Chip sales to hit $400B in 2011 News & Analysis 12/16/2006 Post a comment SHANGHAI, China — The semiconductor market will top a dizzying $400 billion in 2011, according to a recent report by IC Insights. From now till then, the annual growth will stay just the right side of respectable, maintaining double-digit average increases of 10.1 percent.
Along the way, IC Insights believes the $300 billion mile marker will be reached in 2008, eight years after the industry passed $200 billion.
Startup tunes .11n for short-range HDTV video Product News 12/15/2006 Post a comment Startup Amimon Inc. will demonstrate at the Consumer Electronics Show a prototype of its wireless high definition interface for HDTV video, using technology based on a variation of 802.11n that can deliver up to 1.5 Gbits/second.
Macronix tapping SONOS for next-gen flash News & Analysis 12/15/2006 Post a comment Next year, Macronix International will introduce a 2Gbit flash test chip based on its new BE-SONOS, which will help flash move beyond the barriers faced by today's floating gate technology when it scales below the 45 nanometer node.
DRAM party winding down, Gartner says News & Analysis 12/14/2006 Post a comment The DRAM segment is at the tail end of its most successful period in years, but the party will start to wind down in 2007, according to market research firm Gartner. The firm projects DRAM revenue growth willslow to 15 percent next year, with revenue peaking in 2008.
Single-chip comprises THD analyzer Product News 12/14/2006 Post a comment Build your own test gear. Specialized IC supplier Mixed Signal Integration has a nifty CMOS chip that can measure THD. The device is a single-chip 1/6th octave-wide five-harmonic distortion analyzer.
Samsung targeting mobile TV on notebooks Product News 12/14/2006 Post a comment Samsung Electro-Mechanics has developed a module that is set to bring
mobile digital TV (MDTV) to notebooks. Dubbed the SuwonExpress, the device was jointly developed with CyberLink Corp. (Taipei, Taiwan) and Siano Mobile Silicon (Yaqum, Israel).
GSMA calls for clarity on mobile comms IPR News & Analysis 12/14/2006 Post a comment The trade association representing the interests of mobile phone operators, GSM Association (GSMA), has urged industry to increase the transparency around intellectual property rights related to new technology standards.
NEC, Sony, Toshiba outline 45-nm process advance News & Analysis 12/14/2006 Post a comment The three Japanese companies that are working together to develop logic process technologies for the 45-nm generation NEC Electronics Corporation, Toshiba Corporation and Sony Corporation said they have moved closer to their target with the development of an LSI mass production platform.
ST, Ericsson team for 3G baseband processors News & Analysis 12/14/2006 Post a comment STMicroelectronics has been chosen by Ericsson Mobile Platforms as the preferred supplier of third-generation digital baseband processors to OEMs that are licensees of the Swedish group's 3G mobile-phone platform.
SMIC denies reports of fab delays News & Analysis 12/14/2006 Post a comment Despite local reports to the contrary, Semiconductor Manufacturing International Corp. said it is ahead of schedule with the ramp-up of its Chengdu plant and on schedule with a 300-mm wafer facility in Shanghai.
FRAM memory device achieves AEC-Q100 standard for automotive apps Product News 12/13/2006 Post a comment Ramtron International Corp.'s FM25C160, a 16Kb, 5V, SPI FRAM memory device has been qualified to AEC-Q100 (Automotive Electronic Council's Stress Test Qualification for Integrated Circuits) standards. The FM25C160 is the third FRAM device to be AEC-Q100-qualified as part of an aggressive automotive qualification program.
Pixelworks CEO steps down, remains chair News & Analysis 12/13/2006 Post a comment Allen Alley plans to resign as president and CEO of display IC vendor Pixelworks, effective Dec. 31, Pixelworks said. Alley, who founded Pixelworks, will continue to serve as the company's chairman.
ST reorganizes product groups News & Analysis 12/13/2006 Post a comment STMicroelectronics said it plans to reorganize its product segments into three separate groups and as one of its top executives left the company. Effective Jan. 1, ST will divide its product groups into an Application Specific group, a Flash Memories group and a Multi-segment group.
