seasonality would suggest due to a softening of the semiconductor business cycle.
Samsung Semi president faces jail in DRAM probe News & Analysis 12/21/2006 Post a comment The president of Samsung Semiconductor, the U.S. subsidiary of Samsung Electronics, has agreed to plead guilty, serve 10 months in prison and pay a $250,000 fine in connection with an ongoing U.S. Justice Department investigation into DRAM price fixing in 2001 and 2002.
NXP makes slim profit in first 9 months of 2006 News & Analysis 12/21/2006 Post a comment LONDON — NXP BV, formerly Philips Semiconductors, said it made a net profit of 2 million euro (about $2.6 million) on total sales of 3.77 billion euro (about $4.97 billion) in the first nine months of 2006.
Total sales in the nine months ended Sept. 28, 2006, increased 10.6 percent compared to the same period in 2005 although this was partly due to foreign currency effects.
ADI sues Silicon Labs for patent infringement News & Analysis 12/21/2006 Post a comment Analog Devices filed a patent infringement suit against Silicon Laboratories in U.S. District Court in Boston. ADI alleges that Silicon Labs' Si84xx family of products infringe multiple U.S. patents addressing physical construction and signaling techniques related to ADI's iCoupler digital isolation products.
Comparators top list of top 10 IC growth products News & Analysis 12/20/2006 Post a comment Comparators, chips used to measure two different voltages, will be the fastest growing semiconductor product segment in 2006, with projected growth of 37 percent, according to estimates by market research analyst firm IC Insights.
1.8-V UARTs housed in tiny packaging for portables Product News 12/20/2006 Post a comment For portable devices that need to interface with Bluetooth EDR and wireless modems, NXP has launched a 1.8-V UART line that can support data rates as fast as 5-Mbits/s and meet the small form factor requirements of these applications thanks to their TFBGA packaging measuring just 3.5-mm x 3.5-mm.
Interface chips support updated HDMI v1.3 standard Product News 12/20/2006 Post a comment Analog Devices has expanded its line of HDMI interface chips with multiplexers, receivers and transmitters that support the updated HDMI v1.3 standard. The latest additions to ADI's line address growing consumer demand for high-definition content in multimedia products ranging from 1080p deep-color HDTVs to low-power portable applications, including digital video and still cameras, portable media players and cell phones.
Gas gauge chipset advances Li-ion battery protection Product News 12/19/2006 Post a comment Texas Instruments' bq20z90 advanced Impedance Track gas gauge chip for multicell, lithium-based battery packs, for use with the company's bq29330 analog front end (AFE) battery protection IC, uses one-third fewer components than its predecessor.
eBay taps FreeFlow for private auction services News & Analysis 12/19/2006 Post a comment In a deal that could bring online auctions into the mainstream among electronics multinationals, eBay Inc., the biggest name in online auctions, has teamed up with FreeFlow, an Intenet-auction service provider that has, until now, focused in the high-tech sector.
What are the engineering and design challenges in creating successful IoT devices? These devices are usually small, resource-constrained electronics designed to sense, collect, send, and/or interpret data. Some of the devices need to be smart enough to act upon data in real time, 24/7. Specifically the guests will discuss sensors, security, and lessons from IoT deployments.