Intel launches solid-state drive Product News 12/30/2010 26 comments Intel Corp. has introduced to the market a solid-state drive (SSD) that offers 40- and 80-Gbyte memory capacity in a format measuring 51-mm by 30-mm and only 5-mm deep. The unit weighs 10 grams.
Intel shrinks SSD drive Product News 12/30/2010 3 comments Intel Corporation has released the Intel® solid-state drive 310 Series, a solid-state drive (SSD) with Intel® X25-class SSD performance that measures 51mm-by-30mm and 5mm thick.
Cypress fleshes out 65nm SRAM family Product News 12/27/2010 1 comment Cypress Semiconductor reports that new devices deliver industry’s fastest QDR SRAM operating speed of 550 MHz while reducing power consumption by 50 percent.
Key innovators in 2010 News & Analysis 12/27/2010 6 comments Multicore development, the Droid phone and the acceleration of Tesla's electric car head our list of top innovations in 2010.
Many-core Plurality to benchmark on EEMBC News & Analysis 12/23/2010 2 comments The Embedded Microprocessor Benchmark Consortium (EEMBC) has announced that Plurality Ltd., a developer of many-core processors, has joined the consortium's Consumer Workgroup.
NXP sells off sound division for $855 million News & Analysis 12/22/2010 15 comments NXP Semiconductor NV, a chip company that has been undergoing a strategic overhaul and downsizing led by CEO Rick Clemmer, has agreed to sell its Sound Solutions business line to Dover Corp. for $855 million.
ARM share price soars on Windows reports News & Analysis 12/22/2010 20 comments ARM's share price jumped sharply on reports that Microsoft will use the Consumer Electronics Show in Las Vegas next month to demonstrate a version of its Windows operating system that will run on processors designed by the U.K. firm.
13 'fabless' chip firms to top $1B in sales News & Analysis 12/22/2010 5 comments IC Insights said that a record 13 fabless chip companies will top $1 billion in sales this year, though the firm defines the term to include one company that maintains its own fabs but gets most of its wafers from foundries.
TSMC to raise R&D spend in 2011, says report News & Analysis 12/21/2010 Post a comment Foundry Taiwan Semiconductor Manufacturing Co. Ltd. plans to raise its R&D spending by nearly 39 percent to NT$50 billion (about $1.68 billion) in 2011, according to a Taipei Times report that quoted chairman and CEO Morris Chang.
NFC poised to take off, iSuppli says News & Analysis 12/20/2010 5 comments Boosted by support from Nokia and Google, use of near field communication in handsets is poised to begin an explosive growth phase next year, according to market research firm iSuppli.
Hynix CEO warns of weak pricing: report News & Analysis 12/20/2010 Post a comment The CEO of Hynix Semiconductor Inc. has warned that memory chip prices are likely to continue to fall in the first quarter of 2011 and will impact his company's fourth quarter sales and profits, according to a Wall Street Journal report.
Semitech Semiconductor SM2101 Product News 12/18/2010 2 comments Semitech Semiconductor unveiled its SM2101, an FSK/BPSK-based power line transceiver for Advance Metering Infrastructure (AMI) and Automated Meter Reading (AMR) applications.
MStar raises $280 million in Taiwan IPO News & Analysis 12/17/2010 7 comments TV chip supplier MStar Semiconductor Inc. has raised NT$8.4 billion (about $280 million) in the biggest initial public offering of stock traded on the Taiwan Stock Exchange in 2010, according to reports.
IMFT Singapore NAND fab set to start 2Q11 News & Analysis 12/17/2010 9 comments IM Flash Technologies LLC, a joint venture between Intel Corp. and Micron Technologies Inc. that makes NAND flash memoy, is preparing its delayed wafer fab in Singapore and expects to commence commercial production in the second quarter of 2011, according to online reports.
SEMI book-to-bill dipped again in November News & Analysis 12/16/2010 2 comments North America-based manufacturers of semiconductor equipment posted $1.51 billion in orders in November and a book-to-bill ratio of 0.96, down from 0.98 in October, according to the SEMI trade group.
NIST launches $44M technology program News & Analysis 12/16/2010 7 comments A new technology innovation program for advanced manufacturing research in electronics, biotechnology and nanotechnology was funded with $22 million by the National Institute of Standards and Technology, which expects matching funds from research partners to exceed $44 million total.
Report: Fairchild Semi to cut jobs News & Analysis 12/15/2010 16 comments A spokesperson for Fairchild Semiconductor confirmed that the company plans to lay off an undisclosed number of employees at the its fab in South Portland, Maine.
November chip sales fell, says analyst News & Analysis 12/15/2010 2 comments The three-month average of global chip sales for November is set to be $25.7 billion, a 2.4 percent drop compared with $26.32 billion in October, according to Bruce Diesen, an analyst at Carnegie Group (Oslo, Norway).
Penn predicts 6% chip market growth in 2011 News & Analysis 12/15/2010 8 comments Malcolm Penn, founder and principal analyst with consultancy Future Horizons (Sevenoaks, England), sees a return to a "normal" 6 percent growth pattern for the semiconductor market in 2011.
Welcome to the 'fab-tight' era, says Penn News & Analysis 12/15/2010 20 comments Semiconductor manufacturers are no longer building wafer fabs in anticipation of demand, according to Malcolm Penn, principal analyst with Future Horizons. "Forget fab-lite, welcome to the fab-tight era," Penn said speaking at a one-day presentation on his forecast for 2011.
10 technologies to watch in 2011 News & Analysis 12/15/2010 57 comments Here are 10 technologies that we think will generate buzz, attract developers and investors, and get end users to open their wallets in 2011 and beyond.
FormFactor shakes up board News & Analysis 12/15/2010 3 comments FormFactor announced the resignations of three independent members of its board of directors and said that Carl Everett—who served as interim CEO of the company from May until September—had stepped down from his executive role in the company's operations.
What are the engineering and design challenges in creating successful IoT devices? These devices are usually small, resource-constrained electronics designed to sense, collect, send, and/or interpret data. Some of the devices need to be smart enough to act upon data in real time, 24/7. Specifically the guests will discuss sensors, security, and lessons from IoT deployments.