High-side current monitors feature 8-450 volt input range Product News 12/13/2006 Post a comment The HV7801 and HV7802 high-side current monitors from Supertex feature an ultrawide operating range, 8 to 450 volts, for motor controls, off-line sensors, instrumentation amplifiers, and current-sensing for high-voltage LED drivers, batteries, and switchmode supplies.
Antenova RF design group believed to have come from Xindium News & Analysis 12/13/2006 Post a comment Speculation is mounting that the RF designers that will form the core team of Antenova Ltd's planned research and development center in Chicago came from Xindium, an Indium Phosphide start-up that specializes in developing PA amplifiers for mobile devices but is now refocusing on other technologies.
China mobile TV spec similar to Europe's DVB-SH News & Analysis 12/13/2006 Post a comment The spec known as China Multimedia Mobile Broadcasting is a close cousin to Europe's digital video broadcast from satellite for handhelds, or DVB-SH. That could make it easier to deploy, but also raise sticky IP issues.
Consortium preps multicore CPU benchmarks News & Analysis 12/12/2006 Post a comment The Embedded Microprocessor Benchmark Consortium (EMBC) has started work on a standard suite of tests to measure performance of multicore processors and expects a benchmark suite could be available in six to eight months.
CMOS imager taps copper wires Product News 12/12/2006 Post a comment IBM Microelectronics researchers have developed a CMOS imager technology that uses copper wiring instead of the normal aluminum wiring, thereby improving pixel performance.
Dual-band chipset is 802.11n-draft compliant Product News 12/12/2006 Post a comment Here's a chipset that may ease designs of wireless digital entertainment systems. Re-introduced as second-generation silicon by Metalink, the WLANPlus chipset is billed by the company as the industry's first IEEE-802.11n-draft-compliant dual-band chip-set.
Company formed to commercialize nanomaterial production News & Analysis 12/12/2006 Post a comment Technology venture company IP Group has teamed up with scientists from the University of Surrey's Advanced Technology Institute (ATI) and CEVP Ltd, a leader in plasma tool manufacture, to form Surrey NanoSystems, which will develop and make tools for producing nanomaterials.
ISM-band radio-on-a-chip includes flash microcontroller Product News 12/12/2006 Post a comment Building a remote control, wireless mouse, or home automation product? If so, check out this new device from RFIC maker Cypress Semiconductor. It's debuting a next-generation radio-system-on-a-chip for ISM band applications. The device integrates the company's existing 2.4-GHz transceiver with its popular enCoRe II 8-bit Harvard architecture flash-equipped microcontroller.
Micron expands Bracknell imaging design center Product News 12/12/2006 Post a comment Micron Technology has started another recruitment drive for design engineers at its Bracknell, England design centre to focus on image sensor IP development that will be used throughout the company, and on system-on-chip product designs.
64-byte FIFO UARTs target battery-powered applications Product News 12/12/2006 Post a comment Check out Exar's latest pair of 64-byte FIFO UARTs, both of which feature a selectable I²C/SPI slave interface. While both parts are similar in nature, each has a unique feature. The XR20V2170 integrates an RS-232 transceiver, and the XR20M1170 is a low-voltage, 1.8-V device. The devices are suited for industrial, consumer and battery-powered applications.
NXP platform marries GPS, multimedia capabilities Product News 12/12/2006 Post a comment NXP Semiconductors introduced a new personal media player platform combining GPS navigation functionality with multimedia capabilities. The offering is based on NXP's Nexperia mobile multimedia processor PNX1090 and software from NXP and partner ALK Technologies.
FlexRay transceiver drives active safety in vehicles Product News 12/12/2006 Post a comment NXP, formerly Philips Semiconductors, is shipping what it claims is the industry's first FlexRay transceiver, the TJA1080. With the high-speed FlexRay network communications system, car makers can introduce advanced safety and comfort features.
What are the engineering and design challenges in creating successful IoT devices? These devices are usually small, resource-constrained electronics designed to sense, collect, send, and/or interpret data. Some of the devices need to be smart enough to act upon data in real time, 24/7. Are the design challenges the same as with embedded systems, but with a little developer- and IT-skills added in? What do engineers need to know? Rick Merritt talks with two experts about the tools and best options for designing IoT devices in 2016. Specifically the guests will discuss sensors, security, and lessons from IoT deployments.